Patents by Inventor Kenichi Sato

Kenichi Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11549408
    Abstract: Provided is a valve seat insert for an internal combustion engine, which has both an excellent heat dissipation property and excellent wear resistance. The valve seat insert for an internal combustion engine is used while being press-fitted into an aluminum alloy cylinder head, is made of an iron-based sintered alloy, is formed by integrating two layers of a functional member side layer and a supporting member side layer, and has a plating film on at least an outer peripheral side. The plating film is preferably a copper plating film. The plating film is a plating film having a thickness of 1 to 100 ?m and a hardness of 50 to 300 HV, and the hardness of the plating film is adjusted so as to satisfy a range of 1.05 to 4.5 times hardness of the cylinder head in Vickers hardness HV. Pores contained in the valve seat insert are preferably sealed with a curable resin before plating treatment.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 10, 2023
    Assignee: NIPPON PISTON RING CO., LTD.
    Inventors: Ayato Oikawa, Kiyoshi Suwa, Katsuaki Ogawa, Hiroshi Oshige, Kenichi Sato
  • Patent number: 11413908
    Abstract: A pneumatic tire has a side portion located between a tread portion and a bead portion which includes a decorative element. The decorative element comprises protrusions extending along the side portion and bending to form a hook. The protrusions are disposed at intervals with tips of the hooks aligned in the same direction. Each of the protrusions includes a first and second portions. The first portion extends from an inner side in the radial direction to an outer side in the radial direction. The second portion extends from a bend position of each one of the protrusions and forms an angle of 90° or greater with the first portion at the bend position. Each bend position mutually differs in position in the radial direction between the protrusions, and the interval between adjacent protrusions is wider at the second portion than at the first portion.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 16, 2022
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Kenichi Sato
  • Publication number: 20220253141
    Abstract: Provided is a vibration device that is connected to an information processing apparatus and includes a vibration mechanism that generates a vibration. The vibration device receives a first vibration command for the vibration device from the information processing apparatus, receives a second vibration command for a different type of vibration device from the information processing apparatus in parallel with the first vibration command, and operates the vibration mechanism on the basis of at least one of the first vibration command and the second vibration command. The second vibration command is in a format different from that of the first vibration command. The different type of vibration device is of a type different from that of the vibration device.
    Type: Application
    Filed: June 16, 2020
    Publication date: August 11, 2022
    Inventors: Takashi ENOKIHARA, Takuro SAWADA, Masatoshi NAKAE, Shinya MIKAMI, Kenichi SATO, Yoshiyuki IMADA
  • Publication number: 20220214376
    Abstract: A contact probe capable of being used for an inspection of a semiconductor package in which a recess is formed in a terminal portion includes a plunger including a distal end portion that comes into contact with the terminal portion. The distal end portion includes a protruding portion protruding toward the terminal portion and a shoulder portion having a protruding height toward the terminal portion lower than that of the protruding portion.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 7, 2022
    Applicant: YOKOWO CO., LTD.
    Inventor: Kenichi SATO
  • Patent number: 11289614
    Abstract: A photoelectric conversion element includes: a plurality of pixels that are formed on a common semiconductor substrate and each of which includes an avalanche photodiode; a first line that is formed on the semiconductor substrate, is electrically connected to two or more first pixels included in the plurality of pixels, and collectively extracts output currents from the two or more first pixels; and a second line that is formed on the semiconductor substrate, is electrically connected to two or more second pixels included in the plurality of pixels, and collectively extracts output currents from the two or more second pixels. A light receiving area of each first pixel is larger than a light receiving area of each second pixel.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: March 29, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Koei Yamamoto, Shigeyuki Nakamura, Terumasa Nagano, Kenichi Sato
  • Patent number: 11278967
    Abstract: A surface-coated cutting tool has a hard coating layer including an upper layer ?, an adhesion layer ?, and a lower layer ?. The upper layer ? is formed of an ?-Al2O3 layer formed under low temperature conditions. The adhesion layer ? includes a TiCN layer having a thickness of 0.5 ?m or more in an outermost layer and contains 0.5 to 3 ?m to a maximum depth of 0.5 ?m toward the inside in a layer thickness direction of the TiCN layer from the interface between the TiCN layer and the upper layer ?. The lower layer ? is formed of (Ti1-XAlX)(CYN1-Y) of a single phase of a NaCl type face-centered cubic structure, in which an average content ratio Xavg of Al and an average content ratio Yavg of C in this composition formula satisfy 0.60?Xavg?0.95 and 0?Yavg?0.005.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: March 22, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kousuke Yanagisawa, Sho Tatsuoka, Kenichi Sato, Shin Nishida
  • Publication number: 20220082588
    Abstract: A plunger includes a conductive base layer, and a platinum group layer which is provided on the outside of the base layer and which contains a platinum group element as a main component. The plunger has the base layer as its base material, and has the platinum group layer on the outside of the base layer at the tip part to come into contact with an inspection object. A contact probe includes the plunger, and a spring which abuts on the plunger at an end part.
    Type: Application
    Filed: January 23, 2020
    Publication date: March 17, 2022
    Applicant: YOKOWO CO., LTD.
    Inventor: Kenichi SATO
  • Patent number: 11192591
    Abstract: A vehicle body structure in a vehicle rear portion includes a first rear lateral ring-shaped vehicle body framework (RWC1) extending in a vehicle lateral direction in a vehicle body rear portion (1R) from vicinities of a pair of left and right damper support portions (54) supporting suspension dampers (55) and disposed in rear wheelhouses (52) at vehicle rear of side door openings (Es) of the vehicle. The vehicle body structure also includes coupling members (33) coupling longitudinal ring-shaped vehicle body frameworks (SLC) each having a substantially ring shape in a vehicle longitudinal direction to the first rear lateral ring-shaped vehicle body framework (RWC1).
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: December 7, 2021
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Kenichi Sato, Masanori Fukuda, Shuichi Nakagami, Akihiro Kawano
  • Patent number: 11192594
    Abstract: There are provided first and second loop-shaped structure sections which are respectively provided to extend continuously along a lower wall part, right-and-left both side wall parts, and an upper wall part of a vehicle body so as to have a loop shape in a vehicle elevational view. The first loop-shaped structure section is positioned in front of a damper support section. A lower-side part of the second loop-shaped structure section which is located at a lower level than the damper support section is formed by a part of the first loop-shaped structure section and its upper-side part is positioned in back of the damper support section. Each of these loop-shaped structure sections is formed by a closed-cross section portion where a closed-cross section is partitioned by plural members and/or a thick plate portion having a thicker plate thickness than a vehicle-body panel.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: December 7, 2021
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Kazunori Ishimoto, Hideaki Hoshuyama, Yukitaka Takeshita, Kenichi Sato, Itsuki Gunji
  • Patent number: 11192596
    Abstract: A vehicle body structure in a vehicle rear portion includes a second rear lateral ring-shaped vehicle body framework (RWC2) having a substantially ring shape in a vehicle lateral direction and located near a pair of left and right damper support portions (54) supporting suspension dampers (55) and disposed in rear wheelhouses (52) behind side door openings (Es) in the vehicle. The vehicle body structure includes coupling members (33) coupling a pair of left and right side pillars (42) constituting the second rear lateral ring-shaped vehicle body framework (RWC2) having the substantially ring shape to a pair of left and right wheelhouse reinforcements (53).
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: December 7, 2021
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Kenichi Sato, Masanori Fukuda, Hiroshi Yamamoto, Kotaro Kataoka
  • Patent number: 11101315
    Abstract: Each semiconductor chip of a detector comprises a semiconductor substrate having a plurality of photodetector units, an insulating layer formed on a front face of the semiconductor substrate, a common electrode arranged on the insulating layer, a readout line for electrically connecting a quenching resistance of each photodetector unit and the common electrode to each other, and a through electrode extending from the common electrode to a rear face of the semiconductor substrate through a through hole of the semiconductor substrate.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: August 24, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshimaro Fujii, Terumasa Nagano, Kazuhisa Yamamura, Kenichi Sato, Ryutaro Tsuchiya
  • Publication number: 20210220919
    Abstract: A surface-coated cutting tool has a hard coating layer including an upper layer ?, an adhesion layer ?, and a lower layer ?. The upper layer ? is formed of an ?-Al2O3 layer formed under low temperature conditions. The adhesion layer ? includes a TiCN layer having a thickness of 0.5 ?m or more in an outermost layer and contains 0.5 to 3 ?m to a maximum depth of 0.5 ?m toward the inside in a layer thickness direction of the TiCN layer from the interface between the TiCN layer and the upper layer ?. The lower layer ? is formed of (Ti1-XAlX)(CYN1-Y) of a single phase of a NaCl type face-centered cubic structure, in which an average content ratio Xavg of Al and an average content ratio Yavg of C in this composition formula satisfy 0.60?Xavg?0.95 and 0?Yavg?0.005.
    Type: Application
    Filed: March 29, 2017
    Publication date: July 22, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kousuke YANAGISAWA, Sho TATSUOKA, Kenichi SATO, Shin NISHIDA
  • Publication number: 20210215071
    Abstract: Provided is a valve seat insert for an internal combustion engine, which has both an excellent heat dissipation property and excellent wear resistance. The valve seat insert for an internal combustion engine is used while being press-fitted into an aluminum alloy cylinder head, is made of an iron-based sintered alloy, is formed by integrating two layers of a functional member side layer and a supporting member side layer, and has a plating film on at least an outer peripheral side. The plating film is preferably a copper plating film. The plating film is a plating film having a thickness of 1 to 100 ?m and a hardness of 50 to 300 HV, and the hardness of the plating film is adjusted so as to satisfy a range of 1.05 to 4.5 times hardness of the cylinder head in Vickers hardness HV. Pores contained in the valve seat insert are preferably sealed with a curable resin before plating treatment.
    Type: Application
    Filed: May 14, 2019
    Publication date: July 15, 2021
    Applicant: Nippon Piston Ring Co., Ltd.
    Inventors: Ayato OIKAWA, Kiyoshi SUWA, Katsuaki OGAWA, Hiroshi OSHIGE, Kenichi SATO
  • Patent number: 11058343
    Abstract: When a user uses a finger to press and hold a first candidate display area, the first candidate display area is enclosed in a selection frame (W1), a simple window (W10) is displayed, and analysis results relating to a first candidate segment waveform are displayed in this simple window (W10). Analysis results can therefore be confirmed without switching screens and, as a result, inspection results can be confirmed with fewer steps and an electrocardiographic waveform and analysis results therefor can be compared on the same screen.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: July 13, 2021
    Assignee: FUKUDA DENSHI CO., LTD.
    Inventors: Yosuke Shimai, Hironori Uchida, Kenichi Sato
  • Publication number: 20210199689
    Abstract: A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.
    Type: Application
    Filed: March 15, 2021
    Publication date: July 1, 2021
    Applicant: YOKOWO CO., LTD.
    Inventors: Tsugio YAMAMOTO, Kenichi SATO, Takayoshi OKUNO
  • Patent number: 11040402
    Abstract: A surface-coated cutting tool including at least a TiAlCN layer, in which the layer is expressed by a composition formula: (Ti1-XAlX)(CYN1-Y), an average content ratio X of Al and an average content ratio Y of C (here, X and Y are atomic ratios) satisfy 0.60?X?0.95 and 0?Y?0.005, respectively, an average content ratio Z of Cl in the total amount of atoms configuring the TiAlCN phase (here, Z is an atomic ratio) satisfies 0.0001?Z?0.004, plane spacings d(111) and d(200) are respectively calculated from X-ray diffraction spectra of (111) plane and (200) plane of crystal grains having a NaCl type face-centered cubic structure in the TiAlCN layer measured by using an X-ray diffraction device, and an absolute value ?A=|A(111)?A(200)| defined as A(111)=31/2d(111) and A(200)=2d(200) satisfies 0.007 ???A?0.05.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 22, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takuya Ishigaki, Sho Tatsuoka, Kenichi Sato, Kousuke Yanagisawa, Shin Nishida
  • Patent number: 11028583
    Abstract: The present invention is transportable economically in a flat state, and easy to attach and detach, and can provide a curved surface simply while maintaining decoration and strength without craftsmanship and absorb sound. Slits are provided on a rectangular board panel comprising two or more layers of a hard material and a soft material. Two or more layers comprising a hard material and a soft material are laminated on a rectangular board panel, and slits having a length of ½ to ¾ of the vertical side are provided thereto. The use of slits makes formation of curved surfaces easy. Since there is no need to reinforce the outside to maintain the strength thereof, the board panel can be removed easily. Even if an external pressure is applied to the board panel, the flexibility of the hard material divided by the slits and the elastic characteristic of the soft material cause the pressure to be dispersed and absorbed, and sound to be absorbed.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: June 8, 2021
    Inventor: Kenichi Sato
  • Patent number: 10976346
    Abstract: A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: April 13, 2021
    Assignee: YOKOWO CO., LTD.
    Inventors: Tsugio Yamamoto, Kenichi Sato, Takayoshi Okuno
  • Patent number: D924789
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: July 13, 2021
    Assignee: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Kenichi Sato, Hiraku Kouda
  • Patent number: D939429
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: December 28, 2021
    Assignee: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Kenichi Sato, Kento Ishizu, Shunya Harada