Patents by Inventor Keiji Matsumoto

Keiji Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180105981
    Abstract: [Object] A manipulation rope having an excellent torque transmittability is provided. [Solution] A manipulation rope 2 is a rope 2 that is advantageously used as a manipulation rope for a medical instrument, and includes a side wire 6 or a side strand which is an outermost layer, the side wire 6 or the side strand having a forming rate that is greater than 100% and not greater than 110%. The side wire or the side strand having been formed has a spiral shape in which a flatness that is an aspect ratio obtained by a major axis being divided by a minor axis is preferably not less than 1.01 and preferably not greater than 1.10. Further, an elongation of the rope at a time when a tensile load that is 1.0% of a breaking load is applied, is preferably not less than 0.04% and preferably not greater than 0.10%.
    Type: Application
    Filed: April 22, 2016
    Publication date: April 19, 2018
    Inventor: Keiji MATSUMOTO
  • Patent number: 9944087
    Abstract: A liquid ejecting apparatus includes a pressure-regulating mechanism which is provided in a liquid supply path in which it is possible to supply liquid to a liquid ejecting unit, and includes a liquid accommodation part which can accommodate the liquid internally, and in which a volume of the liquid accommodation part is changed depending on displacing of a diaphragm section, in which the diaphragm section includes an annular corrugated portion formed in a sectional waveform shape which is deformed when the diaphragm section receives pressure.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: April 17, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Masahiko Sato, Keiji Matsumoto, Hitotoshi Kimura
  • Patent number: 9941230
    Abstract: The present invention provides an electrical connecting structure between a substrate 21 and a semiconductor chip 22. The electrical connecting structure comprises a metal bump 26 formed on a contact pad 28 of a semiconductor chip 22 and a coating layer 25 formed on the metal bump 26 of the semiconductor chip 22. The coating layer includes material not wettable with solder. The electrical connecting structure further comprises a metal pad 24 formed on the substrate 21. The electrical connecting structure further comprises a solder 29 connecting to a side surface of the metal bump 26 and an outer surface of the metal pad 24. The outer surface is not covered by the coating layer 25.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: April 10, 2018
    Assignee: International Business Machines Corporation
    Inventors: Keiji Matsumoto, Keishi Okamoto, Yasumitsu K. Orii, Kazushige Toriyama
  • Patent number: 9919526
    Abstract: A method for manufacturing a liquid discharge head includes a transferring step of transferring a dry film supported by a supporting member to a substrate having a hole, and a peeling step of peeling the supporting member off the dry film on the substrate. In the peeling step, the dry film is in contact with a wall surface defining the hole in the substrate.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: March 20, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Asai, Kenji Fujii, Keiji Matsumoto, Koji Sasaki, Kunihito Uohashi, Jun Yamamuro, Seiichiro Yaginuma, Masahisa Watanabe, Ryotaro Murakami
  • Publication number: 20180076162
    Abstract: Highly reliable chip mounting is accomplished by using a substrate having such a shape that a stress exerted on a flip-chip-connected chip can be reduced, so that the stress exerted on the chip is reduced and separation of an interlayer insulating layer having a low dielectric constant (low-k) is minimized. Specifically, in a chip mounting structure, a chip including an interlayer insulating layer having a low dielectric constant (low-k) is flip-chip connected to a substrate via bumps is shown. In the chip mounting structure, the substrate has such a shape that a mechanical stress exerted on the interlayer insulating layer at corner portions of the chip due to a thermal stress is reduced, the thermal stress occurring due to a difference in coefficient of thermal expansion between the chip and the substrate.
    Type: Application
    Filed: November 6, 2017
    Publication date: March 15, 2018
    Inventors: Akihiro HORIBE, Keiji MATSUMOTO, Keishi OKAMOTO, Kazushige TORIYAMA
  • Publication number: 20180043689
    Abstract: A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.
