Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Abstract: A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.

Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.

Abstract: A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.

Abstract: In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is provided. Adhesive medium is coated on the contacting surface between the heat pipe and the accommodating trough. The plurality of heat pipes is pressed into the accommodating trough. Finally, the heat pipes juxtaposed in the accommodating trough are pressed coplanarly the surface of the fixing base while a portion of the adhesive medium is received in the recess.

Abstract: A solar cell charging device includes a base shown as a shell shape, a light-converging lens arranged at a top face of the base, a solar collector correspondingly located under the light-converging lens and a photoelectric converting unit. A plurality of charging troughs arranged on the base are recessed inwardly from circumferential faces thereof. The photoelectric converting unit is connected between each charging trough and the solar collector, converting the light energy absorbed by the solar collector into electric energy provided to be input into each charging trough, after the light-converging lens focuses the solar energy onto the solar collector.

Abstract: A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).

Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Abstract: A combined assembly of a fixing base and heat pipes includes a fixing base and at least one heat pipe. The fixing base has a plate body. The bottom surface of the plate body is formed with a transverse opening trough. The opening trough is provided with a through-hole penetrating the plate body. A longitudinal groove is provided in the opening trough at a position corresponding to that of the through-hole. One end of the longitudinal groove does not penetrate the plate body and is formed into a loose-proof section on the bottom section of the opening trough. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-releasing section penetrates to the outside of the through-hole, and the heat-absorbing section is accommodated in the opening trough. A portion of the heat-absorbing section is inserted into the longitudinal groove and stopped by the loose-proof section, and the other portion thereof is formed with a plane that is in flush with the bottom surface of the plate body.

Abstract: In a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes, the method is first to provide a plurality of heat pipes, each of which has an evaporator formed a heated face thereon; then, the evaporators are moved closely to one another in a manner, such that their heated faces are disposed onto a flat face; next, the evaporators are limited from multiple directions; afterward, pressing the evaporators toward the flat face makes their heated faces flush therewith; finally, injecting a bonding media into the gaps among the heat faces of the evaporators bonds the heat faces together to form a fixedly coplanar configuration.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.