Abstract: A method of determining blood pressure measurements includes inflating a cuff, receiving an indication of pressure inside the cuff during inflation, determining a blood pressure based at least in part on the received indication, assigning a confidence level to the blood pressure, and determining whether the confidence level satisfies a threshold confidence level. Based at least on a determination that the confidence level satisfies a threshold confidence level, the method can include causing a display to display the blood pressure. Based at least on a determination that the confidence level does not satisfy a threshold confidence level, the method can include deflating the cuff, receiving an indication of pressure inside the cuff during deflation, determining another blood pressure, and causing a display to display a blood pressure.

Abstract: A method of determining blood pressure measurements includes inflating a cuff, receiving an indication of pressure inside the cuff during inflation, determining a blood pressure based at least in part on the received indication, assigning a confidence level to the blood pressure, and determining whether the confidence level satisfies a threshold confidence level. Based at least on a determination that the confidence level satisfies a threshold confidence level, the method can include causing a display to display the blood pressure. Based at least on a determination that the confidence level does not satisfy a threshold confidence level, the method can include deflating the cuff, receiving an indication of pressure inside the cuff during deflation, determining another blood pressure, and causing a display to display a blood pressure.

Abstract: A method of determining blood pressure measurements includes inflating a cuff, receiving an indication of pressure inside the cuff during inflation, determining a blood pressure based at least in part on the received indication, assigning a confidence level to the blood pressure, and determining whether the confidence level satisfies a threshold confidence level. Based at least on a determination that the confidence level satisfies a threshold confidence level, the method can include causing a display to display the blood pressure. Based at least on a determination that the confidence level does not satisfy a threshold confidence level, the method can include deflating the cuff, receiving an indication of pressure inside the cuff during deflation, determining another blood pressure, and causing a display to display a blood pressure.

Abstract: Systems and methods for monitoring and assessing road conditions are disclosed herein that receive raw data comprising information indicative of road conditions from various types of remote devices. The road condition data may be normalized based on the type of the remote device and the normalized road condition data may be stored. A road condition model may be generated based on the normalized road condition data and using the device location. The road condition model may be used to identify pothole locations, rate road segments, etc. The road condition model may apply various data set weightings and learning algorithms to present an accurate result. The road condition model may be optimized based on feedback from city personnel and other sources of information to determine the accuracy of the model outputs. The road condition model may also be trained to ensure accuracy.

Abstract: Systems and methods for monitoring and assessing road conditions are disclosed herein that receive raw data comprising information indicative of road conditions from various types of remote devices. The road condition data may be normalized based on the type of the remote device and the normalized road condition data may be stored. A road condition model may be generated based on the normalized road condition data and using the device location. The road condition model may be used to identify pothole locations, rate road segments, etc. The road condition model may apply various data set weightings and learning algorithms to present an accurate result. The road condition model may be optimized based on feedback from city personnel and other sources of information to determine the accuracy of the model outputs. The road condition model may also be trained to ensure accuracy.

Abstract: A method of determining blood pressure measurements includes inflating a cuff, receiving an indication of pressure inside the cuff during inflation, determining a blood pressure based at least in part on the received indication, assigning a confidence level to the blood pressure, and determining whether the confidence level satisfies a threshold confidence level. Based at least on a determination that the confidence level satisfies a threshold confidence level, the method can include causing a display to display the blood pressure. Based at least on a determination that the confidence level does not satisfy a threshold confidence level, the method can include deflating the cuff, receiving an indication of pressure inside the cuff during deflation, determining another blood pressure, and causing a display to display a blood pressure.

Abstract: A blood pressure measurement system that non-invasively determines an individual's blood pressure can include a noninvasive blood pressure sensor having an optical sensor and a motion sensor. The optical sensor can provide a photoplethysmograph signal obtained from a patient to a processor. The motion sensor can provide a motion signal to the processor responsive to motion of the patient. In one embodiment, the processor calculates or estimates the blood pressure of the patient based on the photoplethysmograph signal and the motion signal. Advantageously, the system can obtain this blood pressure measurement without an occlusive cuff, thereby reducing patient discomfort. In other implementations, the processor calculates a blood pressure-related parameter from the photoplethysmograph and motion signal. The processor can occasionally trigger an occlusive cuff measurement as this parameter changes, thereby reducing the frequency of occlusive cuff measurements.

