Abstract: A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.

Abstract: Color lights from image projecting sections (207) that enlarge and project images of red, green and blue, respectively, are made incident on a transparent screen at different angles of incidence, so that image synthesis is carried out. The color lights projected are converted into telecentric light by a Fresnel lens (211), and after principal rays of the respective color lights are converted into substantially parallel rays by a color shading eliminating means (219) provided with lenticular lenses on both sides thereof, the rays are incident on a light diffusing means (224). The light diffusing means (224) is formed with a transparent substrate sheet and a plurality of transparent micro beads made to adhere onto a light-incident surface of the substrate sheet with an opaque adhesive. Image light passes through light transmitting portions between the substrate sheet and the micro beads to be diffused.

Abstract: A disk apparatus for reproducing in a preliminary determined order digital video data recorded in a plurality of areas of an optical disk at different positions with respect to the radial position of the optical disk in a reproduction mode by an optical head. The reproduced video data is stored in a buffer memory and encoded by an MPEG decoder. The amount of digital video data corresponding to the access time for accessing the recording areas of the optical disk are reproduced from the optical disk at a speed higher than the bit rate at which the video data is input or output and stored in the buffer memory. The digital video data are continuously read out and reproduced from the buffer memory when the optical head is in the recording areas and accesses between the recording areas.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.

Abstract: The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

Abstract: A rear-projection screen 3, including at least a lenticular lens sheet 32 and a Fresnel lens sheet 31, is configured so that the lenticular lens sheet 32 contains, in a base material thereof made of a resin, light diffusing microparticles made of a resin having a refractive index different from a refractive index of the base material, and the light diffusing microparticles satisfy 0.5 &mgr;m≦&Dgr;N1×d1≦0.9 &mgr;m, where &Dgr;N1 represents a difference between a refractive index of the light diffusing microparticles and a refractive index of the base material of the lenticular lens sheet, and d1 represents an average particle diameter of the light diffusing microparticles. With this, a rear-projection screen with small wavelength dependency of diffusion characteristics can be provided utilizing only resins with general properties.

Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.

Abstract: A rear-projection screen 3, including at least a lenticular lens sheet 32 and a Fresnel lens sheet 31, is configured so that the lenticular lens sheet 32 contains, in a base material thereof made of a resin, light diffusing microparticles made of a resin having a refractive index different from a refractive index of the base material, and the light diffusing microparticles satisfy 0.5 &mgr;m≦&Dgr;N1×d1≦0.9 &mgr;m, where &Dgr;N1 represents a difference between a refractive index of the light diffusing microparticles and a refractive index of the base material of the lenticular lens sheet, and d1 represents an average particle diameter of the light diffusing microparticles. With this, a rear-projection screen with small wavelength dependency of diffusion characteristics can be provided utilizing only resins with general properties.

Abstract: Perfluoroisopropylbenzene derivatives of the general formula (I) or salts thereof, useful as intermediates or raw materials in the synthesis of various industrial materials including agricultural chemicals, drugs and surfactants, wherein X1 is H, halogeno, formyl, optionally halogenated C1-6 alkyl, —C(═O)—R1 (wherein R1 is H, halogeno, hydroxyl, C1-6 alkyl, or NR2R3, with R2 and R3 being each H, C1-6 alkyl, or the like), or the like; X3 is H, halogeno, hydroxyl, cyano, isocyanato, hydrazino, diazo, —C(═O)—R1, —SO2—R4 (wherein R4 is halogeno, hydroxyl, C1-6 alkyl, or NR5R6, with R5 and R6 being each H or C1-6 alkyl), or the like; and X4 is H, halogeno, C1-6 alkyl, or C1-6 alkoxy, with publicly known compounds being excepted.

Abstract: Upon providing information from an information center (1) to the user of a navigation apparatus (2) connected via a wireless/wired communication line, the user sets a category used to specify contents that he or she wants to receive, and a service timing of the contents to the user of the navigation apparatus (2) in advance. The information center (1) provides contents, which are extracted from many unspecified contents provided from a contents service center (6) and satisfy the category, to the navigation apparatus (2). The navigation apparatus (2) provides the acquired contents to the user in accordance with the service timing.

Abstract: A metal foil-based layered product which can eliminate the problems caused by etchant infiltration, can be produced easily, and is sufficiently effective in reducing the permittivity of the whole insulating layer; and a process for producing the same. The process for producing the metal foil-based layered product includes the steps of: forming on a metal foil an undercoat film layer made of a poly(amic acid) which has been imidized at least partly; forming a porous precursor layer on the undercoat film layer by a wet film-forming method using a solution containing a poly(amic acid); and imidizing at least the porous precursor layer.

Abstract: A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.

Abstract: A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.

Abstract: The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a metal layer or an insulating layer, provisionally bonding a porous layer having a releasing film attached thereto onto a surface of the bonding layer, peeling the releasing film from the porous layer, laminating a metal foil on the porous layer obtained after the peeling, and heating and pressurizing the laminated product to transfer the bonding layer to the metal foil and thereby integrating them. Furthermore, the present invention provides a method of manufacturing a wiring board comprising the steps of manufacturing a metal foil laminated product by the above manufacturing methods, and providing a pattern on the metal foil of the metal foil laminated product, thereby forming a wiring layer.

Abstract: The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.

Abstract: The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product. The present invention provides a composite sheet for manufacturing a wiring board which is laminated on a wiring layer having a wiring pattern formed on an insulating layer and is thus used, wherein an adherent sheet containing a thermosetting resin is adhered to a porous film or at least a part thereof is impregnated therein.

Abstract: Auxiliary deflection coils are connected to horizontal deflection coils. Each auxiliary deflection coil is disposed in the intermediate region between the inner peripheral end adjacent to a window and the outer peripheral end. Each horizontal deflection coil is dividable into three regions extending from its winding introductory part to its winding terminal part. A variable inductance coil is connected in parallel with the intermediate region to control the horizontal deflection current flowing across the horizontal deflection coil. The variable inductance coil has a cylindrical core installed in a hollow space of a bobbin and a coil connected in parallel with the auxiliary coil. A disc core is provided adjacent to the coil. The disc core has an end face larger in area than an end face of the cylindrical core.

Abstract: A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.