Patents by Inventor Keng-Min Su

Keng-Min Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11733267
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 22, 2023
    Assignee: MPI CORPORATION
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
  • Patent number: 11619656
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 4, 2023
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Keng-Min Su, Che-Wei Lin, Hsin-Cheng Hung
  • Publication number: 20220214379
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, HSIN-CHENG HUNG
  • Publication number: 20220214380
    Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, KO-CHUN WU
  • Publication number: 20200309819
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Application
    Filed: March 18, 2020
    Publication date: October 1, 2020
    Applicant: MPI Corporation
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin