Patents by Inventor Kenichi Higashi
Kenichi Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050121837Abstract: There is provided: (1) a thermoforming mold having a surface roughness (Ra) of not more than 0.1 ?m; (2) a thermoformed article comprising a crystalline olefin resin, which article has a surface roughness (Ra) of not more than 3 ?m; (3) a process for producing a thermoformed article, which comprises the steps of: (i) heating and softening a crystalline olefin resin to obtain a sheet thereof; and (ii) thermoforming the sheet with a thermoforming mold having a surface roughness (Ra) of not more than 0.1 ?m to obtain a thermoformed article having a surface roughness (Ra) of not more than 3am; (4) a laminated molding article, which comprises: (i) the above thermoformed article; and (ii) a substrate containing a crystalline olefin resin; and (5) a process for producing a laminated molding article.Type: ApplicationFiled: January 13, 2005Publication date: June 9, 2005Inventors: Tsuyoshi Kayanoki, Kenichi Higashi, Yoshiaki Togawa
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Patent number: 6846557Abstract: There are provided (I) a laminate comprising: (i) a resin layer (A), which comprises a layer containing a propylene resin (a), (ii) a resin layer (B), which comprises a layer containing an acrylic resin (b) having a flexural modulus of from 100 to 1500 MPa, and (iii) a resin layer (C), which comprises a layer containing an acrylic resin (c), wherein the resin layers (A), (B) and (C) are laminated in this order, (II) a structure comprising said laminate, and (III) a process for producing said structure.Type: GrantFiled: June 4, 2002Date of Patent: January 25, 2005Assignee: Sumitomo Chemical Company, LimitedInventors: Kenichi Higashi, Yousuke Tsukuda
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Patent number: 6818302Abstract: Disclosed is a laminate comprising at least: a resin layer (A) containing a propylene-based resin (a); a resin layer (B) containing a thermoplastic resin (b) with a tensile elongation at break of not less than 100%; and a resin layer (C) containing an acrylic resin (c), wherein the resin layer (A), the resin layer (B) and the resin layer (C) are disposed in layers in this order.Type: GrantFiled: September 4, 2002Date of Patent: November 16, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Kenichi Higashi, Yousuke Tsukuda
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Patent number: 6709734Abstract: Disclosed are a resin sheet that has a resin layer which is made up of a thermoplastic resin and which has a degree of orientation of not less than 0.0002 and not more than 0.0020, and a thermoformed article and laminate structure. The resin sheet is preferably employed in a thermoforming process. Particlarly favorable application of the resin sheet is a paintless film, which is usually thermoformed and then laminated to a molten resin.Type: GrantFiled: August 20, 2002Date of Patent: March 23, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Kenichi Higashi, Kouichi Yanase
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Publication number: 20040027743Abstract: A the present invention provides an electrostatic discharge protection element to be used in a semiconductor integrated circuit providing MOSFET, comprising a thyristor and a trigger diode for triggering the thyristor into an ON-state, wherein the trigger diode provides an n-type cathode high concentration impurity region, a p-type anode high concentration impurity region and a gate formed between the two high concentration impurity regions, the gate being composed of the same material as that of a gate of MOSFET forming the semiconductor integrated circuit, and the thyristor provided with a p-type high concentration impurity region that forms a cathode and an n-type high concentration impurity region that forms an anode, and the p-type high concentration impurity region provides in a p well and connected to a resistor and/or the n-type high concentration impurity region provided in an n well and connected to a resistor.Type: ApplicationFiled: June 11, 2003Publication date: February 12, 2004Applicant: Sharp Kabushiki KaishaInventors: Kenichi Higashi, Alberto O. Adan
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Publication number: 20030219584Abstract: Disclosed are a sheet which has a resin layer comprising a polyolefin resin with a degree of crystallinity of at least 45% wherein the resin layer has a total haze of up to 10% and wherein at least one surface of the sheet is the resin layer, a thermoformed article obtained by thermoforming the sheet, and a laminate structure comprising the sheet or thermoformed article and a substrate made of a thermoplastic resin, the substrate being laminated on the sheet or thermoformed article.Type: ApplicationFiled: March 3, 2003Publication date: November 27, 2003Applicant: Sumitomo Chemical Company, LimitedInventors: Kenichi Higashi, Koichi Yanase, Takashi Fujimoto
