Abstract: A human-computer interaction method includes: in response to obtaining first input content, outputting a resulting response corresponding to the first input content in a session window of a first application, where presentation method or operability of the resulting response varies with the first input content.

Abstract: Various aspects of the present disclosure relate to a surgical microscope system, and in particular, to an arm for a surgical microscope system. The surgical microscope system comprises an optics carrier comprising optical components of a microscope of the surgical microscope system. The surgical microscope system comprises a display device for displaying image data recorded by an optical imaging sensor of the surgical microscope system. The surgical microscope system comprises an arm. The arm comprises a first section and a second section. The first section is configured to provide a vertical and/or lateral adjustment of the position of the optics carrier. The second section is attached to a suspension point of the first section and to the optics carrier.

Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

Abstract: The disclosure relate to a hydrogen generator comprising a reactant cartridge and a reaction chamber. The reactant cartridge comprises a reactant reservoir comprising a first reactant for generating hydrogen gas; and an engagement mechanism configured to engage with a reaction chamber and enable the first reactant to pass from the reactant reservoir to the reaction chamber when the cartridge is engaged with the reaction chamber. The reaction chamber comprises: a reaction chamber for storing a second reactant; and an engagement mechanism configured to engage with the reactant cartridge and enable the first reactant to pass from the reactant cartridge to the reaction chamber when the cartridge is engaged with the reaction chamber.

Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

Abstract: A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.

Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Abstract: An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.

Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.

Abstract: A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.