Die plate assembly for probe head
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The broken lines depict portions of the die assembly and form no part of the claimed design.
Claims
The ornamental design for a die plate assembly for probe head, as shown and described.
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Type: Grant
Filed: Jun 28, 2021
Date of Patent: Jun 18, 2024
Assignee: MPI CORPORATION (Chu-Pei)
Inventors: Chin-Yi Lin (Chu-Pei), Keng-Min Su (Chu-Pei), Che-Wei Lin (Chu-Pei), Hsin-Cheng Hung (Chu-Pei)
Primary Examiner: Amy C Wierenga
Assistant Examiner: Angel R Marrero-Arce
Application Number: 29/796,877