Abstract: A compound represented by the following formula (1): wherein, R1 is a linear or branched alkyl group having 1 to 3 carbon atoms or a hydroxyl group; and R2 is a 1-pyrrolyl group, a 2-pyrrolyl group, or a 3-pyrrolyl group. The present invention can provide a means highly effective in contributing to savory roasting flavor and capable of imparting fragrance with natural feeling.

Abstract: A compound represented by the following formula (1): wherein, R1 is a linear or branched alkyl group having 1 to 3 carbon atoms or a hydroxyl group; and R2 is a 1-pyrrolyl group, a 2-pyrrolyl group, or a 3-pyrrolyl group. The present invention can provide a means highly effective in contributing to savory roasting flavor and capable of imparting fragrance with natural feeling.

Abstract: It is an object of the present invention to provide a novel therapeutic agent for demyelinating disease which has an action to suppress demyelination of nerve axons. According to the present invention, a therapeutic agent for demyelinating disease which comprises cyclic phosphatidic acids, carba-cyclic phosphatidic acids, thia-cyclic phosphatidic acids, or a salt thereof is provided.

Abstract: It is an object of the present invention to provide a novel therapeutic agent for demyelinating disease which has an action to suppress demyelination of nerve axons. According to the present invention, a therapeutic agent for demyelinating disease which comprises cyclic phosphatidic acids, carba-cyclic phosphatidic acids, thia-cyclic phosphatidic acids, or a salt thereof is provided.

Abstract: A tool changing method for a machining center configured to machine a workpiece with a long tool by three-dimensionally moving the long tool and the workpiece relative to each other, the long tool being detachably provided to a spindle, the workpiece being placed on a table with a pallet therebetween, the tool changing method including: transporting a pallet on which the long tool is placed, in such a way as to arrange the pallet on table of the machining center by using an automated guided vehicle configured to transport the pallet; and then three-dimensionally moving the pallet and the spindle relative to each to thereby attach the long tool to the spindle.

Abstract: A machining center includes: a main spindle to which a tool is detachably attachable; a table on which to place a workplace; a tool magazine in which multiple pots for detachably holding tools are disposed; and a tool exchanger for exchanging the tools between the pots of the tool magazine and the main spindle. The machining center includes a long tool storing apparatus configured to store a long tool with a length longer than those of the tools stored in the tool magazine, and deliver the long tool to one of the pots of the tool magazine.

Abstract: A tool changing method for a machine tool configured to machine a workpiece with a long tool by three-dimensionally moving the long tool and the workpiece relative to each other, the long tool being detachably provided to a spindle, the workpiece being placed on a table, the tool changing method including: transporting the long tool in such a way as to place the long tool onto the table with a long-tool supporting base therebetween by using a gantry loader configured to transport the workpiece in such a way as to place the workpiece onto the table; and then three-dimensionally moving the table and the spindle relative to each other to thereby attach the long tool to the spindle.

Abstract: A magnetic field sensor includes: a magnetic thin film; a feeder comprising an input and output terminals configured to supply element current to the magnetic thin film; and a detector configured to detect a voltage between ends of the magnetic thin film in a direction perpendicular to a direction of the element current. The magnetic thin film is Rained symmetric about the direction of the element current.

Abstract: There is provided a monitor and control apparatus capable of enlarging a volume of a body, while ensuring a space for routing signal lines between a rear face of the body and a bottom surface of a mounting hole. The body 5 has a rear face including: a first face having terminal sections protruded; and a second face protruded backwardly relative to the first face by a stepped portion. An internal space of the body on the second face side is enlarged backwardly more than that on the first face side. The stepped portion is formed in the middle of the rear face of the body in the horizontal direction, which defines a right-half portion as the first face, and a left-half portion as the second face.

Abstract: A semiconductor device includes a die pad, a semiconductor element which is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portions each having a layered structure including a metal foil comprising copper or a copper alloy, and electrically conductive portion plating layers provided at both upper and lower ends of the metal foil are arranged around the die pad. The die pad has a lower die pad plating layer, and the semiconductor element is loaded on the die pad comprising such a die pad plating layer. Electrodes provided on the semiconductor element are electrically connected with top ends of the electrically conductive portions via wires, respectively. The lower electrically conductive portion plating layers of the electrically conductive portions and the die pad plating layer of the die pad are exposed outside from the sealing resin on their back faces.

