Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.

Abstract: A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0?([Co]?0.007)/([P]?0.009)?5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized.

Abstract: A copper alloy has a composition including 0.05 mass % or more and 0.70 mass % or less of Co; 0.02 mass % or more and 0.20 mass % or less of P; 0.005 mass % or more and 0.70 mass % or less of Sn, one or more of B, Cr, and Zr; and furthermore, a Cu balance containing inevitable impurities, wherein X, Y, and Z satisfy the following Expression (1): 1?(X/5)+(Y/50)+(Z/100) and Expression (2): X+Y+Z?1,000, in case where an amount of B is represented by X (massppm), an amount of Cr is represented by Y (massppm), and an amount of Zr is represented by Z (massppm).

Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.

Abstract: A copper-based alloy casting includes 69 to 88% of Cu, 2 to 5% of Si, 0.0005 to 0.04% of Zr, 0.01 to 0.25% of P by mass, and a remainder including Zn and inevitable impurities, and satisfies 60?Cu?3.5×Si?3×P?71. Further, mean grain size after melt-solidification is 100 ?m or less, and ?, ? and ?-phases occupy more than 80% of phase structure. Furthermore, the copper-based alloy casting according to the invention can further include at least one element selected from a group consisting of 0.001 to 0.2% of Mg, 0.003 to 0.1% of B, 0.0002 to 0.01% of C, 0.001 to 0.2% of Ti and 0.01 to 0.3% of rare earth element.

Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Abstract: Copper alloy casting contains Cu: 58-72.5 mass %; Zr: 0.0008-0.045 mass %; P: 0.01-0.25 mass %; one or more elements selected from Pb: 0.01-4 mass %, Bi: 0.01-3 mass %, Se: 0.03-1 mass %, and Te: 0.05-1.2 mass %; and Zn: a remainder, wherein [Cu]?3[P]+0.5([Pb]+[Bi]+[Se]+[Te])=60-90, [P]/[Zr]=0.5-120, and 0.05[?]+([Pb]+[Bi]+[Se]+[Te])=0.45-4 (the content of an element ‘a’ is denoted as [a] mass %; the content of ? phase is denoted as [?]% by area ratio; and an element ‘a’ that is not contained is denoted as [a]=0). The total content of ? phase and ? phase is 85% or more, ? phase content is 25% or less by area ratio, and mean grain size in the macrostructure during melt-solidification is 250 ?m or less.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.20?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.

Abstract: In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0?([Co]?0.007)/([P]?0.009)?5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 ?m, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 ?m. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]<400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.