Patents by Inventor Kenichi Muramatsu
Kenichi Muramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7515248Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: GrantFiled: November 5, 2007Date of Patent: April 7, 2009Assignee: Nikon CorporationInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo
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Publication number: 20090008373Abstract: A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.Type: ApplicationFiled: November 16, 2006Publication date: January 8, 2009Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Kenichi Muramatsu, Takeshi Sakamoto
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Publication number: 20080239274Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: ApplicationFiled: June 2, 2008Publication date: October 2, 2008Applicant: NIKON CORPORATIONInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo
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Illumination optical system, exposure apparatus, and exposure method with polarized switching device
Patent number: 7423731Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: GrantFiled: May 31, 2005Date of Patent: September 9, 2008Assignee: Nikon CorporationInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo -
Publication number: 20080094602Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: ApplicationFiled: November 5, 2007Publication date: April 24, 2008Applicant: NIKON CORPORATIONInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo
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Publication number: 20080074632Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: ApplicationFiled: November 5, 2007Publication date: March 27, 2008Applicant: NIKON CORPORATIONInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo
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Publication number: 20070287267Abstract: A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at least one of the functional devices, can cut the laminate part with a high precision together with the substrate. In this laser processing method, modified regions differing from each other in terms of easiness to cause the substrate 4 to fracture are formed along respective lines to cut 5a to 5d. Therefore, when an expandable tape is attached to the rear face of a substrate 4 and expanded, an object to be processed 1 is cut stepwise into a plurality of chips. Such stepwise cutting allows uniform tensile stresses to act on respective parts extending along the lines to cut 5a to 5d, whereby interlayer insulating films on the lines to cut 5a to 5d are cut with a high precision together with the substrate 4.Type: ApplicationFiled: March 2, 2005Publication date: December 13, 2007Inventors: Takeshi Sakamoto, Kenichi Muramatsu
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Publication number: 20070125757Abstract: A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.Type: ApplicationFiled: March 12, 2003Publication date: June 7, 2007Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20060255024Abstract: A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.Type: ApplicationFiled: March 12, 2003Publication date: November 16, 2006Inventors: Fumitsufu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20060171138Abstract: An illuminating optical system capable of preventing a change in the polarized status of a linearly polarized light passing through a light transmitting member formed of a cubic-system crystal material such as fluorite. An illuminating optical system comprising a light source unit (1) for suppling a linearly polarized light to illuminate surfaces (M, W) to be illuminated with a light from the light source unit. The system is provided with a polarized status switching means (10, 20) disposed on a light path between the light source unit and the surfaces to be illuminated, for switching the polarized status of a light, that illuminates the surfaces to be illuminated, between a linearly polarized status and a non-linearly polarized status. The polarized status switching means has a phase member (10) for changing the polarization surface of an incident linearly polarized light as needed, and a depolarizer (20) for depolarizing an incident linearly polarized light as needed.Type: ApplicationFiled: June 29, 2004Publication date: August 3, 2006Inventors: Kenichi Muramatsu, Norio Komine, Osamu Tanitsu, Hirohisa Tanaka
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Publication number: 20060055834Abstract: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.Type: ApplicationFiled: May 31, 2005Publication date: March 16, 2006Applicant: NIKON CORPORATIONInventors: Osamu Tanitsu, Hirohisa Tanaka, Kenichi Muramatsu, Norio Komine, Hisashi Nishinaga, Tomoyuki Matsuyama, Takehito Kudo
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Publication number: 20060040473Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: October 17, 2005Publication date: February 23, 2006Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20050194364Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: April 15, 2005Publication date: September 8, 2005Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20050189330Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: April 15, 2005Publication date: September 1, 2005Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20050184037Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: April 15, 2005Publication date: August 25, 2005Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20050181581Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: April 15, 2005Publication date: August 18, 2005Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20050173387Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: April 8, 2005Publication date: August 11, 2005Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu
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Publication number: 20040237880Abstract: A method for manufacturing an optical member of a fluoride crystal includes: a growing step of growing an ingot of a fluoride crystal; a cutting-out step of cutting out from the ingot a cylindrical basic material with two parallel planes which have a certain crystal plane orientation; an orientation-determining step of determining a crystal orientation of a side surface of the cylindrical basic material; a birefringence-measuring step of measuring birefringence in a specific crystal axis direction at the side surface determined based on the crystal orientation determined in the orientation-determining step; and an evaluating step of evaluating the fluoride crystal on the basis of a result of measurement of the birefringence. A fluoride crystal is obtained in which a maximum value of birefringence in a specific crystal axis direction at a side surface is not more than 10 nm/cm at a measurement wavelength of 633 nm.Type: ApplicationFiled: September 30, 2003Publication date: December 2, 2004Applicant: Nikon CorporationInventors: Shigeru Sakuma, Kenichi Muramatsu, Kazuhiro Kido
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Patent number: 6726522Abstract: An object display method and apparatus is disclosed which can easily display changeover of an entity, and an amusement apparatus is disclosed which can display a simulated burst having reality and punch. The method and apparatus first displays only one of the objects and hides other objects from the field of view. Then, the method and apparatus displays the previously hidden objects and at the same time hides the previously displayed object.Type: GrantFiled: August 9, 2001Date of Patent: April 27, 2004Assignee: Namco, Ltd.Inventors: Kenichi Muramatsu, Yoh Kuno
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Publication number: 20040002199Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: ApplicationFiled: March 12, 2003Publication date: January 1, 2004Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu