Abstract: Provided is a resin film that has a stress integral value of greater than 10 MPa and 1000 MPa or less when uniaxially stretched at a tensile speed of 300 mm/min at 25° C. until it breaks. The resin film showing these properties is supple and durable.

Abstract: Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.

Abstract: With respect to a phase locked loop (PLL) circuit that receives a first reference clock and generates an output clock, the PLL circuit includes a delay circuit that delays the first reference clock to generate a second reference clock, a feedback circuit that generates a control signal based on a phase difference between the second reference clock and a feedback clock, an oscillator that oscillates at a frequency determined based on the control signal to generate the output clock, and a divider that divides the output clock in the on state. The PLL circuit switches between a first mode and a second mode, the feedback clock in the first mode is a signal obtained by retiming an output of the divider with the output clock, and the feedback clock in the second mode is a signal obtained by retiming the first reference clock with the output clock.

Abstract: For example, an I/O circuit is formed by freely combining a plurality of kinds of standard cells included in a cell library. The plurality of kinds of standard cells include at least first standard cells and a second standard cell. The first standard cells include first protection elements and a first power line formed in a region over the first protection elements to conduct to the first protection elements. The second standard cell includes a second protection element formed in a layout identical with that of the first protection elements, and a second power line formed in a region over the second protection element to conduct to the second protection element while being isolated from the first power line.

Abstract: A semiconductor memory device includes a plurality of transistors arranged in a first direction, and arranged in a second direction and a first wiring layer disposed between a semiconductor substrate and a plurality of voltage supply wirings. Each of the plurality of transistors includes a source region and a drain region. The first wiring layer includes a plurality of first connecting portions disposed at positions overlapping with the plurality of source regions when viewed in a third direction and electrically connected to the plurality of source regions and the plurality of voltage supply wirings, a plurality of second connecting portions disposed at positions overlapping with the plurality of source regions when viewed in the third direction and electrically connected to a plurality of the drain regions and a plurality of conductive layers, and a passing wiring region disposed between a pair of the second connecting portions.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Abstract: The present invention relates to a method for manufacturing a laminate, including: a laminating step of laminating a side of a thermal transfer layer of a thermal transfer sheet having a release sheet and the thermal transfer layer on at least a part of a surface of a resin member by heat bonding, in which the release sheet has no yield points, and has an elongation at break of 100% to 600% in a stress-strain curve measured by a tensile test at a molding temperature T?° C. in the laminating step.

Abstract: A surface modification sheet (X) of the present invention includes a release sheet (10) and a surface modification layer (20) thereon. The surface modification layer (20) contains a polymer having a side chain containing an ethylenic double bond. The side chain of the polymer preferably includes a unit derived from an isocyanate compound containing the ethylenic double bond.

Abstract: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Abstract: Provided is a bidirectional amplifier that can be downsized even when performance varies for each of a plurality of amplifying units. The bidirectional amplifier includes: a first amplifying unit configured to amplify a first signal input from a first terminal and output the amplified first signal from a second terminal; a second amplifying unit configured to amplify a second signal input from the second terminal, output the amplified second signal from the first terminal, and including a compensation element and a compensation element compensating for degradation in performance of the first amplifying unit; and a control unit configured to control an operation of the first amplifying unit and an operation of the second amplifying unit.

Abstract: The present invention relates to a method for manufacturing a laminate, including a laminating step of laminating a side of a thermal transfer layer of a thermal transfer sheet having a release sheet and the thermal transfer layer on at least a part of a surface of a resin member by heat bonding, in which the release sheet has a thermal expansion coefficient ? of ?15%???+7.5% at a molding temperature T?° C. in the laminating step.

Abstract: A stickable-curable adhesive sheet bonds a deformation/conversion device to an adherend. The stickable-curable adhesive sheet contains a stickable-curable adhesive component and a curing component curing the stickable-curable adhesive component. The stickable-curable adhesive component has pressure-sensitive adhesiveness before curing and the initial tensile elastic modulus at 25° C. of the stickable-curable adhesive sheet after curing is 5×108 Pa or more.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: With respect to a phase locked loop (PLL) circuit that receives a first reference clock and generates an output clock, the PLL circuit includes a delay circuit that delays the first reference clock to generate a second reference clock, a feedback circuit that generates a control signal based on a phase difference between the second reference clock and a feedback clock, an oscillator that oscillates at a frequency determined based on the control signal to generate the output clock, and a divider that divides the output clock in the on state. The PLL circuit switches between a first mode and a second mode, the feedback clock in the first mode is a signal obtained by retiming an output of the divider with the output clock, and the feedback clock in the second mode is a signal obtained by retiming the first reference clock with the output clock.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, the surface-modifying layer having an average thickness of 0.1 ?m to 50 ?m, and the difference between the maximum value and the minimum value of the thickness of the surface-modifying layer being less than twice the average thickness; and a surface-modified member, a coated article and a method for producing a coated article, using the surface-modifying sheet.

Abstract: The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, and the surface-modifying layer containing a component that reacts with a thermosetting resin; a surface-modified member, a coated article, a printed article and a joined body, using the surface-modifying sheet; and a method for producing a surface-modified member.

Abstract: Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.