Patents by Inventor Kenichi Murata
Kenichi Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953308Abstract: A light emitting element array includes: a light emitting element group that includes plural light emitting elements; and plural lenses that are provided, corresponding to the plural light emitting elements, on a light emitting surface side of the plural light emitting elements, and that deflects light emitted from the plural light emitting elements according to a positional relation with the plural light emitting elements. Distances between central axes of light emission of the plural light emitting elements and central axes of the plural lenses corresponding to the plural light emitting elements increase from a center side of the light emitting element group toward an end side of the light emitting element group, and a degree of change in the distances decreases from the center side of the light emitting element group toward the end side of the light emitting element group.Type: GrantFiled: July 27, 2020Date of Patent: April 9, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Shigetoshi Nakamura, Kenichi Ohno, Michiaki Murata, Tsutomu Ishii, Jiro Minabe
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Patent number: 11940868Abstract: An information analysis apparatus according to an embodiment includes an input unit that inputs information indicating an apparatus that is a fault occurrence location in a communication network and a factor of a fault, a storage unit that stores a restoration handling method rule in which the apparatus that is the fault occurrence location, the factor of the fault, and an appropriate restoration handling method for the fault are associated, and an analyzer that analyzes an appropriate restoration handling method for the apparatus and the factor indicated by the information that is input, based on information related to a past fault for the apparatus that is the fault occurrence location, or a condition inherent in the apparatus that is the fault occurrence location, from the restoration handling method rule.Type: GrantFiled: September 19, 2019Date of Patent: March 26, 2024Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Satoshi Suzuki, Haruhisa Nozue, Shunsuke Kanai, Fumika Asai, Naomi Murata, Kenichi Tayama
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Patent number: 11929589Abstract: A light-emitting component includes: a substrate; plural light-emitting elements that are disposed on the substrate and that emit light in a direction intersecting with a surface of the substrate; and plural thyristors that are stacked on the plural light-emitting elements and that are turned ON to drive the corresponding light-emitting elements so that the light-emitting elements emit light or an amount of light emitted from the light-emitting elements is increased. Each of the plural light-emitting elements includes a current confinement region which is oxidized via a hole provided in a multilayer structure. The multilayer structure is constituted by a corresponding light-emitting element and a corresponding thyristor.Type: GrantFiled: December 20, 2020Date of Patent: March 12, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Takashi Kondo, Michiaki Murata, Kenichi Ono, Masahiro Yoshikawa, Takehito Hikichi, Yuji Shirai
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Publication number: 20240077553Abstract: According to an embodiment, a cooling device for cooling a constituent element housed in a housing of a unit subjected to an influence of a generated magnetic field includes a water cooling mechanism and at least one air cooling mechanism. The water cooling mechanism cools the constituent element by cooling a cooling plate with a flow of water flowing through a pipe passing through the cooling plate arranged in the housing. The air cooling mechanism is arranged on an outgoing side where the flow of water flowing through the pipe is outgoing from the housing and cools the constituent element by discharging air in the housing along with the water flow in accordance with the water flow.Type: ApplicationFiled: August 14, 2023Publication date: March 7, 2024Applicant: CANON MEDICAL SYSTEMS CORPORATIONInventors: Yasunobu SHINDEN, Teruo HASHIMOTO, Toshikazu SHIMMEI, Shintaro INOUE, Kenichi MURATA, Hajime TANAKA
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Patent number: 11908497Abstract: A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.Type: GrantFiled: March 29, 2022Date of Patent: February 20, 2024Assignee: Western Digital Technologies, Inc.Inventors: Irizo Naniwa, Kenichi Murata
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Publication number: 20240053447Abstract: A highly functional photoelectric conversion element is provided.Type: ApplicationFiled: December 3, 2021Publication date: February 15, 2024Inventors: Tomohiro OHKUBO, Hitoshi TSUNO, Hideaki TOGASHI, Masayuki KURITA, Syuto TAMURA, Tetsuro TAKADA, Nobuhiro KAWAI, Tomoki HIRAMATSU, Masahiro JOEI, Kenichi MURATA, Hideki TSUJIAI
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Publication number: 20240055465Abstract: A highly functional photoelectric conversion element is provided.Type: ApplicationFiled: December 14, 2021Publication date: February 15, 2024Inventors: Kenichi MURATA, Masahiro JOEI, Shintarou HIRATA, Shingo TAKAHASHI, Yoshiyuki OHBA, Takashi KOJIMA, Tomiyuki YUKAWA, Yoshifumi ZAIZEN, Tomohiro SUGIYAMA, Masaki OKAMOTO, Takuya MASUNAGA, Yuki KAWAHARA
