Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Abstract: An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: The process for manufacturing collagen and trace elements from sea water consists of various steps which are raw material preparation, resting of raw material, preliminary filtration to remove heavy metals, deodorize and purity remaining impurities, spraying of water, separation of heavy metals, collagen and trace elements from water and separation of collagen and trace elements. The process according to this invention, apart from sea water, can be applied to other type of salt water by adjusting the salinity and density of the water to an optimal value. The process according to this invention yields clean and purified collagen which is easily absorbed by human body and contains numerous types of trace elements.

Abstract: The process for manufacturing collagen and trace elements from sea water consists of various steps which are raw material preparation, resting of raw material, preliminary filtration to remove heavy metals, deodorize and purity remaining impurities, spraying of water, separation of heavy metals, collagen and trace elements from water and separation of collagen and trace elements. The process according to this invention, apart from sea water, can be applied to other type of salt water by adjusting the salinity and density of the water to an optimal value. The process according to this invention yields clean and purified collagen which is easily absorbed by human body and contains numerous types of trace elements.

Abstract: An electric device includes a main body, a supporting crutch and a pivot mechanism connecting the body to the crutch. The body is rotated around the crutch through the pivot mechanism. The pivot mechanism includes first and second bearing shims. The first bearing shim has a limiting salient, which has a first sidewall, a second sidewall and an inclined surface. The inclined surface is tilted from the second sidewall to the first sidewall. The second bearing shim has a sliding salient. When the sliding salient is disposed on the first/second sidewall, the main body is positioned at a first/second position. The sliding salient crosses the first sidewall and slides on the inclined surface to the second sidewall by a first force. The sliding salient crosses the second sidewall and slides on the inclined surface to the first sidewall by a second force larger than the first force.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.

Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

Abstract: An electric device includes a main body, a supporting crutch and a pivot mechanism connecting the body to the crutch. The body is rotated around the crutch through the pivot mechanism. The pivot mechanism includes first and second bearing shims. The first bearing shim has a limiting salient, which has a first sidewall, a second sidewall and an inclined surface. The inclined surface is tilted from the second sidewall to the first sidewall. The second bearing shim has a sliding salient. When the sliding salient is disposed on the first/second sidewall, the main body is positioned at a first/second position. The sliding salient crosses the first sidewall and slides on the inclined surface to the second sidewall by a first force. The sliding salient crosses the second sidewall and slides on the inclined surface to the first sidewall by a second force larger than the first force.

Abstract: A web based system for creating video compositions has a network connected interface generator for providing web pages to a user coupled to the network. A content library stores video clips and optionally images for use in creating the video composition or a sequence of video clips and/or images. A project database contains metadata for one or more projects that are being edited by a user via the network, and a rendering engine provides down resolutioned previews of a user selected project for viewing by a user via the network.

Abstract: Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.

Abstract: A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Abstract: A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.

Abstract: A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.

Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

Abstract: An integrated diagnostic system includes interface connectors to connect to a plurality of instruments/instrument modules, including engine analyzers, gas analyzers, oscilloscopes, scanners, network connections, and/or other desired peripheral modules. These modules advantageously interface to the system through diverse parts, connections and with various protocols. The system may connect to a network, wired or wireless, for interfacing among processors and modules, and with an internet connection for interaction with remote resources including databases and expert systems.