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Publication number: 20030105238Abstract: A polypropylene resin composition comprising 100 parts by weight of a polypropylene resin (A) having a die swell ratio of less than about 1.70 and about 0.01 to about 45 parts by weight of a polypropylene resin (B) having a die swell ratio of about 1.80 or more. A T die film is also provided, composing polypropylene wherein the film has a molecular weight distribution of about 4.2 or less and a die swell ratio of 1.28 or more. A method of producing a T die film is also provided, comprising the steps of melt-kneading polypropylene by an extruder, extruding the melted product through a die lip, and cool-solidifying the extruded material by a cooling roll to form a film. The film resulting by this method has a molecular weight distribution about of 4.2 or less and a die swell ratio of about 1.28 or more. Further, the present invention provides a laminated molded body comprising a heat molded body composed of a polypropylene resin composition containing 100 parts by weight of polypropylene resin (A), about 0.Type: ApplicationFiled: October 29, 2002Publication date: June 5, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kazunori Kanamori, Shigeki Kishiro, Kenichi Higashi, Koichi Yanase
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Publication number: 20030072958Abstract: Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or &agr;-olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below:Type: ApplicationFiled: September 26, 2002Publication date: April 17, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kenichi Higashi, Nobuo Oi
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Publication number: 20030072956Abstract: Disclosed is a laminate comprising at least:Type: ApplicationFiled: September 4, 2002Publication date: April 17, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kenichi Higashi, Yousuke Tsukuda
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Publication number: 20030054187Abstract: There are provided (I) a laminate comprising:Type: ApplicationFiled: June 4, 2002Publication date: March 20, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kenichi Higashi, Yousuke Tsukuda
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Publication number: 20030044627Abstract: Disclosed are a resin sheet that has a resin layer which is made up of a thermoplastic resin and which has a degree of orientation of not less than 0.0002 and not more than 0.0020, and a thermoformed article and laminate structure. The resin sheet is preferably employed in a thermoforming process. Particlarly favorable application of the resin sheet is a paintless film, which is usually thermoformed and then laminated to a molten resin.Type: ApplicationFiled: August 20, 2002Publication date: March 6, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kenichi Higashi, Kouichi Yanase
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Patent number: 6462379Abstract: A SOI semiconductor device comprises: a SOI substrate in which a buried dielectric film and a surface semiconductor layer are laminated; at least one well formed in the surface semiconductor layer; and at least one transistor which is formed in the well and has a channel region and source/drain regions in the surface semiconductor layer, wherein the well is completely isolated in the surface semiconductor layer and has a well-contact for applying a bias voltage to the well, the transistor is isolated by a device isolation film formed in a surface of the surface semiconductor layer, the channel region is partially depleted, and the surface semiconductor layer under the source/drain regions is fully depleted.Type: GrantFiled: May 14, 1999Date of Patent: October 8, 2002Assignee: Sharp Kabushiki KaishaInventors: Kenichi Higashi, Alberto Oscar Adan
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Patent number: 6381526Abstract: A torque detection apparatus includes a torque sensor, a sensor circuit, a signal processing circuit, and an abnormal state monitoring circuit. The torque sensor is arranged on a rotary shaft and operates to output a predetermined electric signal related to a torque applied to the rotary shaft. The sensor circuit outputs the predetermined electric signal as a sensor circuit signal. The signal processing circuit processes the sensor circuit signal in order to output a torque detection signal. The abnormal state monitoring circuit is arranged proximate the signal processing circuit and operates according to the sensor circuit signal to detect an abnormal operation.Type: GrantFiled: August 10, 2000Date of Patent: April 30, 2002Assignee: Suzuki Motor CorporationInventors: Kenichi Higashi, Takahiro Suzuki, Yoshiyuki Ideno
