Abstract: A method for producing a resin molded product comprises conveying a molding die maintenance member including a plate-like support and a molding die maintenance resin from a common storage to a molding die for resin molding including an upper die and a lower die, clamping the molding die in a state where the molding die maintenance member is placed between the upper die and the lower die of the molding die, performing maintenance by heating the molding die maintenance member after the clamping the molding die, conveying the molding die maintenance member from the molding die, conveying a substrate from the storage to the molding die, and clamping the molding die in a state where the substrate is placed between the upper die and the lower die of the molding die.

Abstract: Provided is a laser processing device that enables a film to be stabilized and processed. The present invention comprises: a conveyance mechanism that conveys a film; a holding mechanism that has a pair of holding parts which can at least sandwich and hold lateral portions of the processing range of the film; and a laser mechanism for processing the processing range of the film held by the holding mechanism.

Abstract: The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.

Abstract: A resin molding apparatus includes: a resin supply mechanism including a nozzle for ejecting liquid resin to a supply target; a resin collection unit including: a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle; and a movement mechanism configured to cause the resin-receiving member to move in such a manner as to follow the nozzle while keeping the resin-receiving member under the nozzle; a mold die including an upper die and a lower die facing the upper die; a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit.

Abstract: The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member 13, the method includes: placing a resin 15 on the plate-like member 13; transferring the resin 15 to a position of a die cavity 17a of a molding die in a state where the resin 15 is placed on the plate-like member 13; and performing resin-encapsulation of an electronic component by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component in a state where the electronic component is soaked in the resin 15 placed on the plate-like member 13 in the die cavity 17a.