METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT
The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member 13, the method includes: placing a resin 15 on the plate-like member 13; transferring the resin 15 to a position of a die cavity 17a of a molding die in a state where the resin 15 is placed on the plate-like member 13; and performing resin-encapsulation of an electronic component by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component in a state where the electronic component is soaked in the resin 15 placed on the plate-like member 13 in the die cavity 17a.
Latest TOWA CORPORATION Patents:
- Method for manufacturing resin molded product
- RESIN MOLDING DEVICE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
- Mold die, resin molding apparatus, and method for producing resin molded product
- RESIN MOLDING DEVICE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
- TRANSFER DEVICE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
The present invention relates to a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component.
BACKGROUND ARTElectronic components such as IC, semiconductor electronic components, and the like are mostly molded as resin-encapsulated electronic components to use. In this instance, there is a case where the electronic component is molded together with a plate-like member such as a heat-releasing plate (heat sink) for releasing heat generated by the electronic component for cooling or a shield (blocking plate) for blocking electromagnetic waves emitted from the electronic component. As the method of manufacturing a resin-encapsulated electronic component including such a plate-like member, for example, there is a method of attaching the plate-like member after performing resin-encapsulation of the electronic component by compression molding or the like. There is also a method of performing resin-encapsulation of the electronic component together with the plate-like member at the time of performing transfer molding in a molding die (metal die).
DISCLOSURE OF THE INVENTION Problem to be Solved by the InventionHowever, the method of attaching the plate-like member after performing resin-encapsulation has a problem in manufacturing efficiency that the method requires a number of steps because a resin-encapsulation step and a plate-like member attachment step are performed separately. Further, the method of performing resin-encapsulation of the electronic component together with the plate-like member by transfer molding needs to load a lead frame together with the electronic component and the plate-like member in a molding die. Therefore, the structure of the handler for transfer molding is complicated and the facility is costly.
Hence, the present invention is intended to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost.
Means for Solving ProblemIn order to achieve the aforementioned purpose, the manufacturing method of the present invention is a method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member, the method includes placing a resin on the plate-like member, transferring the resin to a position of a die cavity of a molding die in a state where the resin is placed on the plate-like member, and performing resin-encapsulation of the electronic component by subjecting the resin to compression molding together with the plate-like member and the electronic component in a state where the electronic component is soaked in the resin placed on the plate-like member in the die cavity.
Further, the manufacturing apparatus of the present invention is an apparatus for manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member, the apparatus includes a resin placement unit, a molding die having a die cavity, a transfer unit, and a resin-encapsulation unit, wherein the resin placement unit places a resin on the plate-like member, wherein the transfer unit transfers the resin to a position of the die cavity in a state where the resin is placed on the plate-like member, and wherein the resin-encapsulation unit performs resin-encapsulation of the electronic component by subjecting the resin to compression molding together with the plate-like member and the electronic component in a state where the electronic component is soaked in the resin placed on the plate-like member in the die cavity.
Effects of the InventionAccording to the manufacturing method or the manufacturing apparatus of the present invention, a resin-encapsulated electronic component including a plate-like member can be manufactured in a simple manner at low cost.
Next, the present invention will be described in more detail. However, the present invention is not limited to the following description.
In the manufacturing method of the present invention, while there is no particular limitation on the plate-like member, the plate-like member is preferably a heat-releasing plate (heat sink) or a shield (blocking plate). The shield may be the one that blocks electromagnetic waves emitted from the electronic component, for example. Further, there is no particular limitation on the shape of the plate-like member. For example, in a case where the plate-like member is a heat-releasing plate, the heat-releasing plate may have, for example, the shape of a fin in which one or more protrusions are bound to a main body of the plate-like member for improving heat-releasing efficiency. While there is no particular limitation on the material of the plate-like member, in a case where the plate-like member is a heat-releasing plate or a shield, for example, metal or the like can be used. Note here that, the plate-like member is also a functional member (action member) having some kind of functions. For example, in a case where the plate-like member is a heat-releasing plate (heat sink), the plate-like member is a functional member (action member) having a heat-releasing function (heat-releasing action) and in a case where the plate-like member is a shield (blocking plate), the plate-like member is a functional member (action member) having a blocking function (blocking action).
During transferring the resin, the resin may be transferred into a die cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on a release film. Further, for example, the plate-like member may be fixed on the release film with an adhesive.
As described above, while there is no particular limitation on the shape of the plate-like member, for example, the plate-like member may include a resin containing portion. Further, with respect to the manufacturing method of the present invention, during placing the resin, the resin may be placed in the resin containing portion of the plate-like member and the transfer of the resin and the compression molding may be performed in a state where the resin is placed in the resin containing portion.
