Abstract: Provided is an imaging device that makes it possible to suppress a decrease in image quality. The imaging device includes: a first semiconductor substrate including a light input surface and a photoelectric conversion section; a second semiconductor substrate on an opposite side of the first semiconductor substrate to the light input surface; an insulating film on side of the first semiconductor substrate on which the light input surface is disposed; a cut portion, a hole portion, or both that extend at least in a thickness direction of the insulating film; an implanted film in a portion or all in a depth direction of the cut portion, the hole portion, or both; a protective member opposed to the first semiconductor substrate with the insulating film in between; and a bonding member including a different material from a material of the implanted film between the protective member and the insulating film.

Abstract: A solid-state imaging element according to an embodiment of the present disclosure includes: a photoelectric conversion layer; an insulation layer provided on one surface of the photoelectric conversion layer and having a first opening; and a pair of electrodes opposed to each other with the photoelectric conversion layer and the insulation layer interposed therebetween. Of the pair of electrodes, one electrode provided on a side on which the insulation layer is located includes a first electrode and a second electrode each of which is independent, and the first electrode is embedded in the first opening provided in the insulation layer to be electrically coupled to the photoelectric conversion layer.

Abstract: An endoscope includes a bending operation member provided at an operation portion and configured to bend a bending portion of an insertion portion, a plurality of bending operation wires configured to be pulled or relaxed by the bending operation member, a plurality of tubular members provided inside the operation portion, into which the plurality of bending operation wires are inserted respectively, and disposed in a deflected state so as to avoid an internal component provided inside the operation portion, and a tubular member fixing member provided inside the operation portion and enabled to optimally adjust end portions of the plurality of tubular members at different positions along a longitudinal axis of the operation portion in a direction orthogonal to the longitudinal axis.

Abstract: A bending operation device includes a bending operation lever, a wire pulling member, bending operation wires, and tubular members. The bending operation lever is tiltably supported to have an angle with respect to a longitudinal direction of an operation unit of an endoscope. The wire pulling member includes arm portions displaced in conjunction with tilt motion of the bending operation lever. The bending operation wires are connected to the arm portions. The bending operation wires cause bending motion of a bendable part disposed in an insertion section of the endoscope. A respective one of bending operation wires is inserted in each of the tubular members. The tubular members (i) change extension directions of the plurality of bending operation wires and (ii) guide the plurality of bending operation wires to the plurality of arm portions.

Abstract: The present technology relates to a solid-state imaging device and an electronic apparatus which make it possible to improve pixel property. Provided is a solid-state imaging device, including a first electrode formed on a semiconductor layer, a photoelectric conversion layer formed on the first electrode, a second electrode formed on the photoelectric conversion layer, and a third electrode disposed between the first electrode and an adjacent first electrode, and electrically insulated. A voltage of the third electrode is controlled to a voltage corresponding to a detection result which contributes to control of discharge of charges or assist for transfer of charges. The present technology can be applied to, for example, a CMOS image sensor.

Abstract: A medical apparatus includes: an operation portion; an annular wall portion including a base portion connectedly provided to an exterior case and a protruding end portion; an operation lever configured to be tilted by an operator; a cover member including a first fitted portion fitted to the operation lever, a deforming portion configured to deform accompanying a tilt of the operation lever, and a second fitted portion with an inner circumferential surface fitted to an outer circumferential surface of the wall portion; and an elastic member including a contact portion in contact with an outer circumferential surface of the second fitted portion, the contact portion being fixed to the exterior case and being deformed to press the outer circumferential surface of the second fitted portion.

Abstract: Imaging devices and electronic apparatuses incorporating imaging devices are provided. An imaging device as disclosed can include a first pixel of a first pixel and a second pixel of a second pixel. The first and second pixels each have a first electrode, a portion of a photoelectric conversion film, and a portion of a second electrode, where the photoelectric conversion film is between the first electrode and the second electrode. The first electrode of the first pixel has a first area, while the first electrode of the second pixel has a second area that is smaller than the first area. The first pixel can include a light shielding film. Alternatively or in addition, the first pixel can be divided into first and second portions.

Abstract: An endoscope can include an internal member provided at a distal end of an insertion portion a conductive external member fitted over the internal member and electrically connected to a ground. The endoscope can also include an image pickup instrument fixed to the internal member, and the image pickup instrument can include a lens. The endoscope can include an electrical connection part having a first end portion connected to the conductive member and a second end portion connected to the external member, the electrical connection part being configured to electrically connect the conductive member and the external member, a conductor wire including a third end portion electrically connected to the first end portion, and a fourth end portion that passes through an opening formed in the external member.

