Abstract: A surveying system including a surveying device and a terminal device for assisting in placement of a staking tool. The surveying system further includes: a design information acquisition unit for acquiring design information including a designed slope; a surveying information acquisition unit for transmitting surveying information to a terminal device; a current state estimation unit for calculating an estimated altitude of a current ground in accordance with the surveying information; an intersection calculation unit for calculating a coordinate of an intersection between the current ground and the designed slope based on the estimated altitude of the current ground and the design information; a stake shape determination unit for determining a shape of a stake to be placed; and a stake shape information unit for causing the terminal device to inform of the shape of the stake determined by the stake shape determination unit.

Abstract: A connector includes a plurality of contacts made of metal material and arranged in an arrangement direction orthogonal to a fitting direction, an insulator made of insulating resin material and holding the plurality of contacts, and a reinforcement terminal made of metal material and attached to an end portion of the insulator in the arrangement direction, the insulator including a fitting portion extending along the arrangement direction and projecting in the fitting direction for fitting to a portion to be fitted of the counter connector, the reinforcement terminal including a terminal accommodating portion of recess shape for accommodating a reinforcement terminal of the counter connector, and a wall portion facing an end portion of the fitting portion in the arrangement direction across the terminal accommodating portion, the reinforcement terminal including a resin material flow passage penetrating the wall portion and reaching the end portion of the fitting portion.

Abstract: A connecting method includes: arranging the connection terminal such that a rear surface of a base portion in a flat plate shape of the connection terminal comes into contact with a front surface of the flexible substrate; with a rising portion of the connection terminal extending from the rear surface side of the base portion toward the base portion and a tip end bending portion of the connection terminal extending from a tip end of the rising portion in a direction inclined with respect to the rising portion, displacing the rising portion toward the base portion so that the tip end bending portion protrudes from a front surface of the base portion; and holding a part of the flexible substrate between a pressing portion formed at the rising portion and a pressed portion formed at the base portion, whereby the conductive portion of the flexible substrate is electrically connected to at least one of the pressing portion and the pressed portion.

Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.

Abstract: A connection terminal is placed with an opening end of a recessed portion of the connection terminal contacting a top of a flexible substrate, a linking conductive member is pushed from a bottom toward a top of the flexible substrate, whereby the linking conductive member projects inside the recessed portion through the opening end as catching a part of the flexible substrate, and the part of the flexible substrate is sandwiched between a pressing portion of the linking conductive member and a first inner portion in the recessed portion to allow the pressing portion to contact a conductive portion exposed on the bottom of the flexible substrate and allow a contact portion of the linking conductive member to contact a second inner portion in the recessed portion, whereby the connection terminal is electrically connected to the conductive portion of the flexible substrate via the linking conductive member.

Abstract: A solid-state imaging device includes blue photoelectric conversion elements, green photoelectric conversion elements, red photoelectric conversion elements, infrared photoelectric conversion elements, and an infrared cut filter (IRCF) is layered on the blue photoelectric conversion elements, the green photoelectric conversion elements, and the red photoelectric conversion elements with a uniform film thickness. Color filters that respectively transmit the blue light, the green light, and the red light are layered on the IRCF so as to correspond with the blue photoelectric conversion elements, the green photoelectric conversion elements, and the red photoelectric conversion elements. A visible-light shielding filter is layered on the infrared photoelectric conversion elements.

Abstract: A technique disclosed in this description relates to a semiconductor device and a method of manufacturing the semiconductor device, and is intended to provide a semiconductor device having high heat dissipation performance. The semiconductor device relating to the technique disclosed in this description includes a diamond substrate and a nitride semiconductor layer. The diamond substrate is made of diamond. The nitride semiconductor layer is formed in a recess formed at an upper surface of the diamond substrate.

Abstract: In a semiconductor device including a crystalline nitride layer, in which diamond is used for heat dissipation thereof, it is an object of the present invention to suppress cracking of the crystalline nitride layer. The semiconductor device includes a layered body and a heat dissipation layer. The layered body includes a crystalline nitride layer and a composite layer. The composite layer includes a non-inhibiting portion which does not inhibit diamond growth on a surface thereof and an inhibiting portion which inhibits the diamond growth on the surface. A layered body main surface of the layered body has a first region in which the non-inhibiting portion is exposed and a second region in which the inhibiting portion is exposed. The heat dissipation layer is made of diamond, opposed to the main surface, adhered to the first region, and separated from the second region with a void interposed therebetween.

Abstract: An operation assistance apparatus 10 includes: an image data acquisition unit 11 configured to acquire image data according to equipment; an inquiry receiving unit 12 configured to receive an inquiry about an operation of equipment; an equipment identifying unit 13 configured to identify equipment included in an image, based on the acquired image data; a matched information extraction unit 14 configured to extract information that matches the received inquiry from information according to the identified equipment; and an information display control unit 15 configured to display the extracted information on a screen.

Abstract: A connector assembly comprises a main connector, a first wiring sheet and a second wiring sheet. The main connector has a receiving portion. The first wiring sheet has a first positioned portion, a first deformable portion extending from the first positioned portion and a first contact provided on the first deformable portion. The second wiring sheet has a second positioned portion, a second deformable portion extending from the second positioned portion and a second contact provided on the second deformable portion. When the connector assembly is assembled, the first positioned portion and the second positioned portion are positioned by a positioning jig. Then, the first deformable portion and the second deformable portion are pressed downward to be pushed into the receiving portion so that the first contact and the second contact are located within the receiving portion to be in contact with each other.

