Abstract: Various aspects of the present disclosure relate to a surgical microscope system, and in particular, to an arm for a surgical microscope system. The surgical microscope system comprises an optics carrier comprising optical components of a microscope of the surgical microscope system. The surgical microscope system comprises a display device for displaying image data recorded by an optical imaging sensor of the surgical microscope system. The surgical microscope system comprises an arm. The arm comprises a first section and a second section. The first section is configured to provide a vertical and/or lateral adjustment of the position of the optics carrier. The second section is attached to a suspension point of the first section and to the optics carrier.

Abstract: A pair of projection glasses, a wearable projection apparatus, and a foldable optical engine are provided. The foldable optical engine includes a projection mechanism and a light emitting mechanism. A light input portion of the projection mechanism corresponds in position to a light output portion of the light emitting mechanism. The projection mechanism and the light emitting mechanism are pivotally connected to each other along a rotation axis so as to be rotatable relative to each other along the rotation axis. When the projection mechanism and the light emitting mechanism are rotated relative to each other to cause the light output portion to face toward the light input portion, the light emitting mechanism is configured to emit a light beam from the light output portion toward the light input portion, so as to allow the projection mechanism to receive the light beam for projecting an image light.

Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

Abstract: A connection device for a leak detector for detecting leaks in pipes of an automobile air conditioning system is provided with an elongated body defining a plurality of fixing holes, a through hole, and a slot; a first threaded hollow fastener disposed through the through hole of the elongated body, the first threaded hollow fastener including a first externally threaded valve, a first connection member defining an opening, and a first O-ring placed on the first connection member; and a second threaded hollow fastener moveably disposed through the slot of the elongated body, the second threaded hollow fastener including a second externally threaded valve, a second connection member defining an opening, and a second O-ring placed on the second connection member.

Abstract: The disclosure relate to a hydrogen generator comprising a reactant cartridge and a reaction chamber. The reactant cartridge comprises a reactant reservoir comprising a first reactant for generating hydrogen gas; and an engagement mechanism configured to engage with a reaction chamber and enable the first reactant to pass from the reactant reservoir to the reaction chamber when the cartridge is engaged with the reaction chamber. The reaction chamber comprises: a reaction chamber for storing a second reactant; and an engagement mechanism configured to engage with the reactant cartridge and enable the first reactant to pass from the reactant cartridge to the reaction chamber when the cartridge is engaged with the reaction chamber.

Abstract: The process for manufacturing collagen and trace elements from sea water consists of various steps which are raw material preparation, resting of raw material, preliminary filtration to remove heavy metals, deodorize and purity remaining impurities, spraying of water, separation of heavy metals, collagen and trace elements from water and separation of collagen and trace elements. The process according to this invention, apart from sea water, can be applied to other type of salt water by adjusting the salinity and density of the water to an optimal value. The process according to this invention yields clean and purified collagen which is easily absorbed by human body and contains numerous types of trace elements.

Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

Abstract: A connection device for a leak detector for detecting leaks in pipes of an automobile air conditioning system is provided with an elongated body including a plurality of threaded holes, and a slot at one end; a first threaded hollow fastener disposed through the other end of the elongated body, the first threaded hollow fastener including a first valve at one end, a first threaded shank, a first connection member at the other end and having an opening, and a first O-ring placed on the first connection member; and a second threaded hollow fastener moveably disposed through the slot and including a second valve at one end, a second threaded shank, a second connection member at the other end and having an opening, and a second O-ring placed on the second connection member.

Abstract: A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.

Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Abstract: An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: The process for manufacturing collagen and trace elements from sea water consists of various steps which are raw material preparation, resting of raw material, preliminary filtration to remove heavy metals, deodorize and purity remaining impurities, spraying of water, separation of heavy metals, collagen and trace elements from water and separation of collagen and trace elements. The process according to this invention, apart from sea water, can be applied to other type of salt water by adjusting the salinity and density of the water to an optimal value. The process according to this invention yields clean and purified collagen which is easily absorbed by human body and contains numerous types of trace elements.

Abstract: The process for manufacturing collagen and trace elements from sea water consists of various steps which are raw material preparation, resting of raw material, preliminary filtration to remove heavy metals, deodorize and purity remaining impurities, spraying of water, separation of heavy metals, collagen and trace elements from water and separation of collagen and trace elements. The process according to this invention, apart from sea water, can be applied to other type of salt water by adjusting the salinity and density of the water to an optimal value. The process according to this invention yields clean and purified collagen which is easily absorbed by human body and contains numerous types of trace elements.

Abstract: An electric device includes a main body, a supporting crutch and a pivot mechanism connecting the body to the crutch. The body is rotated around the crutch through the pivot mechanism. The pivot mechanism includes first and second bearing shims. The first bearing shim has a limiting salient, which has a first sidewall, a second sidewall and an inclined surface. The inclined surface is tilted from the second sidewall to the first sidewall. The second bearing shim has a sliding salient. When the sliding salient is disposed on the first/second sidewall, the main body is positioned at a first/second position. The sliding salient crosses the first sidewall and slides on the inclined surface to the second sidewall by a first force. The sliding salient crosses the second sidewall and slides on the inclined surface to the first sidewall by a second force larger than the first force.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.

Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

Abstract: An electric device includes a main body, a supporting crutch and a pivot mechanism connecting the body to the crutch. The body is rotated around the crutch through the pivot mechanism. The pivot mechanism includes first and second bearing shims. The first bearing shim has a limiting salient, which has a first sidewall, a second sidewall and an inclined surface. The inclined surface is tilted from the second sidewall to the first sidewall. The second bearing shim has a sliding salient. When the sliding salient is disposed on the first/second sidewall, the main body is positioned at a first/second position. The sliding salient crosses the first sidewall and slides on the inclined surface to the second sidewall by a first force. The sliding salient crosses the second sidewall and slides on the inclined surface to the first sidewall by a second force larger than the first force.