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Patent number: 11888012Abstract: Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film.Type: GrantFiled: July 25, 2019Date of Patent: January 30, 2024Assignees: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Kenichi Murata, Masahiro Joei, Fumihiko Koga, Iwao Yagi, Shintarou Hirata, Hideaki Togashi, Yosuke Saito, Shingo Takahashi
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Publication number: 20240031703Abstract: Provided is a light detection apparatus with high functionality. The light detection apparatus includes an effective region provided with a photoelectric converter that detects irradiation light and performs photoelectric conversion, and a peripheral region provided adjacent to the effective region. The photoelectric converter has a stacked structure including a first photoelectric conversion unit, a second photoelectric conversion unit, and a first optical filter. The first photoelectric conversion unit detects light in a first wavelength range of the irradiation light and performs photoelectric conversion. The second photoelectric conversion unit is provided so as to overlap with the first photoelectric conversion unit, detects light in a second wavelength range of the irradiation light, and performs photoelectric conversion.Type: ApplicationFiled: October 20, 2021Publication date: January 25, 2024Inventors: HIDEKI TSUJIAI, TOSHIHIKO HAYASHI, KENICHI MURATA, AKIKO HIRATA
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Publication number: 20240032316Abstract: Light reduction in a wiring part connected to an optical device of an electronic device including the optical device is prevented. The electronic device includes an insulating layer, an interlayer connection wiring, and an upper layer wiring. The insulating layer is disposed adjacent to the lower layer wiring and includes a through hole. The interlayer connection wiring is a transparent wiring that is connected to the lower layer wiring in the through hole and is formed into a shape extending to a surface side of the insulating layer. The upper layer wiring is a transparent wiring that is stacked and connected to the interlayer connection wiring extending to the surface side of the insulating layer.Type: ApplicationFiled: December 8, 2021Publication date: January 25, 2024Inventors: HITOSHI TSUNO, HIDEAKI TOGASHI, TOMOHIRO OHKUBO, MASAYUKI KURITA, SYUTO TAMURA, NOBUHIRO KAWAI, TOMOKI HIRAMATSU, MASAHIRO JOEI, KENICHI MURATA, HIDEKI TSUJIAI, TETSURO TAKADA
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Patent number: 11867407Abstract: A range hood for collecting oil scattered from a rotating disk filter, capable of improving the cleaning workability is provided. The range hood includes a fan configured to generate an air flow, a disk filter provided on a flow path of the air flow and having a slit, a motor configured to rotate the disk filter, a rectifying plate provided upstream of the disk filter on the flow path of the air flow, and a disk cover configured to surround an outer periphery portion of the disc filter and having an outlet portion that allows oil from the disk filter to flow out to a predetermined portion of the rectifying plate.Type: GrantFiled: July 30, 2021Date of Patent: January 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Kiyoshi Iwamoto, Kazutoshi Takenoshita, Kenichi Murata, Yurika Kida
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Publication number: 20240006426Abstract: A highly functional photoelectric conversion element is provided. The photoelectric conversion element includes: a first photoelectric converter that detects light in a first wavelength range and photoelectrically converts the light; a second photoelectric converter that detects light in a second wavelength range and photoelectrically converts the light to obtain distance information of a subject; and an optical filter that is disposed between the first photoelectric converter and the second photoelectric converter, and allows the light in the second wavelength range to pass therethrough more easily than the light in the first wavelength range. The first photoelectric converter includes a stacked structure and an electric charge accumulation electrode.Type: ApplicationFiled: September 19, 2023Publication date: January 4, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Hideaki TOGASHI, Tetsuji YAMAGUCHI, Nobuhiro KAWAI, Koji SEKIGUCHI, Masahiro JOEI, Kenichi MURATA, Shintarou HIRATA, Yuta HASEGAWA, Yoshito NAGASHIMA
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Patent number: 11817466Abstract: A highly functional photoelectric conversion element is provided. The photoelectric conversion element includes: a first photoelectric converter that detects light in a first wavelength range and photoelectrically converts the light; a second photoelectric converter that detects light in a second wavelength range and photoelectrically converts the light to obtain distance information of a subject; and an optical filter that is disposed between the first photoelectric converter and the second photoelectric converter, and allows the light in the second wavelength range to pass therethrough more easily than the light in the first wavelength range. The first photoelectric converter includes a stacked structure and an electric charge accumulation electrode.Type: GrantFiled: June 17, 2020Date of Patent: November 14, 2023Assignee: Sony Semiconductor Solutions CorporationInventors: Hideaki Togashi, Tetsuji Yamaguchi, Nobuhiro Kawai, Koji Sekiguchi, Masahiro Joei, Kenichi Murata, Shintarou Hirata, Yuta Hasegawa, Yoshito Nagashima
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Publication number: 20230345742Abstract: To provide a solid-state imaging element capable of further improving reliability. Provided is a solid-state imaging element including at least a first photoelectric conversion section, and a semiconductor substrate in which a second photoelectric conversion section is formed, in this order from a light incidence side, in which the first photoelectric conversion section includes at least a first electrode, a photoelectric conversion layer, a first oxide semiconductor layer, a second oxide semiconductor layer, and a second electrode in this order, and a film density of the first oxide semiconductor layer is higher than a film density of the second oxide semiconductor layer.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Toshihiko HAYASHI, Masahiro JOEI, Kenichi MURATA, Shintarou HIRATA
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Patent number: 11780022Abstract: A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.Type: GrantFiled: June 25, 2020Date of Patent: October 10, 2023Assignee: Western Digital Technologies, Inc.Inventors: Yusuke Matsumoto, Kenichi Murata
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Publication number: 20230317105Abstract: A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.Type: ApplicationFiled: March 29, 2022Publication date: October 5, 2023Inventors: Irizo Naniwa, Kenichi Murata
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Patent number: 11778840Abstract: To provide a solid-state imaging element capable of further improving reliability. Provided is a solid-state imaging element including at least a first photoelectric conversion section, and a semiconductor substrate in which a second photoelectric conversion section is formed, in this order from a light incidence side, in which the first photoelectric conversion section includes at least a first electrode, a photoelectric conversion layer, a first oxide semiconductor layer, a second oxide semiconductor layer, and a second electrode in this order, and a film density of the first oxide semiconductor layer is higher than a film density of the second oxide semiconductor layer.Type: GrantFiled: August 31, 2022Date of Patent: October 3, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Toshihiko Hayashi, Masahiro Joei, Kenichi Murata, Shintarou Hirata
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Patent number: 11778841Abstract: To provide a photoelectric conversion element that can improve image quality. Provided is a photoelectric conversion element (100) including at least a first electrode (101), a work function control layer (108), a photoelectric conversion layer (102), an oxide semiconductor layer (104), and a second electrode (107) in this order, and further including a third electrode (105), in which the third electrode (105) is provided apart from the second electrode (107) and is provided facing the photoelectric conversion layer (102) via an insulating layer (106), and the work function control layer (108) contains a larger amount of oxygen than an amount of oxygen satisfying a stoichiometric composition.Type: GrantFiled: July 30, 2019Date of Patent: October 3, 2023Assignees: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shintarou Hirata, Masahiro Joei, Kenichi Murata, Masashi Bando, Yosuke Saito, Ryosuke Suzuki
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Publication number: 20230269953Abstract: An image pickup element includes a photoelectric conversion section including a first electrode, a photoelectric conversion layer including an organic material, and a second electrode stacked on one another. Between the first electrode and the photoelectric conversion layer, an oxide semiconductor layer and an oxide film are formed from the first electrode side.Type: ApplicationFiled: March 17, 2023Publication date: August 24, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masahiro JOEI, Kenichi MURATA, Shintarou HIRATA, Toshihiko HAYASHI
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Publication number: 20230215880Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode; a third electrode; a photoelectric conversion layer; and a semiconductor layer. The first electrode and the second electrode are disposed in parallel. The third electrode is disposed to be opposed to the first electrode and the second electrode. The photoelectric conversion layer is provided between the first electrode and second electrode and the third electrode. The semiconductor layer is provided between the first electrode and second electrode and the photoelectric conversion layer. The semiconductor layer has a first layer and a second layer stacked therein in order from the photoelectric conversion layer side. The second layer has an energy level at a lowest edge of a conduction band that is shallower than an energy level of the first layer at a lowest edge of a conduction band.Type: ApplicationFiled: March 24, 2021Publication date: July 6, 2023Inventors: Masahiro JOEI, Shintarou HIRATA, Tomiyuki YUKAWA, Ryosuke SUZUKI, Hiroshi NAKANO, Toshihiko HAYASHI, Ryotaro TAKAGUCHI, Iwao YAGI, Kenichi MURATA