Patents by Inventor Ken Hsu

Ken Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10340384
    Abstract: A method includes forming a first fin protruding above a substrate, the first fin having a PMOS region; forming a first gate structure over the first fin in the PMOS region; forming a first spacer layer over the first fin and the first gate structure; and forming a second spacer layer over the first spacer layer. The method further includes performing a first etching process to remove the second spacer layer from a top surface and sidewalls of the first fin in the PMOS region; performing a second etching process to remove the first spacer layer from the top surface and the sidewalls of the first fin in the PMOS region; and epitaxially growing a first source/drain material over the first fin in the PMOS region, the first source/drain material extending along the top surface and the sidewalls of the first fin in the PMOS region.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Ken Lin, Chun Te Li, Chih-Peng Hsu
  • Publication number: 20190165156
    Abstract: A method includes forming a first fin protruding above a substrate, the first fin having a PMOS region; forming a first gate structure over the first fin in the PMOS region; forming a first spacer layer over the first fin and the first gate structure; and forming a second spacer layer over the first spacer layer. The method further includes performing a first etching process to remove the second spacer layer from a top surface and sidewalls of the first fin in the PMOS region; performing a second etching process to remove the first spacer layer from the top surface and the sidewalls of the first fin in the PMOS region; and epitaxially growing a first source/drain material over the first fin in the PMOS region, the first source/drain material extending along the top surface and the sidewalls of the first fin in the PMOS region.
    Type: Application
    Filed: April 30, 2018
    Publication date: May 30, 2019
    Inventors: Wei-Ken Lin, Chun Te Li, Chih-Peng Hsu
  • Patent number: 9323812
    Abstract: A method of processing a set of intersection queries in a multi-dimensional data structure may include receiving the set of intersection queries for the multi-dimensional data structure. The method may also include determining whether to process each of the set the intersection queries individually, or whether to process the set of intersection queries together using pre-cached modifier mappings. The method may additionally include processing the set of intersection queries, and providing intersection values that correspond to the set of intersection queries.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: April 26, 2016
    Assignee: Oracle International Corporation
    Inventors: Rajesh Bhatia, Prasad Tungaturthy, Pei Ken Hsu
  • Publication number: 20150347427
    Abstract: A method and apparatus that generates a results cache using feedback from a user's search session. In this embodiment, the device receives a feedback package from a client, where the feedback package characterizes a user interaction with a plurality of query results in the search session that are presented to a user in response to a query prefix entered by the user. The device further generates a plurality of results for a plurality of queries by, running the plurality of queries using the search feedback index to arrive at the plurality of results. In addition, the device creates a results cache from the plurality of results, where the results cache maps the plurality of results to the plurality of queries and the results cache is used to serve query results to a client.
    Type: Application
    Filed: September 30, 2014
    Publication date: December 3, 2015
    Inventors: Rishab Aiyer Ghosh, Lun Cui, Vipul Ved Prakash, Larry S. Rosenstein, Ken Hsu
  • Publication number: 20150297647
    Abstract: An Enterococcus faecium EF08 strain for manufacturing a feed additive is disclosed. The EF08 strain is deposited at Bioresource Collection and Research Center of Taiwan with deposit number BCRC 910525. Also, the EF08 strain is deposited at CGMCC-China General Microbiological Culture Collection with deposit number CGMCC 5549. Moreover, the EF08 strain has a 16S rDNA sequence as set forth as SEQ ID NO: 1.
    Type: Application
    Filed: April 17, 2015
    Publication date: October 22, 2015
    Inventors: Ting-Yu LEE, Chih-Hsuan WANG, Jin-Seng LIN, Bi YU, Tien-Ken HSU, Lian-Chwan YANG
  • Patent number: 8978742
    Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.
    Type: Grant
    Filed: December 16, 2012
    Date of Patent: March 17, 2015
    Assignees: Cpumate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Publication number: 20140310300
    Abstract: A method of processing a set of intersection queries in a multi-dimensional data structure may include receiving the set of intersection queries for the multi-dimensional data structure. The method may also include determining whether to process each of the set the intersection queries individually, or whether to process the set of intersection queries together using pre-cached modifier mappings. The method may additionally include processing the set of intersection queries, and providing intersection values that correspond to the set of intersection queries.
    Type: Application
    Filed: April 11, 2013
    Publication date: October 16, 2014
    Applicant: Oracle International Corporation
    Inventors: RAJESH BHATIA, PRASAD TUNGATURTHY, PEI KEN HSU
  • Patent number: 8764222
    Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: July 1, 2014
    Assignee: Kitagawa Holdings, LLC
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Hwai-Ming Wang, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8756811
    Abstract: A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 24, 2014
    Assignees: Golden Sun News Techniques Co., Ltd., Cpumate Inc
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8684563
    Abstract: A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: April 1, 2014
    Assignee: Kitagawa Holdings, LLC
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Hwai-Ming Wang, Chiao-Li Huang, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8667685
    Abstract: A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: March 11, 2014
    Assignees: CPumate Inc, Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8528627
    Abstract: A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: September 10, 2013
    Assignees: Golden Sun News Techniques Co., Ltd., Cpumate Inc.
    Inventors: Ken Hsu, Chih-Hung Cheng, Kuo-Len Lin
  • Patent number: 8484845
    Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: July 16, 2013
    Assignees: CPUMate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8464547
    Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: June 18, 2013
    Assignees: Golden Sun News Techniques Co., Ltd., CPUMate Inc.
    Inventors: Ken Hsu, Chih-Hung Cheng, Chen-Hsiang Lin, Kuo-Len Lin
  • Patent number: 8459335
    Abstract: A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: June 11, 2013
    Assignees: CPUmate Inc, Golden Sun New Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8387250
    Abstract: A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: March 5, 2013
    Assignees: Cpumate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Chih-Hung Cheng, Kuo-Len Lin, Ken Hsu
  • Patent number: 8375584
    Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: February 19, 2013
    Assignees: Cpumate Inc, Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8359745
    Abstract: A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: January 29, 2013
    Assignees: CPUmate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Patent number: 8341967
    Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: January 1, 2013
    Assignees: Golden Sun News Techniques Co., Ltd., Cpumate Inc.
    Inventors: Chih-Hung Cheng, Ken Hsu, Chen-Hsiang Lin, Kuo-Len Lin
  • Patent number: 8344600
    Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: January 1, 2013
    Assignees: CPUMate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Hwai-Ming Wang, Ken Hsu, Chih-Hung Cheng