Patents by Inventor Keiichiro Oishi

Keiichiro Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190256960
    Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 15, 2017
    Publication date: August 22, 2019
    Applicant: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20190249276
    Abstract: This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 15, 2017
    Publication date: August 15, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20190245212
    Abstract: An oxygen evolution catalyst includes a core and a shell covering the surface of the core. The core includes ruthenium oxide or metal ruthenium in at least a surface portion. The shell includes titania or a composite oxide of titanium and ruthenium. Such an oxygen evolution catalyst is obtained by (a) dispersing core particles each including ruthenium oxide or metal ruthenium in at least a surface portion in a solvent to obtain a dispersion, (b) adding a Ti source to the dispersion to produce precursor particles in which the surface of each core particle is covered with a titania precursor, and (c) collecting the precursor particles from the dispersion and heat-treating the precursor particles after drying.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 8, 2019
    Applicants: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shuhei YOSHINO, Kensaku KODAMA, Yoshio SAGESHIMA, Keiichiro OISHI, Yoriko HASEGAWA, Noriyuki KITAO
  • Publication number: 20190241999
    Abstract: This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, , 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 8, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20190169711
    Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: June 6, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 10311991
    Abstract: A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0?([Co]?0.007)/([P]?0.009)?5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: June 4, 2019
    Assignee: MITSUBISHI SHINDOH CO., LTD.
    Inventor: Keiichiro Oishi
  • Publication number: 20190144974
    Abstract: A copper alloy has a composition including 0.05 mass % or more and 0.70 mass % or less of Co; 0.02 mass % or more and 0.20 mass % or less of P; 0.005 mass % or more and 0.70 mass % or less of Sn, one or more of B, Cr, and Zr; and furthermore, a Cu balance containing inevitable impurities, wherein X, Y, and Z satisfy the following Expression (1): 1?(X/5)+(Y/50)+(Z/100) and Expression (2): X+Y+Z?1,000, in case where an amount of B is represented by X (massppm), an amount of Cr is represented by Y (massppm), and an amount of Zr is represented by Z (massppm).
    Type: Application
    Filed: June 23, 2017
    Publication date: May 16, 2019
    Inventors: Yuusuke Enami, Toshio Sakamoto, Hitoshi Nakamoto, Keiichiro Oishi, Atsushi Sugahara, Chikara Yamashita, Takuya Ohara
  • Patent number: 10266917
    Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: April 23, 2019
    Assignee: MITSUBISHI SHINDOH CO., LTD.
    Inventor: Keiichiro Oishi
  • Publication number: 20190040498
    Abstract: A copper-based alloy casting includes 69 to 88% of Cu, 2 to 5% of Si, 0.0005 to 0.04% of Zr, 0.01 to 0.25% of P by mass, and a remainder including Zn and inevitable impurities, and satisfies 60?Cu?3.5×Si?3×P?71. Further, mean grain size after melt-solidification is 100 ?m or less, and ?, ? and ?-phases occupy more than 80% of phase structure. Furthermore, the copper-based alloy casting according to the invention can further include at least one element selected from a group consisting of 0.001 to 0.2% of Mg, 0.003 to 0.1% of B, 0.0002 to 0.01% of C, 0.001 to 0.2% of Ti and 0.01 to 0.3% of rare earth element.
    Type: Application
    Filed: July 12, 2018
    Publication date: February 7, 2019
    Inventor: Keiichiro Oishi
  • Patent number: 10163539
    Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: December 25, 2018
    Assignees: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kazumasa Hori
  • Patent number: 10155289
    Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: December 18, 2018
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 10020088
    Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: July 10, 2018
    Assignees: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Takashi Hokazono, Michio Takasaki, Yosuke Nakasato
  • Patent number: 10017841
    Abstract: Copper alloy casting contains Cu: 58-72.5 mass %; Zr: 0.0008-0.045 mass %; P: 0.01-0.25 mass %; one or more elements selected from Pb: 0.01-4 mass %, Bi: 0.01-3 mass %, Se: 0.03-1 mass %, and Te: 0.05-1.2 mass %; and Zn: a remainder, wherein [Cu]?3[P]+0.5([Pb]+[Bi]+[Se]+[Te])=60-90, [P]/[Zr]=0.5-120, and 0.05[?]+([Pb]+[Bi]+[Se]+[Te])=0.45-4 (the content of an element ‘a’ is denoted as [a] mass %; the content of ? phase is denoted as [?]% by area ratio; and an element ‘a’ that is not contained is denoted as [a]=0). The total content of ? phase and ? phase is 85% or more, ? phase content is 25% or less by area ratio, and mean grain size in the macrostructure during melt-solidification is 250 ?m or less.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: July 10, 2018
    Assignee: MITSUBISHI SHINDOH CO., LTD.
    Inventor: Keiichiro Oishi
  • Publication number: 20180155807
    Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.20?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.
    Type: Application
    Filed: November 7, 2017
    Publication date: June 7, 2018
    Inventors: Keiichiro Oishi, Yosuke Nakasato, Katsuhiko Hata, Shinji Tanaka
  • Patent number: 9970081
    Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: May 15, 2018
    Assignee: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Keiichiro Oishi, Yosuke Nakasato, Takashi Hokazono
  • Patent number: 9957589
    Abstract: The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: May 1, 2018
    Assignees: Mitsubishi Shindoh Co., Ltd., MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Takashi Hokazono, Michio Takasaki, Yosuke Nakasato
  • Patent number: 9873927
    Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 23, 2018
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Yosuke Nakasato, Katsuhiko Hata, Shinji Tanaka
  • Publication number: 20170103825
    Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.
    Type: Application
    Filed: October 19, 2016
    Publication date: April 13, 2017
    Inventors: Keiichiro Oishi, Kazumasa Hori
  • Patent number: 9512507
    Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: December 6, 2016
    Assignees: MITSUBISHI MATERIALS CORPORATION, MITSUBISHI SHINDOH CO., LTD.
    Inventors: Shinji Tanaka, Keiichiro Oishi, Hiroharu Ogawa
  • Patent number: 9512506
    Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: December 6, 2016
    Assignees: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kazumasa Hori