Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: A cross shaft joint includes a cross shaft including four shaft parts, needle rollers rolling on outer peripheral faces of the shaft parts, bearing cups each having a cylindrical part, and a bottom part, and externally fitted to the shaft parts via the needle rollers, and yokes provided with bearing holes into which the bearing cups are inserted. The needle rollers are maintained in a tight fit state between the shaft parts and the bearing cups. Each cylindrical part is provided with a projected part projected radially inward of the cylindrical part in a curved shape, at an inner peripheral side thereof, and an apex of the projected part is in contact with the needle roller within a range in an axial direction of the needle roller, the range containing an axial center of the needle roller in the axial direction.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: A cross shaft joint includes a bearing cup, a cross shaft, and a joint yoke. The bearing cup includes a cylindrical portion in which an opening portion for receiving a shaft portion is formed in one end of the cylindrical portion in an axis direction, and a bottom portion that closes the other end of the cylindrical portion in the axis direction. The bearing cup is press-fitted into the fitting hole and supports the shaft portion through a rolling element so that the shaft portion is able to rotate. The bearing cup is fitted onto the shaft portion inside the fitting hole and holds the rolling element with the shaft portion. A diameter of an inner peripheral surface of the cylindrical portion is smaller on the opening portion side than the bottom portion side in a free state of the bearing cup before being press-fitted into the fitting hole.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: The conveyance apparatus includes: a swing arm whose distal end portion passes on a carrying-in/out position and a working position while being swung, which are provided on a circular trajectory in advance, a plurality of turn tables each of which is mounted on the corresponding distal end portion of the swing arm, the turn tables revolving along the circular trajectory and being rotatable on the axis thereof at the mounted position in the horizontal direction in a state that a workpiece is placed on the turn table, and a rotation locking mechanism that locks the rotation of the turn table on the axis except when the turn table is located at the working position.

Abstract: Provided are a program, a control method, and a control device by which an activation time can be shortened. In a computer system which is equipped with a Memory Management Unit (MMU), with respect to a table of the MMU, page table entries are rewritten so that page faults occur at each page necessary for operation of software. At the time of activating, stored memory images are read page by page for the page faults which occurred in the RAM to be accessed. By reading as described above, reading of unnecessary pages is not performed, and thus, the activation time can be shortened. The present invention can be applied to a personal computer and an electronic device provided with an embedded computer.

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract: Provided is a program, control method, and control device that can shorten start-up time. Page table entry is rewritten for a Memory Management Unit (MMU) table, on a computer system equipped with an MMU, so that a page fault will occur at every page, for all the pages necessary for the operation of a software program. Upon start-up, the stored memory image is loaded in page units for page faults that have occurred on the RAM to be accessed. Loading of unnecessary pages will not be executed, because such loading was executed, and the start-up time can be shortened worth that time. This program, control method, and control device can be applied to personal computers, and electronic devices equipped with built-in type computers.

Abstract: An object is to eliminate electric discharge due to static electricity generated by peeling when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element. A substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers. The film is bent along a curved surface of the pressurization roller on a side of the pressurization rollers, where the film is collected, and accordingly, peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: A drawn cup roller bearing includes: a drawn cup outer ring that includes a cylindrical portion serving as an outer raceway surface, a first rib which is formed at one axial end portion of the cylindrical portion and is bent radially inwardly such that a step portion is formed at an intermediate portion of the first rib, and a second rib which is formed at the other axial end portion of the cylindrical portion and is radially inwardly folded back; an annular seal which is press-fitted in the step portion; and a cage which holds a plurality of rollers and is inserted into the drawn cup outer ring from the second rib to be mounted in the drawn cup outer ring in such a manner that the cage is retained against withdrawal by the step portion and the plurality of rollers is retained against withdrawal by the second rib.

Abstract: An information-processing apparatus including an execution-state holding unit that stores an execution state of a program executed by a computer, an execution-state saving unit configured to store the execution state in effect upon execution of the program at a predetermined execution point of the program, a transfer-history holding unit that stores a transfer history, the transfer history based on how the execution state stored in the execution-state saving unit has been transferred to the execution-state holding unit, an access detection unit configured to detect whether the computer has accessed the execution state stored in the execution-state holding unit, and a necessary area transfer unit configured to transfer, based on the transfer history, an area of the execution state accessed by the computer from the execution-state saving unit to the execution-state holding unit when the accessed area has not been transferred from the execution-state saving unit to the execution-state holding unit.

Abstract: Disclosed herein is an information-processing apparatus which includes: a computer; an execution-state holding unit configured to hold an execution state of a program executed by the computer; and a return-point setting unit configured to set an execution point of the program, which is to be restored after activation of the information-processing apparatus, prior to the activation. The apparatus further includes an execution-state saving unit configured to save an execution state, which is held by the execution-state holding unit as a program execution state at an execution point set by the return-point setting unit as the execution point of the program to be restored after the activation, prior to the activation; and an execution-state transfer unit configured to transfer the execution state saved by the execution-state saving unit to the execution-state holding unit at an activation time.