Abstract: According to an embodiment, a cooling device for cooling a constituent element housed in a housing of a unit subjected to an influence of a generated magnetic field includes a water cooling mechanism and at least one air cooling mechanism. The water cooling mechanism cools the constituent element by cooling a cooling plate with a flow of water flowing through a pipe passing through the cooling plate arranged in the housing. The air cooling mechanism is arranged on an outgoing side where the flow of water flowing through the pipe is outgoing from the housing and cools the constituent element by discharging air in the housing along with the water flow in accordance with the water flow.

Abstract: The cylinder body is affected by a rotational operation of the first operation part in such a manner that a rotational position of the cylinder body is changed while an axial position of the cylinder body is not changed, and is affected by a rotational operation of the second operation part in such a manner that the axial position of the cylinder body is changed while the rotational position of the cylinder body is not changed. A communication amount between the cold water supply channel and the cold water inlet hole, a communication amount between the hot water supply channel and the hot water inlet hole, and/or a communication amount between the mixed water outlet hole and the mixed water outlet channel are/is changed depending on the axial position and the rotational position of the cylinder body in order to achieve both a temperature regulation and a flow rate regulation.

Abstract: A high-temperature part of the present disclosure includes: a high-temperature part body which includes a base and a coating layer formed on a part of a surface of the base; and a protective layer which is formed on at least a part of a surface of the coating layer. The protective layer is formed of a material which is allowed to disappear from a surface of the coating layer under an operation environment of a gas turbine.

Abstract: The cylinder body is affected by a rotational operation of the first operation part in such a manner that a rotational position of the cylinder body is changed while an axial position of the cylinder body is not changed, and is affected by a rotational operation of the second operation part in such a manner that the axial position of the cylinder body is changed while the rotational position of the cylinder body is not changed. A communication amount between the cold water supply channel and the cold water inlet hole, a communication amount between the hot water supply channel and the hot water inlet hole, and/or a communication amount between the mixed water outlet hole and the mixed water outlet channel are/is changed depending on the axial position and the rotational position of the cylinder body in order to achieve both a temperature regulation and a flow rate regulation.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a main valve body; a back pressure chamber; an inlet hole; an outlet hole; a pilot valve body for opening and closing an end of the outlet hole on a side of the back pressure chamber; an elongated member holding the pilot valve body; and a lifter rotatable and also movable in the axial direction of the elongated member by the rotation of the rotatable member. The lifter and the elongated member are integrally movable in the axial direction. The elongated member is connected to the lifter under a condition in which the elongated member is biased to the lifter in a one-way direction of the axial direction by a biasing-connecting member.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a rotatable member; a lifter linearly movable by a rotation of the rotatable member; a valve body linearly movable by a linear movement of the lifter; a stopper configured to restrict a movable range of the lifter in a fixed state of the stopper in which a position of the stopper is not able to be changed; and a stopper-holding member configured to hold the stopper selectively in the fixed state or in a provisional fixed state in which the position of the stopper is able to be changed.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a main valve body movably supported in the flow path via a diaphragm membrane; a back pressure chamber; a plurality of inlet holes communicating the upstream side of the flow path with the back pressure chamber; an outlet hole communicating a downstream side of the flow path with the back pressure chamber; and a pilot valve body for opening and closing the outlet hole, wherein moments acting on the main valve body based on the liquid flowing into the back pressure chamber through the plurality of inlet holes are canceled by each other in total, under a condition in which the pilot valve body opens the outlet hole.

Abstract: A faucet apparatus includes a rotating operation unit that rotationally operates water spouting and shutting off operations, and a flow adjustment operation and a temperature adjustment operation of hot and cold water, an acceleration sensor that detects an attitude and a rotating movement of the rotating operation unit, and a control unit. The rotating operation unit moves without striding across a horizontal plane at a time of performing a rotating operation from a first operation position to a second operation position around a predetermined rotation axis in the water spouting state. The acceleration sensor is set in a state where a rotation axis at a time of rotating within a predetermined plane in response to the flow adjustment operation and temperature adjustment operation of the hot and cold water does not coincide with a gravity direction axis.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: A faucet apparatus includes a rotating operation unit that rotationally operates water spouting and shutting off operations, and a flow adjustment operation and a temperature adjustment operation of hot and cold water, an acceleration sensor that detects an attitude and a rotating movement of the rotating operation unit, and a control unit. The rotating operation unit moves without striding across a horizontal plane at a time of performing a rotating operation from a first operation position to a second operation position around a predetermined rotation axis in the water spouting state. The acceleration sensor is set in a state where a rotation axis at a time of rotating within a predetermined plane in response to the flow adjustment operation and temperature adjustment operation of the hot and cold water does not coincide with a gravity direction axis.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a main valve body movably supported in the flow path via a diaphragm membrane; a back pressure chamber; a plurality of inlet holes communicating the upstream side of the flow path with the back pressure chamber; an outlet hole communicating a downstream side of the flow path with the back pressure chamber; and a pilot valve body for opening and closing the outlet hole, wherein moments acting on the main valve body based on the liquid flowing into the back pressure chamber through the plurality of inlet holes are canceled by each other in total, under a condition in which the pilot valve body opens the outlet hole.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a main valve body; a back pressure chamber; an inlet hole; an outlet hole; a pilot valve body for opening and closing an end of the outlet hole on a side of the back pressure chamber; an elongated member holding the pilot valve body; and a lifter rotatable and also movable in the axial direction of the elongated member by the rotation of the rotatable member. The lifter and the elongated member are integrally movable in the axial direction. The elongated member is connected to the lifter under a condition in which the elongated member is biased to the lifter in a one-way direction of the axial direction by a biasing-connecting member.

Abstract: The present invention is a flow-rate adjustable valve for adjusting a flow rate of liquid flowing through a flow path. The flow-rate adjustable valve includes: a rotatable member; a lifter linearly movable by a rotation of the rotatable member; a valve body linearly movable by a linear movement of the lifter; a stopper configured to restrict a movable range of the lifter in a fixed state of the stopper in which a position of the stopper is not able to be changed; and a stopper-holding member configured to hold the stopper selectively in the fixed state or in a provisional fixed state in which the position of the stopper is able to be changed.

Abstract: A cross shaft joint includes a cross shaft including four shaft parts, needle rollers rolling on outer peripheral faces of the shaft parts, bearing cups each having a cylindrical part, and a bottom part, and externally fitted to the shaft parts via the needle rollers, and yokes provided with bearing holes into which the bearing cups are inserted. The needle rollers are maintained in a tight fit state between the shaft parts and the bearing cups. Each cylindrical part is provided with a projected part projected radially inward of the cylindrical part in a curved shape, at an inner peripheral side thereof, and an apex of the projected part is in contact with the needle roller within a range in an axial direction of the needle roller, the range containing an axial center of the needle roller in the axial direction.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: A cross shaft joint includes a bearing cup, a cross shaft, and a joint yoke. The bearing cup includes a cylindrical portion in which an opening portion for receiving a shaft portion is formed in one end of the cylindrical portion in an axis direction, and a bottom portion that closes the other end of the cylindrical portion in the axis direction. The bearing cup is press-fitted into the fitting hole and supports the shaft portion through a rolling element so that the shaft portion is able to rotate. The bearing cup is fitted onto the shaft portion inside the fitting hole and holds the rolling element with the shaft portion. A diameter of an inner peripheral surface of the cylindrical portion is smaller on the opening portion side than the bottom portion side in a free state of the bearing cup before being press-fitted into the fitting hole.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.