In the manufacturing method of the present invention, there is no particular limitation on the resin, and for example, the resin may either be a thermoplastic resin or a thermosetting resin. The resin may be at least one selected from the group consisting of granular resins, powdery resins, liquid resins, plate-like resins, sheet-like resins, film-like resins, and paste-like resins, for example. Further, the resin may be at least one selected from the group consisting of transparent resins, translucent resins, and opaque resins, for example.
In the manufacturing apparatus of the present invention, the transfer unit may be the one that transfers the resin into a die cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on a release film. In this case, the resin-encapsulation unit may include a release film attractive unit and may perform the compression molding in a state where the release film is attracted by the release film attractive means. Further, in the present invention, there is no particular limitation on the molding die, and examples thereof include a metal die and a ceramic die.
EXAMPLESHereinafter, specific Examples of the present invention will be described with reference to Figures. Each Figure is schematically illustrated by appropriately omitting, exaggerating, and the like for convenience in explanation.
Example 1In this Example, the method of manufacturing a resin-encapsulated electronic component and the apparatus for manufacturing a resin-encapsulated electronic component that use the release film will be described.
In the cross sectional views of
First, as shown in
Next, as shown in
Next, as shown in
Next, as shown in
Note here that, in the manufacturing method of the present invention, while there is no particular limitation on the molding die for compression molding (for example, compression molding die), for example, the molding die may be formed of an upper die and a lower die. While
Next, with reference to schematic cross sectional views of
First, the cross sectional view of
The resin-encapsulation unit is a component of this manufacturing apparatus and includes all the components shown in
As will be described later, the resin-encapsulation unit performs resin-encapsulation of an electronic component 19 by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component 19 in a state where the electronic component 19 is soaked in the resin 15 placed on the heat-releasing plate (plate-like member) 13 in the lower die cavity (die cavity) 17a. Note here that, in
Next, the method of manufacturing a resin-encapsulated electronic component using this manufacturing apparatus will be described. Note here that, in
First, as shown in
First, as shown in
Next, as shown in
Further, as indicated by an arrow 25 in
Next, as shown in
That is, first, as shown in
Note here that, as described above, at the time of soaking the electronic component 19 in the resin 15 in the lower die cavity 17a, the resin 15 is in a state of having fluidity. This resin 15 having fluidity may be, for example, liquid resins (pre-hardened thermosetting resins and the like) or molten resins obtained by heating and melting solid resins such as granular resins, powdery resins, paste-like resins, and the like. The heating of the resin 15 can be performed by heating the lower die 17, for example. Further, for example, in a case where the resin 15 is a thermosetting resin, the resin 15 may be thermally hardened by pressurizing the resin 15 in the lower die cavity 17a. Thereby, resin-encapsulation molding (compression molding) of the electronic component 19 can be performed in the resin forming body (package) corresponding to the shape of the lower die cavity 17a. This makes it also possible to perform molding in a state where the plate-like member 13 is exposed at the top surface (the opposite side of the substrate) of the resin forming body (package), for example.
After the compression molding (resin-encapsulation), as shown in
Note here that the “FM (fine molding)” of performing the compression molding by reducing the pressure in the inside of the chase holder (at least the inside of the die cavity) is employed in this Example. However, the present invention is not limited thereto and other ways of compression molding can be employed.
Further, 13 can be a plate-like member other than the heat-releasing plate, and may be, for example, a blocking plate (shield).
Further, while the manufacturing method of the present invention includes the resin placement, the transfer of the resin, and the resin-encapsulation as described above, the manufacturing method of the present invention may include any other procedures as shown in this Example.
In this Example, as described above, the resin is transferred into the die cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on the release film. Thereby, for example, in
Next, another Example of the present invention will be described.
In the cross sectional views of
Since the release film 12 is not used in this Example, the step shown in
Also, the manufacturing method and the manufacturing apparatus schematically shown in cross sectional views of
In this Example, since the outer edge portions of the heat-releasing plate 13 are raised so that the center of the heat-releasing plate 13 serves as a resin containing portion, the contact of the resin 15 with the lower die 17 and the entry of the resin 15 into the void 17b between the lower die outer circumferential end retainer 21 and the lower die chase can be restricted or prevented without using the release film 12. Therefore, as well as the cost saving by omitting the release film, the manufacturing efficiency of the resin-encapsulated electronic component can be increased because the steps of affixing or attracting the release film can be omitted.
Note here that the shape and the structure of the plate-like member such as a heat-releasing plate and the like are not limited to those shown in
Further, in this Example, as in Example 1, 13 can be a plate-like member other than the heat-releasing plate, and may be, for example, a blocking plate (shield).