Abstract: A patient monitoring system includes an inflatable cuff, a gas reservoir containing a compressed gas, and a sensor. When the inflatable cuff is coupled to a wearer, the gas reservoir supplies gas to the inflatable cuff to inflate the inflatable cuff via gas pathways. As the inflatable cuff inflates, a patient monitor can receive blood pressure data from the sensor and use the blood pressure data to determine the blood pressure of the wearer. The patient monitor can also receive blood pressure data during deflation of the inflatable cuff to determine the blood pressure of the wearer.

Abstract: An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages.

Abstract: An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages.

Abstract: A patient monitoring system includes an inflatable cuff, a gas reservoir containing a compressed gas, and a sensor. When the inflatable cuff is coupled to a wearer, the gas reservoir supplies gas to the inflatable cuff to inflate the inflatable cuff via gas pathways. As the inflatable cuff inflates, a patient monitor can receive blood pressure data from the sensor and use the blood pressure data to determine the blood pressure of the wearer. The patient monitor can also receive blood pressure data during deflation of the inflatable cuff to determine the blood pressure of the wearer.

Abstract: An apparatus and a method for producing three-dimensional integrated circuit packages. In one embodiment, an electronics package with at least two dice are stacked one atop another is disclosed. A top die is of smaller size compared with a bottom die such that after a die attach operation, wire-bond pads of the bottom die will be exposed for a subsequent wire bonding operation. The bottom die contains contact pads on the front side that couple with one or more passive components fabricated on the back side of the top die to complete the circuit. In another exemplary embodiment, a method to form one or more three-dimensional passive components in a stacked-die package is disclosed wherein partial inductor elements are fabricated on the front side of the bottom die and the back side of the top die. The top and bottom elements are coupled together completing the passive component.

Abstract: Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the die is substantially parallel to the surface area of the substrate. The face of the die is aligned with at least a portion of the component layer, and terminals of the die are connected to the substrate.

Abstract: Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the die is substantially parallel to the surface area of the substrate. The face of the die is aligned with at least a portion of the component layer, and terminals of the die are connected to the substrate.

Abstract: An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages.

Abstract: A DFN package includes internally extended package leads. One or more package pads are physically and electrically extended from a first edge of the package to a second, opposite edge of the package. These extended package leads can terminate at the edges of the leadframe. The package pads and the extended package leads where the IC die is attached can have full leadframe thickness. Other extended package lead features can have a reduced leadframe thickness (e.g., about half the leadframe thickness). Leadframe features can be physically and electrically connected to a tie-bar feature which can be an integral part of a leadframe matrix. The tie-bar can stabilize the leadframe features during assembly. The tie-bar can also provide electrical connectivity for post assembly leadframe plating. The tie-bar can be removed during package singulation by sawing or punching techniques to free the leadframe features both physically and electrically.

Abstract: A blood pressure measurement system that non-invasively determines an individual's blood pressure can include a noninvasive blood pressure sensor having an optical sensor and a motion sensor. The optical sensor can provide a photoplethysmograph signal obtained from a patient to a processor. The motion sensor can provide a motion signal to the processor responsive to motion of the patient. In one embodiment, the processor calculates or estimates the blood pressure of the patient based on the photoplethysmograph signal and the motion signal. Advantageously, the system can obtain this blood pressure measurement without an occlusive cuff, thereby reducing patient discomfort. In other implementations, the processor calculates a blood pressure-related parameter from the photoplethysmograph and motion signal. The processor can occasionally trigger an occlusive cuff measurement as this parameter changes, thereby reducing the frequency of occlusive cuff measurements.

Abstract: An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages.

Abstract: A fabrication method for a BGA or LGA package includes a low-cost metal leadframe with internally extended leads. I/O attach lands can be placed at any location on the metal leadframe, including the center of the package. An I/O attach land can be fabricated at any position upon an extended lead (e.g., near the center of the package). During fabrication of the package, an isolation saw cut to the bottom of the package can be used to electrically disconnect the leadframe circuit from the peripheral extension traces to prevent tampering with the IC die by probing the edge metal traces.

Abstract: A wafer-level, batch processed, die-sized integrated circuit (IC) package with both top and bottom side electrical connections is disclosed. In one aspect, a number of bonding wires can be attached to bond pads on the top side (active circuit side) of an IC wafer. Trenches can be formed in the wafer at scribe regions and the bonding wires can extend through the trench. The trench can be filled with coating material. The bonding wires can be partially exposed on the top and/or bottom sides of the wafer to distribute electrical connections from the bond pads to the top and/or bottom sides of the wafer.