    Type: Application
    Filed: August 4, 2017
    Publication date: February 15, 2018
    Inventors: Kunihito Uohashi, Shingo Nagata, Kenji Fujii, Jun Yamamuro, Koji Sasaki, Keiji Matsumoto, Seiichiro Yaginuma, Ryotaro Murakami, Tomohiko Nakano, Masataka Nagai
  • Patent number: 9889669
    Abstract: A liquid ejecting apparatus includes a liquid ejecting head which ejects liquid from a nozzle that is disposed on a nozzle surface, a first wiping portion which is able to wipe away the liquid that is adhered to the nozzle surface, and a second wiping portion which is able to hold the liquid that is adhered to the nozzle surface by contacting the nozzle surface, wherein it is possible to perform a first maintenance operation in which the nozzle surface is wiped using the first wiping portion and a second maintenance operation in which the second wiping portion is caused to contact the nozzle surface due to the second wiping portion being biased by the first wiping portion.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: February 13, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Shigenori Nakagawa, Keiji Matsumoto
  • Patent number: 9893031
    Abstract: Highly reliable chip mounting is accomplished by using a substrate having such a shape that a stress exerted on a flip-chip-connected chip can be reduced, so that the stress exerted on the chip is reduced and separation of an interlayer insulating layer having a low dielectric constant (low-k) is minimized. Specifically, in a chip mounting structure, a chip including an interlayer insulating layer having a low dielectric constant (low-k) is flip-chip connected to a substrate via bumps is shown. In the chip mounting structure, the substrate has such a shape that a mechanical stress exerted on the interlayer insulating layer at corner portions of the chip due to a thermal stress is reduced, the thermal stress occurring due to a difference in coefficient of thermal expansion between the chip and the substrate.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: February 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Akihiro Horibe, Keiji Matsumoto, Keishi Okamoto, Kazushige Toriyama
  • Patent number: 9873255
    Abstract: A liquid ejection head includes a substrate having an energy generating element arranged therein and an ejection port forming member laid as superposed above the substrate. At least one ejection port is formed so as to run through the ejection port forming member. The ejection port forming member has a concave portion including the ejection port formed therein on the surface thereof opposite to the surface thereof facing the substrate, and has a convex portion on the surface of the ejection port forming member facing the substrate so as to correspond to the concave portion.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 23, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Sasaki, Kenji Fujii, Jun Yamamuro, Kazuhiro Asai, Seiichiro Yaginuma, Keiji Matsumoto, Kunihito Uohashi, Masahisa Watanabe, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada
  • Publication number: 20170358373
    Abstract: According to an embodiment, a core catcher has: a main body including: a distributor arranged on a part of a base mat in the lower dry well, a basin arranged on the distributor, cooling channels arranged on a lower surface of the basin connected to the distributor and extending in radial directions, and a riser connected to the cooling channels and extending upward; a lid connected to an upper end of the riser and covering the main body; a cooling water injection pipe open, at one end, to the suppression pool, connected at another end to the distributor; and chimney pipes connected, at one end, to the riser, another end being located above the upper end of the riser and submerged and open in the pool water.
    Type: Application
    Filed: June 7, 2017
    Publication date: December 14, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takashi SATO, Keiji MATSUMOTO, Masato YAMADA
  • Publication number: 20170336498
    Abstract: An arithmetic processor is provided to detect a background even when observed data values vary. The processor includes a background candidate data memory 20 storing data as a background candidate. In the data, an observation count, as the number of times of obtaining the same observation data, is correlated with distance data representing the observed data. The processor also includes a ranking section 11 ranking background candidates using the observation count as a basis; an observation count update section 12 comparing observed data with a background candidate stored in the memory 20 to find a match, counting observations of the background candidate if there is a match, and replacing distance data of a lowest-ranked background candidate with the observed data if there is no match; and a background determination section 13 determining there are two backgrounds if the top two background candidates remain unchanged for a predetermined period.
    Type: Application
    Filed: May 17, 2017
    Publication date: November 23, 2017
    Applicant: DENSO WAVE INCORPORATED
    Inventors: Kunihiko ITO, Gaku TAKANO, Wataru KOBORI, Tetsuya IWASAKI, Keiji MATSUMOTO
  • Patent number: 9809027
    Abstract: A method of manufacturing a structure includes (1) positioning a first resin layer provided on a first supporting member on a substrate having a through hole, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and (2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer. A first resin layer portion that is above the through hole is removed before or simultaneously with the releasing of the first supporting member.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: November 7, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiji Matsumoto, Jun Yamamuro, Kazuhiro Asai, Kunihito Uohashi, Seiichiro Yaginuma, Masahisa Watanabe, Koji Sasaki, Ryotaro Murakami, Kenji Fujii
  • Publication number: 20170297336
    Abstract: A method for manufacturing a liquid ejection head including the steps of preparing a substrate including, on a surface of the substrate, a layer having a plurality of openings in which opening portions of supply portions are located and which are arrayed in an array direction and another opening which is different from the plurality of openings and is located beyond the array end portion in the array direction, and attaching a dry film for forming flow passages to the substrate and the layer.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 19, 2017
    Inventors: Jun Yamamuro, Kenji Fujii, Kazuhiro Asai, Keiji Matsumoto, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma, Masahisa Watanabe, Ryotaro Murakami, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada
  • Patent number: 9789690
    Abstract: A method for manufacturing a liquid ejection head includes the steps of: preparing a substrate including an energy-generating element disposed on a first surface of the substrate and a supply path for liquid; disposing a dry film on the first surface of the substrate in such a manner that the dry film partially enters the supply path; etching the dry film from a side of the dry film facing the first surface of the substrate so that the dry film has an etched surface substantially in parallel with the first surface and covers the supply path; forming a resin layer to be a flow path member on the dry film covering the supply path; and removing the dry film covering the supply path.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: October 17, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masahisa Watanabe, Jun Yamamuro, Kazuhiro Asai, Keiji Matsumoto, Koji Sasaki, Kunihito Uohashi, Ryotaro Murakami, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada, Kenji Fujii, Seiichiro Yaginuma
  • Publication number: 20170248946
    Abstract: A remote control apparatus capable of communicating with a control apparatus of an autonomously running work vehicle via a communication apparatus, the remote control apparatus comprising a communication apparatus, a control apparatus, a display apparatus, and cameras for obtaining images of the front and rear, wherein the display apparatus is provided with at least a remote control region for controlling the autonomously running work vehicle, a peripheral image region for displaying images captured by the cameras, and a work status display region, wherein the peripheral image region is provided with a frontal view and a rear view.
