Abstract: An apparatus and method for incorporating discrete passive components into an integrated circuit package. A first surface of a substrate is coated with a material to mechanically protect the first surface. A first metal layer and then an insulating layer are formed on a second surface of the substrate. Selected areas are removed from the insulating and a second metal layer is formed over the insulating layer and the exposed metal layer. Selected areas of the second metal layer are removed to form a plurality of structures, including at least one of a wirebonding pad, a solder-bonding pad, a device interconnect circuit, or an attach pad to which an electronic component may be attached. An electronic component may be attached to at least one of the structures. The resulting integrated circuit die may be incorporated into an electronic package.

Abstract: A platform residing viewing sensor and a pointing system/weapon. An operator system is remotely monitoring the scene on a display as viewed by the viewing sensor such that an operator system can gaze, acquire and track targets by scanning the scene with eyes and locking the eyesight onto a selected target and track the target with the eyes. The system further includes a dual camera sensor that follows and monitors the operator system's eyes motion so that the operator system can simultaneously monitor the external viewing sensor's scene, locking and tracking some selected target. The display coordinates of the selected target are utilized to point the pointing system/weapon on the external platform so that the operator system can fire at the target as desired. The problem is thus summarized as one of controlling the weapon pointing, movement and firing on a target that has been selected and is tracked by the eyes of an operator system viewing a display.

Abstract: The present invention provides a method and system for an innovative design of the automatic stabilization and pointing control of a device based on the MEMS technology, which is small enough and has acceptable accuracy to be integrated into many application systems, such as, laser pointing systems, telescopic systems, imaging systems, and optical communication systems. The stabilization mechanism configuration design is based on utilization of AGNC commercial products, the coremicro IMU and the coremicro AHRS/INS/GPS Integration Unit. The coremicro AHRS/INS/GPS Integration Unit is used as the processing platform core for the design of the MEMS coremicro IMU based stabilization mechanism.

Abstract: A device for electrically interconnecting one or more semiconductor devices to provide for flexibility in wiring and preventing long or shorted leads and methods for fabricating and using same. The device has a substrate with a plurality of substantially concentric electrically-conductive paths, each of the plurality of electrically-conductive paths being electrically isolated from each other and formed on a first surface of the substrate. At least one of the plurality of electrically-conductive paths is arranged concentrically so as to substantially span a width of the first surface of the substrate. A plurality of bonding pads is electrically coupled to each of the electrically-conductive paths. The plurality of bonding pads is coupled to one of the electrically-conductive paths and is electrically isolated from bonding pads located on any other electrically-conductive path. The entire interconnect device may be mounted in a standard leadframe product.

Abstract: An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.

Abstract: A device for electrically interconnecting one or more semiconductor devices to provide for flexibility in wiring and preventing long or shorted leads and methods for fabricating and using same. The device has a substrate with a plurality of substantially concentric electrically-conductive paths, each of the plurality of electrically-conductive paths being electrically isolated from each other and formed on a first surface of the substrate. At least one of the plurality of electrically-conductive paths is arranged concentrically so as to substantially span a width of the first surface of the substrate. A plurality of bonding pads is electrically coupled to each of the electrically-conductive paths. The plurality of bonding pads is coupled to one of the electrically-conductive paths and is electrically isolated from bonding pads located on any other electrically-conductive path. The entire interconnect device may be mounted in a standard leadframe product.

Abstract: A networked position multiple tracking system includes a plurality of individual units which are networked multi-tracking devices networked and their location information is shared via a data link. The individual units are organized as groups and groups are further networked to facilitate the data transfer in a large area or different geographical areas. The typical applications of the present invention include tracking of family members; tracking of cab vehicles of a taxi company; tracking of law enforcement officials pursuing criminals or suspects. In a military environment, the soldiers in a regiment can track each other during military missions by using the present invention. The pilots of aircraft in a formation can use the multi-tracking system to maintain formation flight and evade potential collision.

Abstract: A method and apparatus electrically coupling input/output bond pads that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads electrically coupled to an integrated circuit of the microelectronic device and first and second conductive stud balls bonded to first and second input/output pads, respectively, and a third conductive stud ball bonded to the first and second conductive stud balls. A wire bonding tool in “stud ball” mode is utilized to bond the conductive stud balls.

