Die plate assembly for probe head

- MPI CORPORATION
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Description

FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;

FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;

FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;

FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;

FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;

FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;

FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;

FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;

FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;

FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;

FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;

FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;

FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,

FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.

The broken lines depict portions of the die assembly and form no part of the claimed design.

Claims

The ornamental design for a die plate assembly for probe head, as shown and described.

Referenced Cited
U.S. Patent Documents
5872026 February 16, 1999 Pasch
D421968 March 28, 2000 Matsumura
D426522 June 13, 2000 Matsumura
D432504 October 24, 2000 Matsumura
6242933 June 5, 2001 Yap
7629804 December 8, 2009 Nguyen
D720310 December 30, 2014 Sharma
8901948 December 2, 2014 Wang
9069015 June 30, 2015 Campardo
D743356 November 17, 2015 Sharma
D763806 August 16, 2016 Sharma
11619656 April 4, 2023 Lin
20220214380 July 7, 2022 Lin
Foreign Patent Documents
008591598-0001 August 2021 EM
214871-0001 October 2021 TW
Patent History
Patent number: D1031738
Type: Grant
Filed: Jun 28, 2021
Date of Patent: Jun 18, 2024
Assignee: MPI CORPORATION (Chu-Pei)
Inventors: Chin-Yi Lin (Chu-Pei), Keng-Min Su (Chu-Pei), Che-Wei Lin (Chu-Pei), Hsin-Cheng Hung (Chu-Pei)
Primary Examiner: Amy C Wierenga
Assistant Examiner: Angel R Marrero-Arce
Application Number: 29/796,877