Patents by Inventor Kenichi Harano

Kenichi Harano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11697721
    Abstract: Provided is a method for producing a resin molded article including an introducing step of introducing a plurality of resin foam particles and a heat medium substance into a forming mold, and a molding step of, after the introducing step, heating the forming mold to a temperature at which the heat medium substance can be vaporized, thereby obtaining a resin molded article including the plurality of resin foam particles.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 11, 2023
    Assignee: ASICS CORPORATION
    Inventors: Junichiro Tateishi, Takashi Yamade, Daisuke Sawada, Takashi Osaki, Kenichi Harano
  • Patent number: 11667105
    Abstract: A laminate of the present invention includes a first member which contains a thermoplastic polymer and through which laser light is transmitted and a second member which contains a thermoplastic polymer and absorbs laser light, wherein the first member is directly bonded to the second member, and A represented by the formula 1: A=?9×D+Wa?45 is more than zero. D represents a distance between a Hansen solubility parameter of the thermoplastic polymer of the first member and a Hansen solubility parameter of the thermoplastic polymer of the second member, and Wa represents work of adhesion calculated from each surface free energy of the first member and the second member. Such a first member and a second member are firmly bonded to each other without using a bonding sheet.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: June 6, 2023
    Assignee: ASICS CORPORATION
    Inventors: Hironori Kitayama, Junichiro Tateishi, Kenichi Harano
  • Patent number: 11589638
    Abstract: Provided in the present invention is a shoe that has a ground engaging surface with a simplified structure and that is excellent in lightweight properties since an outsole is composed of an elastomer sheet including a sheet body and foamed polymer particles dispersed in the sheet body.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: February 28, 2023
    Assignee: ASICS CORPORATION
    Inventors: Daisuke Sawada, Kenichi Harano, Junichiro Tateishi
  • Publication number: 20230037426
    Abstract: A mouth cover includes a mouth cover body that covers at least the mouth and the nostrils of a wearer, and wearing portions that are connected to the mouth cover body and allow the wearer to wear the mouth cover body. The mouth cover body includes an opening in a downward direction from a position directly facing the mouth of the wearer.
    Type: Application
    Filed: October 21, 2022
    Publication date: February 9, 2023
    Inventors: MAKOTO FUKUDA, TSUYOSHI NISHIWAKI, YOSUKE OTSUKA, TAKEHIRO TAGAWA, KENICHI HARANO, JUN KONDO, KOICHI MONMA, MIZUHO IRIE, KEI KANEMATSU
  • Patent number: 11445785
    Abstract: Provided is a shoe sole member partially or entirely formed of a resin composite, the resin composite including; a non-foamed elastic body matrix composed of an elastomer; and a plurality of resin foam particles dispersed in the elastic body matrix. Also provided is a shoe including the shoe sole member.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 20, 2022
    Assignee: ASICS CORPORATION
    Inventors: Junichiro Tateishi, Takashi Yamade, Daisuke Sawada, Takashi Osaki, Kenichi Harano
  • Publication number: 20210087352
    Abstract: Provided is a method for producing a resin molded article including an introducing step of introducing a plurality of resin foam particles and a heat medium substance into a forming mold, and a molding step of, after the introducing step, heating the forming mold to a temperature at which the heat medium substance can be vaporized, thereby obtaining a resin molded article including the plurality of resin foam particles.
    Type: Application
    Filed: January 31, 2018
    Publication date: March 25, 2021
    Applicant: ASICS CORPORATION
    Inventors: Junichiro TATEISHI, Takashi YAMADE, Daisuke SAWADA, Takashi OSAKI, Kenichi HARANO
  • Patent number: 10952494
    Abstract: An outsole is formed of a viscoelastic body containing a rubber component. This viscoelastic body has a loss factor measured by a dynamic viscoelasticity measurement under conditions of a temperature of 23° C., a frequency of 10 Hz, a static strain of 10%, and a dynamic strain of 7% being 0.17 or more, a storage elastic modulus measured by the dynamic viscoelasticity measurement being 5.7 MPa or less, and a ratio of a tensile stress at 300% elongation to a tensile stress at 100% elongation being 4.4 or more. Such outsole is excellent in wet grip performance and durability.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: March 23, 2021
    Inventors: Masanori Sakamoto, Yusuke Nishiura, Osamu Yamane, Kenichi Harano
  • Publication number: 20210045491
    Abstract: Provided is a shoe sole member partially or entirely formed of a resin composite in which a plurality of resin foam particles are integrated with one or more non-foamed elastic bodies, wherein a resin composition constituting the one or more elastic bodies and a resin composition constituting the plurality of resin foam particles both include a polyolefin-based resin as a main component, or both include a polyurethane-based resin as a main component. Also provided is a shoe including the shoe sole member.