Abstract: Solid-state imaging devices, methods to produce the solid-state imaging devices, and electronic apparatuses including the solid-state imaging devices, where the solid-state imaging devices include a semiconductor substrate including a light receiving surface; a plurality of photoelectric conversion parts provided within the semiconductor substrate; and a plurality of reflection portions provided in the semiconductor substrate on a side of the photoelectric conversion parts that is opposite from the light receiving surface; where each of the reflection portions includes a reflection plate and a plurality of metal wirings, and where the plurality of metal wirings are disposed in a same layer of the semiconductor substrate as the reflection plate.

Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.

Abstract: The present disclosure is to provide a solid-state imaging device capable of further increasing the degree of freedom in the design of rewiring lines connecting to joining portions that are contact points between a solid-state imaging device and a module substrate on which the solid-state imaging device is mounted.

Abstract: There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.

Abstract: An endoscope includes a frame component provided at a distal end portion of an insertion portion, an exterior member with conductivity in which the frame component fits, an imaging unit fixed to the frame component and configured to pick up an image, a conductive part provided in the imaging unit, an electrical connection part, a first end portion of which is connected to the conductive part, a neighboring part of a second end portion on an opposite side of the first end portion of which is sandwiched and fixed between an outer surface of the frame component and an inner surface of the exterior member and configured to electrically connect the conductive part and the exterior member, and an opening provided in the exterior member and configured to expose part of the frame component and cut an extra portion of the electrical connection part during assembly.

Abstract: An endoscope operation portion includes: an operation portion body provided being connected to a grasping portion; a joystick-type bending operation lever provided on a back side of the operation portion body, including a lever shaft body, and configured to perform a bending operation of a bending portion; and a suction button provided on a front side of the operation portion body so that an angle formed by an operation axis in a pressing-down operation direction relative to a central axis of the lever shaft body is an obtuse angle, and an intersection point between the central axis and the operation axis is positioned inside the operation portion body.

Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.

Abstract: The present disclosure relates to a solid-state image pickup device, a manufacturing method, and an electronic apparatus, which can obtain high charge transfer efficiency from a photoelectric conversion unit to a floating diffusion layer. The floating diffusion layer is arranged in a rectangular shape so as to surround a gate electrode of a vertical transistor whose groove portion is rectangular. A reset drain is formed so as to be adjacent to the floating diffusion layer through a reset gate. A potential of the floating diffusion layer is reset to the same potential as that of the reset drain by applying a predetermined voltage to the reset gate. It is possible to apply the present disclosure to, for example, a CMOS solid-state image pickup device used in an image pickup device such as a camera.

Abstract: There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.

Abstract: A bending operation device includes a bending operation member, a bendable part, an operation wire, a pulling wire, and a connection member. The bending operation member is disposed in an operation unit and is supported tiltably in a preset direction. The bendable part is disposed on a side of a distal end of the operation unit. The operation wire is connected at an end thereof to the bending operation member and is pulled or relaxed according to displacement of the bending operation member. The pulling wire is connected to the bendable part and bends the bendable part. The connection member is connected to the operation wire at a first position and is connected to the pulling wire at a second position. The second position is shifted from the first position by a preset angle in a turning direction about a longitudinal axis of the operation unit.

Abstract: A solid-state imaging element according to an embodiment of the present disclosure includes: a photoelectric conversion layer; an insulation layer provided on one surface of the photoelectric conversion layer and having a first opening; and a pair of electrodes opposed to each other with the photoelectric conversion layer and the insulation layer interposed therebetween. Of the pair of electrodes, one electrode provided on a side on which the insulation layer is located includes a first electrode and a second electrode each of which is independent, and the first electrode is embedded in the first opening provided in the insulation layer to be electrically coupled to the photoelectric conversion layer.

Abstract: An endoscope includes a bending operation apparatus including: a rod-like shaft section that is standing perpendicularly from one surface of an operation section and capable of being tilted; and a cover member including a central section that is placed to externally cover the rod-like shaft section in a water tight manner, a peripheral section that closes in a water tight manner an opening portion in which the rod-like shaft section is disposed, and an intermediate section provided between the peripheral section and the central section, wherein the cover member of the bending operation apparatus includes a deformation restricting section that is a tubular section formed along a longitudinal axis of the rod-like shaft section and placed to externally cover an intermediate portion of the rod-like shaft section, and restricts outward expansion of the intermediate section.