Patents by Inventor Keishin Yamazaki

Keishin Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090111285
    Abstract: [Problem] To provide a substrate treatment apparatus capable of performing temperature control in a reaction tube with accuracy. [Means for Resolution] A substrate treatment apparatus 100 includes: a reaction tube 42 for treating a substrate 54; a heater 46 for heating the substrate 54 in the reaction tube 42; a cooling air channel 72 for circulating cooling air 70 outside the reaction tube 42; and a thermocouple 82 for detecting temperature around the reaction tube 42. The thermocouple 82 is disposed in the cooling air channel 72 for circulating cooling air 70 in a state where the thermocouple 82 is covered with a protection tube 86, and a cover 88 for intercepting flow toward the protection tube 86 of the cooling air 70 is disposed outside the protection tube 86.
    Type: Application
    Filed: August 4, 2006
    Publication date: April 30, 2009
    Applicant: Hitachi Kokusai Electric Inc.
    Inventors: Keishin Yamazaki, Iwao Nakamura, Ryota Sasajima
  • Publication number: 20090016854
    Abstract: A heat-treating apparatus capable of realizing a highly precise processing maintaining a high degree of safety, and a method of producing substrates are provided. The heat-treating apparatus comprises a reaction tube for treating substrates; a manifold for supporting the reaction tube; and a heater provided surrounding the reaction tube to heat the interior of reaction tube; wherein the reaction tube and the manifold are in contact with each other as their continuous flat surfaces come in contact with each other; a cover member is provided to cover the contact portion between the reaction tube and the manifold from the outer side; and the cover member is provided with at least either a gas feed port or an exhaust port communicated with a space formed among the cover member, the reaction tube and the manifold.
    Type: Application
    Filed: March 27, 2006
    Publication date: January 15, 2009
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akira Morohashi, Iwao Nakamura, Ryota Sasajima, Keishin Yamazaki, Sadao Nakashima
  • Publication number: 20080190910
    Abstract: A heat treatment apparatus wherein a nozzle is accurately provided on an adaptor to prevent the nozzle from interfering with other part items and a possibility of breakage due to heat expansion of the nozzle can be reduced. The heat treatment apparatus (10) is provided with a reaction tube (42) for treating a substrate (54), a quartz adaptor (44) for supporting the reaction tube (42), a nozzle (66) connected to the adaptor (44) for supplying a treatment gas into the reaction tube (42), and a heater (46) provided outside the reaction tube (42) for heating inside the reaction tube (42). The nozzle (66) is connected to an upper plane of the adaptor (44) in the reaction lube (42) at least a part which is of the nozzle (66) and is connected with the adaptor (44) is made of quartz and other nozzle parts are made of silicon carbide.
    Type: Application
    Filed: September 15, 2005
    Publication date: August 14, 2008
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tomoharu Shimada, Akira Morohashi, Kojiro Yokozawa, Keishin Yamazaki
  • Publication number: 20070275570
    Abstract: A heat treatment device where intervals between substrates supported by a supporter is reduced so that the number of substrates to be treated can be increased. A heat treatment device has a reaction furnace for treating substrates and a supporter for supporting the substrates in plural stages in the reaction furnace. The supporter has supporting plates in contact with the substrates and supporting members for supporting the supporting plates. A supporting plate and a supporting member are superposed on each other at least a part in the thickness direction.
    Type: Application
    Filed: January 20, 2005
    Publication date: November 29, 2007
    Applicant: Hitachi Kokusai Electric Inc.
    Inventors: Naoto Nakamura, Iwao Nakamura, Tomoharu Shimada, Akira Morohashi, Keishin Yamazaki, Sadao Nakashima