Note here that, with respect to the resin-encapsulated electronic component manufactured by the present invention, for example, the number of the electronic components may be one or more than one. In the cross sectional view of
In the cross sectional view of
Further, as described above, in the present invention, the plate-like member may be fixed on the release film with an adhesive. An example thereof is schematically shown in the cross sectional view of
The present invention is not limited to the aforementioned Examples; and arbitrary and suitable combinations, changes, or selective adoption thereof can be made as necessary without departing from the spirit and scope of the present invention.
EXPLANATION OF REFERENCE NUMERALS
- 11 XY table
- 12 release film
- 13 heat-releasing plate (plate-like member)
- 14 tray cover
- 14c cleaner
- 15 resin
- 16 resin handler
- 17 lower die
- 17a lower die cavity (die cavity)
- 17b void
- 18 substrate
- 19 electronic component
- 20 upper die
- 21 lower die outer circumferential end retainer
- 22 film retainer
- 21s, 22s spring
- 23 FM cover
- 23a O ring
- 24, 25 attraction by depressurization
- 26, 30 direction of force acting on spring
- 27 direction of force acting on FM cover
- 28 depressurization of inside of chase holder
- 29 release of depressurization
- 31 transferring direction of heat-releasing plate 13
Claims
1. A method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component comprising a plate-like member, the method comprising:
- placing a resin on the plate-like member;
- transferring the resin to a position of a die cavity of a molding die in a state where the resin is placed on the plate-like member; and
- performing resin-encapsulation of an electronic component by subjecting the resin to compression molding together with the plate-like member and the electronic component in a state where the electronic component is soaked in the resin placed on the plate-like member in the die cavity.
2. The method according to claim 1, wherein
- the plate-like member comprises a heat-releasing plate or a shield.
3. The method according to claim 1, wherein
- during the transferring, the resin is transferred into the die cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on a release film.
4. The method according to claim 3, wherein
- the plate-like member is fixed on the release film with an adhesive.
5. The method according to claim 1, wherein
- the plate-like member includes a resin containing portion,
- during the placing the resin, the resin is placed in the resin containing portion, and
- the transferring and the compression molding are performed in a state where the resin is placed in the resin containing portion.
6. The method according to claim 1, wherein
- the resin is a thermoplastic resin or a thermosetting resin.
7. The method according to claim 1, wherein
- the resin is at least one selected from the group consisting of granular resins, powdery resins, liquid resins, plate-like resins, sheet-like resins, film-like resins, and paste-like resins.
8. The method according to claim 1, wherein
- the resin is at least one selected from the group consisting of transparent resins, translucent resins, and opaque resins.
9. An apparatus for manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component comprising a plate-like member, the apparatus comprising:
- a resin placement unit;
- a molding die having a die cavity;
- a transfer unit; and
- a resin-encapsulation unit, wherein
- the resin placement unit places a resin on the plate-like member, the transfer unit transfers the resin to a position of the die cavity in a state where the resin is placed on the plate-like member, and
- the resin-encapsulation unit performs resin-encapsulation of an electronic component by subjecting the resin to compression molding together with the plate-like member and the electronic component in a state where the electronic component is soaked in the resin placed on the plate-like member in the die cavity.
10. The apparatus according to claim 9, wherein
- the transfer unit transfers the resin into the die cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on a release film.
11. The apparatus according to claim 10, wherein
- the resin-encapsulation unit comprises a release film attractive unit, and
- the compression molding is performed in a state where the release film is attracted by the release film attractive unit.
12. A plate-like member-equipped release film, comprising
- a release film; and
- a plate-like member, wherein
- the plate-like member is placed on the release film.
13. The plate-like member-equipped release film according to claim 12, wherein
- the plate-like member is fixed on the release film with an adhesive.
14. The plate-like member-equipped release film according to claim 12, wherein
- the plate-like member comprises a heat-releasing plate and a shield.
15. The plate-like member-equipped release film according to claim 12, wherein
- a single plate-like member is placed on a single release film.
16. The plate-like member-equipped release film according to claim 12, wherein
- a plurality of plate-like members are placed on a single release film.
17. The plate-like member-equipped release film according to claim 12, wherein
- the release film is a long release film.
18. The plate-like member-equipped release film according to claim 12, wherein
- the plate-like member-equipped release film is used for the method according to claim 1.
Type: Application
Filed: Nov 8, 2012
Publication Date: Jan 15, 2015
Applicant: TOWA CORPORATION (Kyoto-shi, Kyoto)
Inventors: Hiroshi Uragami (Kyoto-shi), Keita Mizuma (Kyoto-shi), Ichitaro Okamoto (Kyoto-shi), Naoki Takada (Kyoto-shi), Mamoru Nakamura (Kyoto-shi), Shinsuke Yasuda (Kyoto-shi)
Application Number: 14/381,887
International Classification: H01L 21/56 (20060101); H01L 21/67 (20060101); B29C 43/18 (20060101);