Abstract: In a monitoring and control device for use in a remote monitoring and control system, a device housing has a socket located behind a display panel and an external storage medium including a rewritable memory is removably mounted in the socket. The device housing is attached in an attachment hole formed in a wall in a state that the external storage medium is mounted in the socket. A control unit performs a setting operation for a graphic image displayed on the display panel and for the load control in accordance with setting information stored in the external storage medium. The external storage medium is inserted in the socket through an insertion slot formed in a side portion of the device housing, at least a portion of the insertion slot being received in the attachment hole in a state that the device housing is attached to the wall.

Abstract: A magnetic field sensor includes: a magnetic thin film; a feeder comprising an input and output terminals configured to supply element current to the magnetic thin film; and a detector configured to detect a voltage between ends of the magnetic thin film in a direction perpendicular to a direction of the element current. The magnetic thin film is Rained symmetric about the direction of the element current.

Abstract: A semiconductor device includes a die pad, a semiconductor element which is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portions each having a layered structure including a metal foil comprising copper or a copper alloy, and electrically conductive portion plating layers provided at both upper and lower ends of the metal foil are arranged around the die pad. The die pad has a lower die pad plating layer, and the semiconductor element is loaded on the die pad comprising such a die pad plating layer. Electrodes provided on the semiconductor element are electrically connected with top ends of the electrically conductive portions via wires, respectively. The lower electrically conductive portion plating layers of the electrically conductive portions and the die pad plating layer of the die pad are exposed outside from the sealing resin on their back faces.

Abstract: A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a metal foil 1 comprising copper or a copper alloy, and electrically conductive portion plating layers 2 provided at both upper and lower ends of the metal foil 1 are arranged around the die pad 20. The die pad 20 has a lower die pad plating layer 2b, and the semiconductor element 30 is loaded on the die pad 20 comprising such a die pad plating layer 2b. Electrodes 30a provided on the semiconductor element 30 are electrically connected with top ends of the electrically conductive portions 10 via wires 3, respectively. The lower electrically conductive portion plating layers 2 of the electrically conductive portions 10 and the die pad plating layer 2b of the die pad 20 are exposed outside from the sealing resin 40 on their back faces.

Abstract: A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20a, and a side face 60a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.

Abstract: There is provided a monitor and control apparatus capable of enlarging a volume of a body, while ensuring a space for routing signal lines between a rear face of the body and a bottom surface of a mounting hole. The body 5 has a rear face including: a first face having terminal sections protruded; and a second face protruded backwardly relative to the first face by a stepped portion. An internal space of the body on the second face side is enlarged backwardly more than that on the first face side. The stepped portion is formed in the middle of the rear face of the body in the horizontal direction, which defines a right-half portion as the first face, and a left-half portion as the second face.

Abstract: In a monitoring and control device for use in a remote monitoring and control system, a device housing has a socket located behind a display panel and an external storage medium including a rewritable memory is removably mounted in the socket. The device housing is attached in an attachment hole formed in a wall in a state that the external storage medium is mounted in the socket. A control unit performs a setting operation for a graphic image displayed on the display panel and for the load control in accordance with setting information stored in the external storage medium. The external storage medium is inserted in the socket through an insertion slot formed in a side portion of the device housing, at least a portion of the insertion slot being received in the attachment hole in a state that the device housing is attached to the wall.

Abstract: A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.

Abstract: A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20a, and a side face 60a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.

Abstract: A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a metal foil 1 comprising copper or a copper alloy, and electrically conductive portion plating layers 2 provided at both upper and lower ends of the metal foil 1 are arranged around the die pad 20. The die pad 20 has a lower die pad plating layer 2b, and the semiconductor element 30 is loaded on the die pad 20 comprising such a die pad plating layer 2b. Electrodes 30a provided on the semiconductor element 30 are electrically connected with top ends of the electrically conductive portions 10 via wires 3, respectively. The lower electrically conductive portion plating layers 2 of the electrically conductive portions 10 and the die pad plating layer 2b of the die pad 20 are exposed outside from the sealing resin 40 on their back faces.