Abstract: The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

Abstract: A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area.

Abstract: A drain electrode (17) includes (i) a lower drain electrode (17a) stacked on a semiconductor layer (14) so as to partially cover an upper surface of the semiconductor layer (14) and (ii) an upper drain electrode (17b). The semiconductor layer (14), the lower drain electrode (17a), and the upper drain electrode (17b) form steps. In a step part where the steps are formed, a distance between a periphery of the lower drain electrode (17a) and a periphery of the upper drain electrode (17b) is more than 0.4 ?m but less than 1.5 ?m.

Abstract: The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

Abstract: Disposed on an insulating substrate (10a) are a plurality of TFTs arranged in a matrix, each including a drain electrode (18b) in which a first conductive layer (16b) and a second conductive layer (17bb) are laminated in this order; an interlayer insulating film (21) deposited on each of the TFTs, in which a plurality of contact holes (21a) reaching to the respective drain electrodes (18b) are formed; and a plurality of pixel electrodes (22a) disposed on the interlayer insulating film (21) in a matrix, each connected to a corresponding drain electrode (18b) via a corresponding contact hole (21a), being susceptible to an electric corrosion reaction with the second conductive layer (17bb). At a side of the drain electrode, which is connected to the pixel electrode (22a), a top surface of the first conductive layer (16b) is exposed from the second conductive layer (17bb). The interlayer insulating film (21) is disposed to cover the second conductive layer (17bb).

Abstract: A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area.

Abstract: A connecting terminal has a configuration in which a plurality of parts of a first line (2) and respective corresponding plurality of parts of a second line (6) are connected to each other by a transparent conductive thin film (10). In a connecting terminal part, the plurality of parts of the first line (2) and the respective corresponding plurality of parts of the second line (6) are connected to each other in parallel. With the configuration, it is possible to greatly reduce a risk of disconnection. It is therefore possible to prevent disconnection from being caused by corrosion in the connecting terminal part of a display apparatus etc.

Abstract: The present invention is a substrate for use in a display panel. According to the substrate, lines (102, 106, 107, and 113) provided in a display region on the substrate are made up of multiple layers whose uppermost layers (102c, 106c, 107c, and 113c) are each made from (i) an oxide of first metal selected from the group consisting of copper, titanium, and molybdenum or (ii) a nitride of copper. This can prevent external light from being reflected and thereby improve a contrast in a bright room.