Patents by Inventor Kenichi Inoue

Kenichi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11009832
    Abstract: A pointer including a thick section formed on a pointer body in a manner to be thicker than a thickness of the pointer body, an accommodation section provided in the thick section in a manner to penetrate through a front and back of the thick section, and a luminous member provided in the accommodation section.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: May 18, 2021
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Kenichi Inoue, Masao Amano
  • Publication number: 20210115234
    Abstract: Provided is a propylene polymer composition capable of implementing a molded article containing excellent impact resistance. Provided is a propylene polymer composition containing components (A) to (C), satisfying all of requirements (1) to (5), (A) a propylene polymer containing 90 wt % or more of a propylene structural unit; (B) an ethylene-?-olefin copolymer or hydrogenated conjugated diene polymer containing more than 10 wt % and 99 wt % or less of an ethylene structural unit; (C) a propylene block copolymer or graft copolymer containing a propylene polymer segment and an ethylene-?-olefin copolymer segment or a hydrogenated conjugated diene polymer segment; (1) an intrinsic viscosity being 0.5 dl/g or more; (2) CXIS having a number average molecular weight of 40,000 or more; (3) a ratio of the number average molecular weight of CXIS to a number average molecular weight of CXS being 0.
    Type: Application
    Filed: July 2, 2019
    Publication date: April 22, 2021
    Inventors: Kenichi SENO, Yohei KASHIWAME, Kazuya INOUE
  • Patent number: 10984950
    Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: April 20, 2021
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Kenichi Inoue, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
  • Publication number: 20210078081
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Application
    Filed: November 2, 2020
    Publication date: March 18, 2021
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Patent number: 10943739
    Abstract: A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: March 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Ito, Akitoshi Yoshii, Kenichi Inoue, Yoshiki Satou
  • Publication number: 20210052194
    Abstract: A living body detection device includes a receiver that receives, from at least one non-contact sensor, a measurement result obtained by measuring a detection area with the at least one non-contact sensor, an extraction circuit that extracts a biological signal from the measurement result, a counting circuit that counts the number of living bodies present in the detection area from the biological signal, and an acquisition circuit that acquires a prescribed number of living bodies to be present in the detection area, and a verification circuit that verifies whether the number of living bodies counted by the counting circuit is equal to the prescribed number and outputs a result of verification.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Inventor: KENICHI INOUE
  • Publication number: 20210046549
    Abstract: Provided is a soft magnetic powder capable of forming a powder magnetic core having a high magnetic permeability with a decreased oxygen content even when the particle size is small. There is provided a soft magnetic powder including Fe alloy containing Si which is a soft magnetic powder containing 0.1% to 15 mass % of Si, and having a product of D50 multiplied by [O] (D50×[O]) being 3.0 [?m·mass %] or less, wherein D50 represents a volume-based cumulative 50% particle size [?m] of the soft magnetic powder as measured by a laser diffraction particle size distribution analyzer, and [O] represents an oxygen content [mass %].
    Type: Application
    Filed: September 3, 2018
    Publication date: February 18, 2021
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
  • Patent number: 10870151
    Abstract: A sealing structure with a surface of a base material with a through-hole, an underlying metal film, and a sealing member bonded to the underlying metal film to seal the through-hole. The sealing member includes a compressed product of a metal powder including gold having a purity of 99.9% by mass or more and a lid-like metal film including a bulk-like metal including gold and having a thickness of not less than 0.01 ?m and not more than 5 ?m. The sealing material includes an outer periphery-side densified region in contact with an underlying metal film and a center-side porous region in contact with the through-hole. The shape of pores in the densified region is specified, and the horizontal length (l) of a pore in the radial direction at any cross-section of the densified region and the width (W) of the densified region satisfy the relationship of l?0.1W.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: December 22, 2020
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Ogashiwa, Yuya Sasaki, Masayuki Miyairi, Kenichi Inoue
  • Publication number: 20200388438
    Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
    Type: Application
    Filed: August 7, 2020
    Publication date: December 10, 2020
    Applicant: TDK CORPORATION
    Inventors: Norihisa ANDO, Kenichi INOUE, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
  • Publication number: 20200383611