Abstract: A three-dimensional survey apparatus includes a collimating ranging unit, a scanner unit, and a control calculation portion. The control calculation portion stores coordinates of a machine reference point of the collimating ranging unit and a direction of a reference collimation of a telescope portion, stores first point group data, stores a direction of a first collimation of the telescope portion oriented from the movement source position toward a movement destination position, stores a direction of a second collimation of the telescope portion oriented from the movement destination position toward the movement source position and a movement distance, calculates and stores coordinates of the machine reference point at the movement destination position with the survey start position as a reference based on the direction of the first collimation, the direction of the second collimation, and the movement distance, and stores second point group data.

Abstract: A three-dimensional survey apparatus includes a collimating ranging unit, a scanner unit, and a control calculation portion. The control calculation portion stores coordinates of a machine reference point of the collimating ranging unit and a direction of a reference collimation of a telescope portion, stores first point group data, stores a direction of a first collimation of the telescope portion oriented from the movement source position toward a movement destination position, stores a direction of a second collimation of the telescope portion oriented from the movement destination position toward the movement source position and a movement distance, calculates and stores coordinates of the machine reference point at the movement destination position with the survey start position as a reference based on the direction of the first collimation, the direction of the second collimation, and the movement distance, and stores second point group data.

Abstract: An active phased array antenna (APAA) device includes antenna elements, active circuits, switches, and a control circuit. The antenna elements transmit and receive radio waves. The active circuits are connected to the antenna elements and start an operation upon supply of power distributed from a power supply circuit and transmit and receive signals via the antenna elements to which the active circuits are connected. The switches are connected to the active circuits, and start, upon being closed, supply of power to the active circuits to which the switches are connected, and stop, upon being opened, the supply of power to the active circuits to which the switches are connected. The control circuit transmits to the switches switching signals to turn the switches on and off to control starting and stopping of the supply of power to the active circuits. The control circuit sets timing differences in execution timings of executing the start of the stop of supply of power to the active circuits.

Abstract: This particulate matter (PM) sensor is provided with a porous body that has a partition disposed in a passage for exhaust gas including particulate matter, at least a pair of electrodes that oppose each other in a prescribed direction so as to sandwich the porous body, and a deposition part that includes the surface of the partition on the upstream side of the passage, has the particulate matter deposited thereon, and has, formed therein, pores having an average pore diameter smaller than the average pore diameter of the portion of the partition other than the deposition part.

Abstract: A connector includes a pushing member having a projection, and a contact having a projection accommodating portion, the projection accommodating portion having a protruding portion that is situated in an inner surface of the projection accommodating portion with protruding from the inner surface of the projection accommodating portion toward an inside of the projection accommodating portion and approaches a lateral surface of the projection when the projection is inserted into the projection accommodating portion, and a gap forming portion that is situated in the inner surface of the projection accommodating portion around the protruding portion and forms a predetermined gap between the gap forming portion and the lateral surface of the projection when the projection is inserted into the projection accommodating portion, the predetermined gap being wider than a distance between the protruding portion and the lateral surface of the projection.

Abstract: A first connection portion is formed at an end portion of a flexible conductor by folding the end portion of the flexible conductor in halves along a folding line extending in a given direction, and a contact-side connection portion of a contact presses the first connection portion from opposite sides in a thickness direction of the first connection portion to thereby electrically connect the contact to the flexible conductor.

Abstract: A connection terminal is placed with an opening end of a recessed portion of the connection terminal contacting a top of a flexible substrate, a linking conductive member is pushed from a bottom toward a top of the flexible substrate, whereby the linking conductive member projects inside the recessed portion through the opening end as catching a part of the flexible substrate, and the part of the flexible substrate is sandwiched between a pressing portion of the linking conductive member and a first inner portion in the recessed portion to allow the pressing portion to contact a conductive portion exposed on the bottom of the flexible substrate and allow a contact portion of the linking conductive member to contact a second inner portion in the recessed portion, whereby the connection terminal is electrically connected to the conductive portion of the flexible substrate via the linking conductive member.

Abstract: A method for producing a hardened product of a hydraulic composition, includes mixing water, a hydraulic powder, a dispersant composition, and an aggregate to prepare a hydraulic composition, filling the hydraulic composition into a mold, and steam curing, in the mold, the hydraulic composition filled into the mold. The dispersant composition includes (A) a formaldehyde naphthaienesulfonate condensate or a salt thereof, (B) a compound having an alkylenoxy group, and optionally (C) a polycarboxylic acid-based copolymer, in particular proportions.

Abstract: A connecting method includes: arranging the connection terminal such that a rear surface of a base portion in a flat plate shape of the connection terminal comes into contact with a front surface of the flexible substrate; with a rising portion of the connection terminal extending from the rear surface side of the base portion toward the base portion and a tip end bending portion of the connection terminal extending from a tip end of the rising portion in a direction inclined with respect to the rising portion, displacing the rising portion toward the base portion so that the tip end bending portion protrudes from a front surface of the base portion; and holding a part of the flexible substrate between a pressing portion formed at the rising portion and a pressed portion formed at the base portion, whereby the conductive portion of the flexible substrate is electrically connected to at least one of the pressing portion and the pressed portion.

Abstract: A connector assembly comprises a main connector, a first wiring sheet and a second wiring sheet. The main connector has a receiving portion. The first wiring sheet has a first positioned portion, a first deformable portion extending from the first positioned portion and a first contact provided on the first deformable portion. The second wiring sheet has a second positioned portion, a second deformable portion extending from the second positioned portion and a second contact provided on the second deformable portion. When the connector assembly is assembled, the first positioned portion and the second positioned portion are positioned by a positioning jig. Then, the first deformable portion and the second deformable portion are pressed downward to be pushed into the receiving portion so that the first contact and the second contact are located within the receiving portion to be in contact with each other.