Abstract: The present invention allows non-wafer form devices to be tested on a standard automatic wafer-probe tester or other automated test or measurement device commonly employed in semiconductor or allied industries (e.g., flat panel display, data storage, or the like) processes. The present invention accomplishes this by providing a low-profile carrier for temporarily mounting a non-wafer form device. The low-profile carrier holds the non-wafer form device (e.g., an integrated circuit chip, a thin film head structure, one or more molded array packages, etc.) magnetically into recesses which are machined or otherwise formed in the low-profile carrier.

Abstract: An apparatus for testing and connecting integrated circuit chips to external packaging and circuitry. A plurality of electrically conductive leads are formed on an electrically insulative substrate by tape automated bonding methods. The leads extend from peripherally disposed test terminals to centrally disposed interconnect pads and are aligned therebetween with bond pads that are disposed near a perimeter of a face of a chip. The leads are connected to the bond pads and are encapsulated with a cement, and the substrate is adhered to the chip face. Electronic characteristics of the chip are tested by channeling electrical signals via the test terminals. The leads are then severed closely peripheral to the bond pads, disconnecting the test terminals from the chip. The chips that pass the testing are connected via the interconnect pads, which may be arranged in a pad grid array, to matching terminals in a package.

Abstract: A method and apparatus for testing and connecting integrated circuit chips to external packaging and circuitry. A plurality of electrically conductive leads are formed on an electrically insulative substrate by tape automated bonding methods. The leads extend from peripherally disposed test terminals to centrally disposed interconnect pads and are aligned therebetween with bond pads that are disposed near a perimeter of a face of a chip. The leads are connected to the bond pads and are encapsulated with a cement, and the substrate is adhered to the chip face. Electronic characteristics of the chip are tested by channeling electrical signals via the test terminals. The leads are then severed closely peripheral to the bond pads, disconnecting the test terminals from the chip. The chips that pass the testing are connected via the interconnect pads, which may be arranged in a pad grid array, to matching terminals in a package.

Abstract: A method of electrically connecting a tape automated bonding lead to an aluminum input/output pad of an integrated circuit includes sequentially sputtering an adhesive layer, a diffusion barrier layer and a gold layer on the input/output pad. The adhesive layer is a metallic film having good step coverage and adhesive properties to contact the pad. The diffusion barrier layer is formed atop the adhesive layer and is sandwiched by the gold layer. The method employs "bumpless" techniques and the bond lead is connected to the gold layer by applying a combination of pressure and vibrational energy.

Abstract: A method of packaging an integrated circuit chip having an active surface with a pattern of input/output pads. A package member is positioned to frame the integrated circuit chip, leaving a gap between the active chip surface and an interconnect support surface of the package member. A filler material is deposited within the gap, simultaneously fixing the chip to the package member and providing a bridge that is coplanar with the active and interconnect support surfaces. A pattern of conductive printed circuit interconnects is preferably photolithographically formed from the input/output pads to an edge of the package member. The resulting structure can then be electrically connected to a substrate, such as a printed circuit board, by bonding the interconnects to contact sites on the substrate. Optionally, a number of integrated circuit chips can be connected to a single package member to form a multi-chip module.

Abstract: A method of forming leadouts on a surface mountable chip carrier for electrical connection to a supporting substrate, such as a motherboard. The chip carrier includes a carrier board having input/output vias extending to a selected layer of the carrier board. In a preferred embodiment, the selected layer is the lower surface of the carrier board, but the selected layer may optionally be the upper surface or an intermediate layer. The input/output vias are on an inboard side of an interconnection region. An array of terminals, which may also be vias, are on the outboard side of the interconnection region. The interconnection region is removed from the carrier board to form a window located between the terminals and the input/output vias. In the preferred embodiment, a metallic layer is then deposited on the lower surface of the carrier board. The metallic layer is patterned to leave leads extending from the input/output vias to the terminals, thereby providing parallel leads extending across the window.

Abstract: A pressure sensor header uses a layered assembly of a first and a second metal layer with an intermediate ceramic layer having a radial surface groove providing a fluid passage between a peripheral fluid port and a hole extending through the first layer between the groove and an outer surface of the first layer. A plurality of electrically conductive pins are arranged to extend through the layered assembly and are sealed to the upper and lower metal headers with glass seals to provide a fluid-tight seal. The seals on the metal pins provide a means for retaining the layered assembly in a predetermined configuration while the radial groove and the hole through the first layer provide a fluid path to a pressure transducer element supported on the first layer of the header and having an internal fluid path aligned with the hole through the first layer. Electrical connections to the metal pins provide electrical signal paths between the transducer element and associated electrical circuits.