Abstract: A tubular fuser device rotates and is in contact with a sheet on which a positively charged toner image is formed to fix the toner image to the sheet. The fuser device includes a tubular substrate made of a metal, a rubber layer covering the outer periphery of the substrate, an adhesion layer covering the outer periphery of the rubber layer, and a surface layer made of a resin covering the outer periphery of the adhesion layer. In the fuser device, a charge decay ?V at a moment 120 seconds after end of charging a surface of the surface layer to ?1 kV is zero, and an electrostatic capacity per unit area C in a thickness direction of the fuser device is equal to or less than 3.30 pF/cm2.

Abstract: A tubular fuser device rotates and is in contact with a sheet on which a positively charged toner image is formed to fix the toner image to the sheet. The fuser device includes a tubular substrate made of a metal, a rubber layer covering the outer periphery of the substrate, an adhesion layer covering the outer periphery of the rubber layer, and a surface layer made of a resin covering the outer periphery of the adhesion layer. In the fuser device, C·R/A2 is less than 1.1×10?53 F?/cm4 in which C·R/A2 is a product of an electrostatic capacity per unit area C/A in a thickness direction of the fuser device and an electrical resistance per unit area R/A in the thickness direction of the fuser device.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: Provided is lane guidance system for decreasing the possibility that a user is misled including: a proposed travel route acquisition unit that acquires a proposed travel route of a vehicle; a successive intersection determination unit that determines whether a distance between a first intersection that is a guidance intersection on the proposed travel route and a second intersection that follows the first intersection is within a prescribed distance. Based on the proposed travel route, a travelable lane acquisition unit acquires a travelable lane that the vehicle needs to travel along when entering the first intersection to exit in a specific exiting direction of the first intersection, when the vehicle needs to exit from the first intersection in the exiting direction to travel along the proposed travel route.

Abstract: Disclosed herein is a micro light emitting diode (microLED) display structure with emission from the back side of a transparent substrate, which can be manufactured by fluidic assembly. The architecture allows microLED displays or display tiles to be fabricated simply, with processing and interconnection only on one side of the backplane. The structure may incorporate reflectors in the fluidic assembly structures to direct substantially all of the emitted light toward the viewer. Also disclosed are microLEDs and emission backplanes designed to support a back emission display.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: A cavity elongated in one direction is formed in a protective film covering the conductive pattern of the topmost conductive layer of a multilayer wiring substrate. The cavity exposes part of the conductive pattern. A first via-conductor extends downward from the conductive pattern of the topmost conductive layer at least until that of a second conductive layer. Second via-conductors extend downward from the conductive pattern of the second or third conductive layer at least until that of a conductive layer one below. As viewed from above, the first via-conductor and the cavity partially overlap each other. At least two second via-conductors are disposed to sandwich the cavity therebetween. The difference between the smallest gap between the cavity and the second via-conductor at one side and that between the cavity and the second via-conductor at the other side is smaller than the smallest gap between the cavity and the second via-conductors.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: A compound represented by general formula (I) (in the formula, all symbols are as described in the description) or a salt thereof has a potent nerve-protecting and/or -repairing activity, and therefore can be used as a therapeutic agent for neuropathy (e.g., chronic inflammatory demyelinating polyneuropathy, Guillain-Barre syndrome, periarteritis nodosa, allergic vasculitis, diabetic peripheral neuropathy, entrapment neuropathy, peripheral neuropathy associated with the administration of a chemotherapeutic drug, or peripheral neuropathy associated with Charcot-Marie-Tooth disease).

Abstract: At least one transistor is arranged on a substrate. A collector layer and a base layer of the transistor compose a collector mesa having a substantially mesa shape and the collector mesa has side faces tilting with respect to the substrate so that the dimension of a top face in a first direction of a plane of the substrate is smaller than the dimension of a bottom face therein. A first insulating film covering the transistor is arranged on the substrate. A first-layer emitter line that extends from an area overlapped with the top face of the collector mesa to areas overlapped with at least part of the tilting side faces of the collector mesa in a plan view is arranged on the first insulating film. A second-layer emitter line and an emitter bump are arranged on the first-layer emitter line.

Abstract: Microperturbation fluidic assembly systems and methods are provided for the fabrication of emissive panels. The method provides an emissive substrate with a top surface patterned to form an array of wells. A liquid suspension is formed over the emissive substrate top surface, comprising a first liquid and emissive elements. Using an array of micropores, a perturbation medium, which optionally includes emissive elements, is injected into the liquid suspension. The perturbation medium may be the first liquid, a second liquid, or a gas. A laminar flow is created in the liquid suspension along the top surface of the emissive substrate in response to the perturbation medium, and emissive elements are captured in the wells. The ejection of the perturbation medium can also be used to control the thickness of the liquid suspension overlying the top surface of the emissive substrate.