    Type: Application
    Filed: January 31, 2018
    Publication date: February 18, 2021
    Applicant: ASICS CORPORATION
    Inventors: Junichiro TATEISHI, Takashi YAMADE, Daisuke SAWADA, Takashi OSAKI, Kenichi HARANO
  • Publication number: 20210045494
    Abstract: Provided is a shoe sole member partially or entirely formed of a resin composite, the resin composite including: a non-foamed elastic body matrix composed of an elastomer; a plurality of resin foam particles dispersed in the elastic body matrix; and a binder that lies between the elastic body matrix and the plurality of resin foam particles and has a hardness at 23° C. that is higher than a hardness at 23° C. of the elastic body matrix. Also provided is a shoe including the shoe sole member.
    Type: Application
    Filed: January 31, 2018
    Publication date: February 18, 2021
    Applicant: ASICS CORPORATION
    Inventors: Junichiro TATEISHI, Takashi YAMADE, Daisuke SAWADA, Takashi OSAKI, Kenichi HARANO
  • Publication number: 20200305547
    Abstract: Provided is a shoe sole member partially or entirely formed of a resin composite, the resin composite including; a non-foamed elastic body matrix composed of an elastomer; and a plurality of resin foam particles dispersed in the elastic body matrix. Also provided is a shoe including the shoe sole member.
    Type: Application
    Filed: October 13, 2017
    Publication date: October 1, 2020
    Applicant: ASICS CORPORATION
    Inventors: Junichiro TATEISHI, Takashi YAMADE, Daisuke SAWADA, Takashi OSAKI, Kenichi HARANO
  • Publication number: 20200297062
    Abstract: Provided in the present invention is a shoe that has a ground engaging surface with a simplified structure and that is excellent in lightweight properties since an outsole is composed of an elastomer sheet including a sheet body and foamed polymer particles dispersed in the sheet body.
    Type: Application
    Filed: October 13, 2017
    Publication date: September 24, 2020
    Applicant: ASICS CORPORATION
    Inventors: Daisuke SAWADA, Kenichi HARANO, Junichiro TATEISHI
  • Publication number: 20200262156
    Abstract: A laminate of the present invention includes a first member which contains a thermoplastic polymer and through which laser light is transmitted and a second member which contains a thermoplastic polymer and absorbs laser light, wherein the first member is directly bonded to the second member, and A represented by the formula 1: A=?9×D+Wa?45 is more than zero. D represents a distance between a Hansen solubility parameter of the thermoplastic polymer of the first member and a Hansen solubility parameter of the thermoplastic polymer of the second member, and Wa represents work of adhesion calculated from each surface free energy of the first member and the second member. Such a first member and a second member are firmly bonded to each other without using a bonding sheet.
    Type: Application
    Filed: September 15, 2017
    Publication date: August 20, 2020
    Applicant: ASICS CORPORATION
    Inventors: Hironori KITAYAMA, Junichiro TATEISHI, Kenichi HARANO
  • Publication number: 20190380431
    Abstract: An outsole is formed of a viscoelastic body containing a rubber component. This viscoelastic body has a loss factor measured by a dynamic viscoelasticity measurement under conditions of a temperature of 23° C., a frequency of 10 Hz, a static strain of 10%, and a dynamic strain of 7% being 0.17 or more, a storage elastic modulus measured by the dynamic viscoelasticity measurement being 5.7 MPa or less, and a ratio of a tensile stress at 300% elongation to a tensile stress at 100% elongation being 4.4 or more. Such outsole is excellent in wet grip performance and durability.
    Type: Application
    Filed: April 19, 2017
    Publication date: December 19, 2019
    Inventors: Masanori Sakamoto, Yusuke Nishiura, Osamu Yamane, Kenichi Harano
  • Publication number: 20180368515
    Abstract: Provided is a shoe sole member that is partially or entirely formed from a resin foam product constituted by integrating of resin foam particles, wherein the resin foam particles are composed of a resin composition containing a polyamide elastomer, and the resin foam product satisfies all formulas (1) to (4) below, when a loss factor at ?20° C. tan ? [?20° C.], a loss factor at 25° C. is tan ? [25° C.], a storage elastic modulus at 25° C. of the resin composition is E? [25° C.], the minimum value of a complex viscosity at 100° C. to 130° C. of the resin composition is ?min, and the maximum value thereof is ?max, in a dynamic viscoelasticity measurement: 1?tan ? [?20° C.]/tan ? [25° C.]?5 . . .??(1); 50 MPa?E? [25° C.]?400 MPa . . .??(2); 0.05 MPa·s??min . . .??(3); and ?max?0.6 MPa·s . . .??(4).