    Abstract: A sleep position determination device according to an embodiment of the present disclosure is provided with a receiver that receives a measurement result obtained by measuring a subject using a contactless sensor, an extraction circuit that extracts a respiration signal of the subject from the measurement result, memory that stores reference information related to a level of the respiration signal, and a determination circuit that determines a sleep position of the subject on a basis of a comparison between the level of the respiration signal of the subject and the reference information.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Inventor: KENICHI INOUE
  • Patent number: 10858295
    Abstract: The present invention pertains to high-strength/high-ductility alloys, and in particular, provides high-strength composite particles comprising a ceramic phase and a metal phase, a composite powder, a method for manufacturing composite particles, and a method for manufacturing a composite member. Composite particles including a ceramic phase and a metal phase, wherein the composite particles are characterized in that the porosity is no greater than 45% in area ratio in cross-section, and the area ratio of the metal phase, where the total area of the ceramic phase and the metal phase is 100%, is at least 20%. A composite powder characterized in including a plurality of the composite particles.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: December 8, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Shuho Koseki, Tadashi Furuya, Daiki Shinno, Kenichi Inoue
  • Patent number: 10828702
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: November 10, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20200298316
    Abstract: The present invention discloses a coated cutting tool having a hard coating film on a surface of the tool. The hard coating film is a nitride, the content ratio of titanium (Ti) with respect to a total amount of metal elements (including semimetal elements) is in a range of 70 at % to 95 at %, the content ratio of silicon (Si) with respect to the total amount of metal elements (including semimetal elements) is in a range of 5 at % to 30 at %, and the content ratio of argon (Ar) with respect to the total amount of metal elements (including semimetal elements) and non-metal elements is 0.1 at % or less. The hard coating film has a NaCl type crystal structure and has an average crystal grain size in a range of 5 nm to 30 nm.
    Type: Application
    Filed: March 28, 2017
    Publication date: September 24, 2020
    Inventors: Tomoya Sasaki, Shuho Koseki, Kana Morishita, Saleh Abusuilik, Kenichi Inoue, Denis Kurapov, Wolfgang Kalss
  • Patent number: 10773311
    Abstract: An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m2/g) (oxygen content/BET specific surface area) is 0.90 wt. %·g/m2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 ?m or less.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: September 15, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kenichi Inoue, Atsushi Ebara, Masahiro Yoshida, Kyoso Masuda, Takahiro Yamada, Shinichi Uchiyama
  • Patent number: 10777353
    Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 15, 2020
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Kenichi Inoue, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
  • Publication number: 20200238388
    Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.
    Type: Application
    Filed: September 18, 2018
    Publication date: July 30, 2020
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Masahiro Yoshida, Kenichi Inoue
  • Publication number: 20200230701
    Abstract: A sealing structure with a surface of a base material with a through-hole, an underlying metal film, and a sealing member bonded to the underlying metal film to seal the through-hole. The sealing member includes a compressed product of a metal powder including gold having a purity of 99.9% by mass or more and a lid-like metal film including a bulk-like metal including gold and having a thickness of not less than 0.01 ?m and not more than 5 ?m. The sealing material includes an outer periphery-side densified region in contact with an underlying metal film and a center-side porous region in contact with the through-hole. The shape of pores in the densified region is specified, and the horizontal length (l) of a pore in the radial direction at any cross-section of the densified region and the width (W) of the densified region satisfy the relationship of l?0.1W.
    Type: Application
    Filed: April 4, 2018
    Publication date: July 23, 2020
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori OGASHIWA, Yuya SASAKI, Masayuki MIYAIRI, Kenichi INOUE
  • Publication number: 20200122236
    Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 23, 2020
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Patent number: 10626493
    Abstract: A method for producing a tool coated with a hard coating, the method including the following steps: applying a TiAIN coating layer onto a substrate with a first magnetron sputtering process and applying a TixSi1-xN coating layer onto the TiAIN layer with a second magnetron sputtering process, where x is smaller than or equal to 0.85 and preferably between and including 0.80 and 0.70 whereas the second magnetron sputtering process is performed with power densities greater than 100 W/cm2 and as such is a HIPIMS process.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: April 21, 2020
    Assignees: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON, HITACHI METALS, LTD., MITSUBISHI HITACHI TOOL ENGINEERING, LTD.
    Inventors: Denis Kurapov, Tomoya Sasaki, Shuho Koseki, Kana Morishita, Saleh Breik Abusuilik, Kenichi Inoue
  • Publication number: 20190371529
    Abstract: A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 5, 2019
    Applicant: TDK CORPORATION
    Inventors: Shinya ITO, Akitoshi YOSHII, Kenichi INOUE, Yoshiki SATOU