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Publication number: 20020032283Abstract: A polypropylene resin composition comprising 100 parts by weight of a polypropylene resin (A) having a die swell ratio of less than about 1.70 and about 0.01 to about 45 parts by weight of a polypropylene resin (B) having a die swell ratio of about 1.80 or more. A T die film is also provided, composing polypropylene wherein the film has a molecular weight distribution of about 4.2 or less and a die swell ratio of 1.28 or more. A method of producing a T die film is also provided, comprising the steps of melt-kneading polypropylene by an extruder, extruding the melted product through a die lip, and cool-solidifying the extruded material by a cooling roll to form a film. The film resulting by this method has a molecular weight distribution about of 4.2 or less and a die swell ratio of about 1.28 or more. Further, the present invention provides a laminated molded body comprising a heat molded body composed of a polypropylene resin composition containing 100 parts by weight of polypropylene resin (A), about 0.Type: ApplicationFiled: June 28, 2001Publication date: March 14, 2002Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kazunori Kanamori, Shigeki Kishiro, Kenichi Higashi, Koichi Yanase
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Publication number: 20020022912Abstract: To provide a middle point potential adjusting method for a power steering system capable of precisely equalizing a middle point potential output from a steering force detecting torque sensor to a value of a middle point potential recognized by a power steering controller. A steering force detecting torque sensor 1 is connected to a power steering controller 28 by assembling the steering force detecting torque sensor 1 in a steering force transmission path of an automobile, and a middle point potential adjusting circuit 13 is adjusted so that a torque detection signal Ts which is output from the middle point potential adjusting circuit 13 in a condition where an external force exerted to a steering handle 18 is removed is a potential C to be recognized as a middle point potential by the power steering controller 28.Type: ApplicationFiled: April 13, 2001Publication date: February 21, 2002Applicant: Suzuki Motor CorporatiomInventors: Hiroshi Urabe, Kenichi Higashi
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Publication number: 20010052613Abstract: A SOI semiconductor device comprises: a SOI substrate in which a buried dielectric film and a surface semiconductor layer are laminated; at least one well formed in the surface semiconductor layer; and at least one transistor which is formed in the well and has a channel region and source/drain regions in the surface semiconductor layer, wherein the well is completely isolated in the surface semiconductor layer and has a well-contact for applying a bias voltage to the well, the transistor is isolated by a device isolation film formed in a surface of the surface semiconductor layer, the channel region is partially depleted, and the surface semiconductor layer under the source/drain regions is fully depleted.Type: ApplicationFiled: May 14, 1999Publication date: December 20, 2001Inventors: KENICHI HIGASHI, ALBERTO OSCAR ADAN
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Publication number: 20010053454Abstract: There are disclosed:Type: ApplicationFiled: April 26, 2001Publication date: December 20, 2001Inventors: Kenichi Higashi, Yousuke Tsukuda
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Publication number: 20010026867Abstract: There Is provided: (1) a thermoforming mold having a surface roughness (Ra) of not more than 0.Type: ApplicationFiled: December 20, 2000Publication date: October 4, 2001Inventors: Tsuyoshi Kayanoki, Kenichi Higashi, Yoshiaki Togawa
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Patent number: 6169144Abstract: There is disclosed: an injection-molded product containing a propylene based resin composition having a melt viscosity of not more than about 32 Pa·s measured at a shear rate of 2,432 s−1 and at a temperature of 240° C. and a swelling ratio of from about 1.3 to 2.0 measured at a shear rate of 2,432 s−1 and at a temperature of 240° C., which composition comprises: (i) about 50 to 70% by weight of a propylene based resin; (ii) about 15 to 30% by weight of a thermoplastic elastomer; and (iii) about 10 to 30% by weight of an inorganic filler.Type: GrantFiled: June 16, 1999Date of Patent: January 2, 2001Assignee: Sumitomo Chemical Company, LimitedInventors: Kenichi Higashi, Masao Toyoda, Susumu Kanzaki
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Patent number: 5830402Abstract: A multilayer molded article comprising a skin and a substrate consisting of a polypropylene resin composition having a crystallization rate of 45 second or less, said skin being integrally adhered to the substrate. Said multilayer molded article can be produced by feeding a skin material and a molten polypropylene resin composition having a crystallization rate of 45 second or less between a pair of upper and lower molds, molding the molten polypropylene resin composition in the molds with simultaneous adhering of the skin material to the surface of the molded resin composition and then cooling the molten resin composition to solidify the same. Said multilayer molded article has a small deformation degree without the soft feeling of the skin material being impaired.Type: GrantFiled: June 17, 1996Date of Patent: November 3, 1998Assignee: Sumitomo Chemical Company, LimitedInventors: Hiroyuki Harada, Kenichi Higashi, Masahito Matsumoto, Nobuhiro Usui