    Type: Application
    Filed: December 2, 2015
    Publication date: December 27, 2018
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Takashi YAMADE, Kenichi HARANO, Yuuki HOSHINO, Masayuki TAKANO
  • Patent number: 10143263
    Abstract: There is provided a shoe-forming member comprising a rubber composition containing a styrene-butadiene rubber, a butadiene rubber, silica, a silane coupling agent, and a crosslinking agent, the rubber composition being crosslinked, wherein the rubber composition contains specific materials as the silane coupling agent and the crosslinking agent, and the butadiene rubber and the styrene-butadiene rubber are contained in the rubber composition in predetermined proportions.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 4, 2018
    Assignee: ASICS CORPORATION
    Inventors: Takashi Oomura, Yasuhiro Otsuka, Kenichi Harano
  • Patent number: 10113045
    Abstract: There is provided a molded foam article including a foam obtained by foaming a formation material wherein the formation material contains a resin component, an Asker C hardness of the foam is 10 degrees or more, and a ratio E40/E0 of the foam is 0.5 or more, the ratio E40/E0 being a ratio of an elastic coefficient E40 at a strain of 40% in relation to an elastic coefficient E0 at a strain of 0% of the foam. The molded foam article has appropriate softness with a small change in hardness under compressive deformation.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: October 30, 2018
    Assignee: ASICS CORPORATION
    Inventors: Junichiro Tateishi, Kenichi Harano, Keisuke Yamada, Mitsuo Nasako
  • Patent number: 10051915
    Abstract: A foamed sole according to the present invention includes a foam molding containing a rubber component and a resin component, wherein the maximum value of a loss factor [tan ?] at a frequency of 10 Hz and at 30° C. to 80° C. of the foam molding is 0.18 or less, and a peak of a loss factor [tan ?] at a frequency of 10 Hz of the foam molding lies within the range of 100° C. or higher. The foamed sole has a feature that it hardly shrinks when it is heated.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: August 21, 2018
    Assignee: ASICS Corporation
    Inventors: Yasuhiro Otsuka, Kenichi Harano, Takuro Kamimura, Daisuke Sawada
  • Publication number: 20170013910
    Abstract: There is provided a shoe-forming member comprising a rubber composition containing a styrene-butadiene rubber, a butadiene rubber, silica, a silane coupling agent, and a crosslinking agent, the rubber composition being crosslinked, wherein the rubber composition contains specific materials as the silane coupling agent and the crosslinking agent, and the butadiene rubber and the styrene-butadiene rubber are contained in the rubber composition in predetermined proportions.
    Type: Application
    Filed: March 31, 2014
    Publication date: January 19, 2017
    Applicant: ASICS Corporation
    Inventors: Takashi Oomura, Yasuhiro Otsuka, Kenichi Harano
  • Patent number: 9192212
    Abstract: A laminate for laser bonding of the present invention contains a bonding sheet that is melted by irradiation of laser light and a first member laminated on one surface of the bonding sheet and formed of a thermoplastic foam. The difference between the melting point of the first member (Mfoam) and the melting point of the bonding sheet (Msheet) (Mfoam?Msheet) is ?50° C. to 20° C. and the difference between the melt viscosity of the first member (Vfoam) and the melt viscosity of the bonding sheet (Vsheet) (Vfoam?Vsheet) is 3.0×105 Pa·s to 8.0×105 Pa·s. Preferably, the laminate for laser bonding contains a second member having transparency to laser light laminated on the other surface of the bonding sheet.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: November 24, 2015
    Assignee: ASICS CORPORATION
    Inventors: Junichiro Tateishi, Katsuhiro Imazato, Sadaki Mori, Kenichi Harano, Hironori Kitayama
  • Patent number: D889788
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 14, 2020
    Assignees: SUMITOMO RUBBER INDUSTRIES, LTD., ASICS CORPORATION
    Inventors: Hisao Yoshinaga, Takuro Akasaka, Nami Masao, Kenichi Harano