Patents by Inventor Kenichi Harano
Kenichi Harano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150181975Abstract: A foamed sole according to the present invention includes a foam molding containing a rubber component and a resin component, wherein the maximum value of a loss factor [tan ?] at a frequency of 10 Hz and at 30° C. to 80° C. of the foam molding is 0.18 or less, and a peak of a loss factor [tan ?] at a frequency of 10 Hz of the foam molding lies within the range of 100° C. or higher. The foamed sole has a feature that it hardly shrinks when it is heated.Type: ApplicationFiled: January 18, 2012Publication date: July 2, 2015Applicant: ASICS CORPORATIONInventors: Yasuhiro Otsuka, Kenichi Harano, Takuro Kamimura, Daisuke Sawada
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Publication number: 20150143723Abstract: There is provided a molded foam article including a foam obtained by foaming a formation material wherein the formation material contains a resin component, an Asker C hardness of the foam is 10 degrees or more, and a ratio E40/E0 of the foam is 0.5 or more, the ratio E40/E0 being a ratio of an elastic coefficient E40 at a strain of 40% in relation to an elastic coefficient E0 at a strain of 0% of the foam. The molded foam article has appropriate softness with a small change in hardness under compressive deformation.Type: ApplicationFiled: May 31, 2012Publication date: May 28, 2015Applicant: ASICS CORPORATIONInventors: Junichiro Tateishi, Kenichi Harano, Keisuke Yamada, Mitsuo Nasako
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Patent number: 8461222Abstract: There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at ?10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan ? (?20° C. to 40° C.) at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan ? (?20° C.)/tan ? (40° C.) at a frequency of 10 Hz is 0.7 to 1.3.Type: GrantFiled: July 19, 2011Date of Patent: June 11, 2013Assignee: ASICS CorporationInventors: Sadaki Mori, Katsuhiro Imazato, Kenichi Harano, Akiyuki Morikawa
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Patent number: 8440308Abstract: The method of manufacturing shoes of the present invention comprises a pre-step of heating a following reactive hot-melt adhesive to melt it and providing the melted adhesive on a joining surface of at least one adherend, an ultraviolet treating step of irradiating the adhesive with ultraviolet light having irradiation energy more than 100 mJ/cm2 and less than 1200 mJ/cm2 to polymerize a polyurethane prepolymer, and a joining step of overlaying a joining surface of another adherend on the adhesive to bond both adherends together. The reactive hot-melt adhesive contains a polyurethane prepolymer having an (meth)acryloyl group and an isocyanate group at the end of a molecule, and a photopolymerization initiator. The polyurethane prepolymer includes a non-crystalline polyol and a crystalline polyol, wherein the non-crystalline polyol is contained from 20% by mass to 90% by mass with respect to the whole polyols. The viscosity of the reactive hot-melt adhesive at 80° C. is 300 Pa·s or less.Type: GrantFiled: January 29, 2008Date of Patent: May 14, 2013Assignee: Asics CorporationInventors: Kenichi Harano, Tatsuya Amano, Hisao Matsumiya
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Publication number: 20120204446Abstract: A laminate for laser bonding of the present invention contains a bonding sheet that is melted by irradiation of laser light and a first member laminated on one surface of the bonding sheet and formed of a thermoplastic foam. The difference between the melting point of the first member (Mfoam) and the melting point of the bonding sheet (Msheet) (Mfoam?Msheet) is ?50° C. to 20° C. and the difference between the melt viscosity of the first member (Vfoam) and the melt viscosity of the bonding sheet (Vsheet) (Vfoam?Vsheet) is 3.0×105 Pa·s to 8.0×105 Pa·s. Preferably, the laminate for laser bonding contains a second member having transparency to laser light laminated on the other surface of the bonding sheet.Type: ApplicationFiled: October 15, 2009Publication date: August 16, 2012Applicant: ASICS CORPORATIONInventors: Junichiro Tateishi, Katsuhiro Imazato, Sadaki Mori, Kenichi Harano, Hironori Kitayama
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Publication number: 20110265351Abstract: There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at ?10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan ? (?20° C. to 40° C.) at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan ? (?20° C.)/tan ? (40° C.) at a frequency of 10 Hz is 0.7 to 1.3.Type: ApplicationFiled: July 19, 2011Publication date: November 3, 2011Applicant: ASICS CORPORATIONInventors: Sadaki MORI, Katsuhiro Imazato, Kenichi Harano, Akiyuki Morikawa
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Patent number: 8008363Abstract: There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at ?10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan ? [?20° C. to 40° C.] at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan ? [?20° C.]/tan ? [40° C.] at a frequency of 10 Hz is 0.7 to 1.3.Type: GrantFiled: May 10, 2006Date of Patent: August 30, 2011Assignee: ASICS CorporationInventors: Sadaki Mori, Katsuhiro Imazato, Kenichi Harano, Akiyuki Morikawa
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Publication number: 20100040889Abstract: The method of manufacturing shoes of the present invention comprises a pre-step of heating a following reactive hot-melt adhesive to melt it and providing the melted adhesive on a joining surface of at least one adherend, an ultraviolet treating step of irradiating the adhesive with ultraviolet light having irradiation energy more than 100 mJ/cm2 and less than 1200 mJ/cm2 to polymerize a polyurethane prepolymer, and a joining step of overlaying a joining surface of another adherend on the adhesive to bond both adherends together. The reactive hot-melt adhesive contains a polyurethane prepolymer having an (meth)acryloyl group and an isocyanate group at the end of a molecule, and a photopolymerization initiator. The polyurethane prepolymer includes a non-crystalline polyol and a crystalline polyol, wherein the non-crystalline polyol is contained from 20% by mass to 90% by mass with respect to the whole polyols. The viscosity of the reactive hot-melt adhesive at 80° C. is 300 Pa·s or less.Type: ApplicationFiled: January 29, 2008Publication date: February 18, 2010Applicants: ASICS CORPORATION, HITACHI KASEI POLYMER CO., LTD.Inventors: Kenichi Harano, Tatsuya Amano, Hisao Matsumiya
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Publication number: 20080229622Abstract: There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at ?10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan ? [?20° C. to 40° C.] at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan ? [?20° C.]/tan ? [40° C.] at a frequency of 10 Hz is 0.7 to 1.3.Type: ApplicationFiled: May 10, 2006Publication date: September 25, 2008Inventors: Sadaki Mori, Katsuhiro Imazato, Kenichi Harano, Akiyuki Morikawa
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Patent number: 5943892Abstract: Electro-unite tubes having different plate thicknesses or different diameters are breakdown-formed without changing the upper rolls and the lower rolls of the breakdown pass rolls each time. Each of breakdown pass rolls 12 includes an upper roll 12a having a convex curved surface and a lower roll 12b opposed to the upper roll 12a, the lower roll 12b being provided with a V-shaped concave portion 13. A gap is maintained between a metal band plate 11 and the deepest portion D in the concave portion 13, and the metal band plate 11 is in local contact with the lower roll 12b. The upper roll 12a can be moved up and down, and the distance between the end of the curved surface of the upper roll 12a and the deepest portion D in the concave portion 13 is adjusted depending upon the plate thickness and the diameter of the electro-unite tube to determine the curvature (R.sub.1 or R.sub.2) for forming the metal band plate 11.Type: GrantFiled: August 12, 1998Date of Patent: August 31, 1999Assignee: Sanyo Seiki Co., Ltd.Inventors: Kiyomasa Hoshi, Kenichi Harano