    Type: Application
    Filed: July 2, 2015
    Publication date: August 31, 2017
    Applicant: YANMAR CO., LTD.
    Inventors: Kouhei OGURA, Wataru NAKAGAWA, Keiji MATSUMOTO, Akifumi KURODA
  • Publication number: 20170232745
    Abstract: A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening.
    Type: Application
    Filed: May 3, 2017
    Publication date: August 17, 2017
    Inventors: Seiichiro Yaginuma, Keiji Matsumoto, Koji Sasaki
  • Patent number: 9728433
    Abstract: An attitude changing apparatus which can change an attitude of a component with certainty without damaging the component. The component has a rectangular parallelepiped shape where a pair of rectangular end surfaces opposite to each other are connected to each other by four side surfaces. The component is stored in a cavity which penetrates between main surfaces of a conveyance member, the conveyance member is moved relative to a base, and the component is made to pass through an engaging groove formed on a reference surface of the base.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: August 8, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masatoshi Harada, Atsushi Kudo, Keiji Matsumoto
  • Publication number: 20170203569
    Abstract: A liquid ejection head has an ejection port forming region which includes liquid ejection energy generating elements arranged on a substrate, liquid supply ports each running through the substrate and having an opening at a surface of the substrate, a liquid path formed on the surface as a space containing the liquid ejection energy generating elements and the liquid supply ports therein, and ejection ports corresponding to the respective liquid ejection energy generating elements. The liquid ejection head is manufactured by forming a liquid path forming layer on the substrate using a dry film resist, forming an ejection port forming layer on the liquid path forming layer, forming a liquid path in the liquid path forming layer and ejection ports in the ejection port forming layer. The substrate has dummy holes each having an opening at a surface of the substrate outside the ejection port forming region.
    Type: Application
    Filed: December 27, 2016
    Publication date: July 20, 2017
    Inventors: Keiji Matsumoto, Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma, Ryotaro Murakami, Masahisa Watanabe, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada, Kenji Fujii
  • Publication number: 20170198313
    Abstract: A PHA copolymer which is slowly crystallized is improved in crystallization speed to improve the melt workability of the PHA copolymer in working such as injection molding, film molding, blow molding, fiber spinning, extrusion foaming or bead foaming, thereby improving the resultant articles in productivity. A method for the improvement is a method for producing a PHA mixture, including the step of culturing a microorganism having both of a gene encoding a PHA synthase that synthesizes a copolymer PHA (A) and that is derived from the genus Aeromonas, and a gene encoding a PHA synthase that synthesizes a PHA (B) different in melting point from the copolymer PHA (A) by 10° C. or more to produce, in a cell of the microorganism, two or more PHAs different in melting point from one another by 10° C. or more simultaneously.
    Type: Application
    Filed: March 27, 2015
    Publication date: July 13, 2017
    Applicant: KANEKA CORPORATION
    Inventors: Shingo KOBAYASHI, Rina AOKI, Tetsuya MINAMI, Hisashi ARIKAWA, Keiji MATSUMOTO
  • Patent number: 9697914
    Abstract: According to an embodiment, a nuclear power plant has a core; a reactor pressure vessel; a dry well; a wet well; a vacuum breaker; a containment vessel including the dry well, the LOCA vent pipe, the wet well, and the vacuum breaker; a cooling water pool placed outside the containment vessel; a heat exchanger at least partially submerged in cooling water; a gas supply pipe connected to the inlet plenum of the heat exchanger and the dry well; a condensate return pipe connected to the outlet plenum of the heat exchanger and the containment vessel; and a gas vent pipe connected to the outlet plenum of the heat exchanger and an outside of the wet well so that non-condensable gas inside the heat exchanger is released out of the wet well. The gas vent pipe is not connected to the wet well.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: July 4, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Sato, Keiji Matsumoto