Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.

Abstract: A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Abstract: A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.

Abstract: A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.

Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.

Abstract: A computer system and method for preventing burnout of a Central Processing Unit (CPU). The computer system includes a CPU, a temperature sensor, a Direct Current to Direct Current (DC-DC) transformer, a hardware monitor and an ATX power supply. The CPU serves to execute computer programs. The temperature sensor is adjacent to or directly attached to the CPU for monitoring the operating temperature of the CPU. The DC-DC transformer is coupled to the CPU for providing CPU source voltage. The hardware monitor is coupled to the temperature sensor and the DC-DC transformer for monitoring the operating temperature and the source voltage of the CPU. The ATX power supply is coupled to the hardware monitor and the DC-DC transformer and controlled by a Post Power-Triggering Signal. When the operating temperature or the source voltage exceeds a permitted range, the hardware monitor sends a Post Power-Triggering signal to the ATX power supply to cut its output power off.

Abstract: A dust-proof device for a solid integration rod in projecting apparatuses is provided in the invention. The solid integration rod has a layer of metal reflecting film with a certain length in axial direction. The layer of metal reflecting film is coated on the circumferential outer surface at an end of the solid integration rod that is adhered to the dust-proof element of the dust-proof device. The metal reflecting film is provided so that if a flared portion of the adhesive occurs after the dust-proof device is adhered to the solid integration rod, the metal film will still reflect the light normally, and the light energy will not be lost through the flare portion.

Abstract: The invention discloses a solid rod dust-proof structure for projecting apparatuses. The solid rod includes an incident-beam surface and an outgoing-beam surface. The dust-proof structure includes: a housing provided with a first chamber and a second chamber connecting each other wherein the cross section of the second chamber is greater than that of the first chamber. The first chamber contains the solid rod, and a stopping portion is installed on the opposite end of the second chamber for stopping the solid rod; and a dust-proof plate being a transparent plate is contained in the second chamber to completely cover the outgoing-beam surface of the solid rod. Using the above structure, the outgoing-beam surface of the solid rod can be completely covered by the transparent dust-proof plate so that the structure is free from dust and the light transmitting through the outgoing-beam surface will not be blocked.

Abstract: Improved locking sleeve assembly is intended for use on a knock-down display shelf which is made up of four supporting pillars, multiple inner sleeves, rest boards, a top board and a plurality of retaining caps. Each locking sleeve assembly is made up of a separable inner locking sleeve and a retaining cap which has a roundly flanged bottom and a hollow central tubular portion provided with a tapered inner surface. On the circular flange of each retaining cap are disposed a number of counter sunk screw holes. At each corner of a rest board is disposed a counter sunk through hole in which a bottom flanged retaining cap can be placed and fixed in place by screws engaged with the screw holes on the circular flange. Each supporting pillar has a plurality of equally spaced peripheral grooves so as to permit halves of the separable locking sleeves, each having a peripherally extended rib on the inner surface, to be selectively engaged with the grooves of a supporting pillar at various levels.

Abstract: A table with adjustable shelves including four supporting rods, several collars, several retaining boards, a cover board, several supporting beams and several bridge beams. Each corner of the retaining board is formed with an arch recess. The supporting beam includes a linkage each end of which is connected with a C-shaped conic fixing sleeve. Two sides of top edge of the linkage are respectively formed with two dented section. When assembled, from lateral upper sides of the collars, the C-shaped conic fixing sleeves of the supporting beams are downward fitted onto the supporting rods and engaged with the collars fitted around the supporting rods. The bridge beams are bridged between the linkages of the supporting beams with the ends of the bridge beams inserted in the dented sections thereof. The retaining board is positioned between the supporting rods and rested on the supporting beams and the bridge beams.

Abstract: An illuminating coaster includes an upper member, an intermediate member, a lower member, an illuminating assembly arranged between the upper member and the intermediate member and including a first conducting member, a second conducting member, and batteries, the first conducting member being fixedly mounted on an inner side of the upper member, the first conducting member being fixedly mounted on an inner side of the upper member, the second conducting member being provided with a light-emitting diode, the batteries being disposed between the first and second conducting members, whereby when a glass is put onto the coaster, the upper member will be pressed downwardly to make the first conducting member contact the batteries thereby forming a closed circuit and therefore causing the light-emitting diode to give light through a bottom of the glass.

Abstract: A foldable hanger of the present invention mainly comprises a hook portion, a frame and two shoulders. The hook portion is formed with an extended cylindrical post at its lower portion, from which extends a notch from half way of the cylindrical post down to its bottom, and two flanges at its two sides of the notch. The frame has an upper and a lower hollow pipes with a board formed inbetween the two pipes. Both of the upper and the lower pipes have teeth integrally formed in the hollow bodies and a block ring placed inside of each end of the two pipes. The board is integrally formed with the two pipes having a recess being shaped like the hook in reversed position located underneath the cut portion of the upper pipe each of which has two flat plates extended upwardly from the cut ends therefrom and each of which further has two semi-circle plates extended outwardly from the top of the flat plate towards the two ends of the upper pipe respectively.