Abstract: A semiconductor device has a transmission control circuit comprising a signal transmission circuit, an output control circuit, a replica circuit and a detection circuit. The single transmission circuit receives a predetermined signal in synchronization with a first control signal, and transmits and outputs the signal through a signal bus in synchronization with a second control signal. The output control circuit supplies the second control signal and controls an output timing thereof. The replica circuit transmits and outputs a replica signal (having level shifted in response to the input timing of the predetermined signal) through a replica signal bus having the same transmission characteristics as the signal bus. The detection circuit detects shifting of the replica signal and supplies a feedback signal to the output control circuit whose output timing is controlled in accordance with the shifting timing of the replica signal based on the feedback signal.

Abstract: A semiconductor device has a transmission control circuit comprising a signal transmission circuit, an output control circuit, a replica circuit and a detection circuit. The single transmission circuit receives a predetermined signal in synchronization with a first control signal, and transmits and outputs the signal through a signal bus in synchronization with a second control signal. The output control circuit supplies the second control signal and controls an output timing thereof. The replica circuit transmits and outputs a replica signal (having level shifted in response to the input timing of the predetermined signal) through a replica signal bus having the same transmission characteristics as the signal bus. The detection circuit detects shifting of the replica signal and supplies a feedback signal to the output control circuit whose output timing is controlled in accordance with the shifting timing of the replica signal based on the feedback signal.

Abstract: An electronic component monitoring device and method for correctly recognizing electronic components with bumps. A reflection-recognizing light emitter for emitting light toward an array of bumps on an electronic component, a transmission-recognizing light emitter for emitting light toward a background board, and a bump-recognizing light emitter for emitting light at an acute angle toward the array face of the electronic component are provided, and switchable light emitter(s) is/are switched on and off in accordance with a bump recognition method, transmission recognition method, and reflection recognition method.

Abstract: The present invention consists in that printed patterns on a printed circuit board and component information near the printed patterns are photographed, that the type of an electronic component to be mounted and the mounting position and mounting attitude of the electronic component are recognized from the photographed image, and that the predetermined electronic component is mounted on the predetermined position of the printed circuit board at the predetermined attitude on the basis of the above information items. Further, a program for the mounting order of all the electronic components to be mounted on the printed circuit board is generated on the basis of the image processing information items.

Abstract: An electric parts mounting apparatus is provided with a head rotation drive mechanism which is magnetically or fluidly connected to a vacuum head in a non-contact state. The vacuum heads are rotated by the head rotation drive mechanism, and the electric parts taken up by the vacuum heads are angularly positioned, and then mounted on the circuit board.

Abstract: In an electronic chip supplying apparatus, a vacuum suction device for sucking a retainer tape which encases electronic chips is provided in a retainer tape support member provided at an opening position where the electronic chips are picked up from a chip pickup device, or a tension applying device for the retainer is provided. Thus, vertical fluctuation of the retainer tape is prevented at the opening position.

Abstract: In an apparatus for mounting electronic parts onto a printed board, each of suction heads mounted on a peripheral portion of an intermittently rotatable index table attracts by suction a corresponding one of the electronic parts at a part attracting position. With rotation of the index table, the suction head holding the attracted electronic part is transferred to a part mounting position, where the electronic part is mounted onto the printed board. At least two positioners are arranged along the path of the transferred suction head for adjusting the part attracted on the suction head to its correct position and direction. The positioners are arranged respectively on both sides divided by a line extending from the attracting position to the mounting position. The positioners adjust respective kinds of electronic parts which are different from each other in configuration and size.