Abstract: An airbag apparatus attachment mechanism includes a holder, a supporting member, an urging member, and a functional member. The holder is fastened to a metal core with a fastening member. The supporting member protrudes further forward than an airbag apparatus and is inserted into the holder. The urging member urges the airbag apparatus rearward. The functional member is attached to a part of the supporting member that is inserted in the holder. The functional member includes a spring portion that is thinner than a gap between the supporting member and the holder. The spring portion is disposed in the gap. The functional member is configured such that the spring portion is elastically deformed in a radial direction of the supporting member due to vibration of the airbag apparatus, thereby suppressing the vibration.

Abstract: A semiconductor device includes two cell rows, each of which is formed of a plurality of transistor cells aligned in parallel to each other. Each of the plurality of transistor cells includes a collector region, a base region, and an emitter region that are disposed above a substrate. A plurality of collector extended wiring lines are each connected to the collector region of a corresponding one of the plurality of transistor cells and are extended in a direction intersecting an alignment direction of the plurality of transistor cells. A collector integrated wiring line connects the plurality of collector extended wiring lines to each other. A collector intermediate integrated wiring line that is disposed between the two cell rows in plan view connects the plurality of collector extended wring lines extended from the plurality of transistor cells that belong to one of the two cell rows to each other.

Abstract: A compound represented by general formula (I) (in the formula, all symbols are as described in the description) or a salt thereof has a potent nerve-protecting and/or -repairing activity, and therefore can be used as a therapeutic agent for neuropathy (e.g., chronic inflammatory demyelinating polyneuropathy, Guillain-Barre syndrome, periarteritis nodosa, allergic vasculitis, diabetic peripheral neuropathy, entrapment neuropathy, peripheral neuropathy associated with the administration of a chemotherapeutic drug, or peripheral neuropathy associated with Charcot-Marie-Tooth disease).

Abstract: Each of cells arranged on a substrate surface along a first direction includes at least one unit transistor. Collector electrodes are arranged between two adjacent cells. A first cell, which is at least one of the cells, includes unit transistors arranged along the first direction. The unit transistors are connected in parallel to each another. In the first cell, the base electrode and the emitter electrode in each unit transistor are arranged along the first direction, and the order of arrangement of the base electrode and the emitter electrode is the same among the unit transistors. When looking at one first cell, a maximum value of distances in the first direction between the emitter electrodes of two adjacent unit transistors in the first cell being looked at is shorter than ½ of a shorter one of distances between the first cell being looked at and adjacent cells.

Abstract: A semiconductor package includes a module substrate having opposite top and bottom surfaces, a semiconductor chip provided with bumps and mounted on the top surface of the module substrate via the bumps, and a metal member having a top portion disposed at a level higher than the semiconductor chip with reference to the top surface of the module substrate and including the semiconductor chip in plan view and a side portion extending from the top portion toward the module substrate. The module substrate includes a first metal film disposed on or in at least one of the bottom surface and an internal layer of the module substrate. The first metal film is electrically connected to the bumps and reaches a side surface of the module substrate. The side portion is thermally coupled to the first metal film at the side surface of the module substrate.

Abstract: A tubular fuser device rotates and is in contact with a sheet on which a positively charged toner image is formed to fix the toner image to the sheet. The fuser device includes a tubular substrate made of a metal, a rubber layer covering the outer periphery of the substrate, an adhesion layer covering the outer periphery of the rubber layer, and a surface layer made of a resin covering the outer periphery of the adhesion layer. In the fuser device, C·R/A2 is less than 1.1×10?3 F?/cm4 in which C·R/A2 is a product of an electrostatic capacity per unit area C/A in a thickness direction of the fuser device and an electrical resistance per unit area R/A in the thickness direction of the fuser device.

Abstract: A fluidic assembly emissive display panel is presented with a plurality of wells exposing LED interfaces. Each LED interface is made up of a planar first interconnect platform having an x-axis first depth and is configured to accept an axial LED first electrode mounting wing. A planar second interconnect platform has the first depth and is configured to accept an axial LED second electrode mounting wing. A groove is interposed between the first and second interconnect platforms and has an x-axis second depth, greater than the first depth, and is configured to accept an axial LED body locking tooth. The axial LEDs have an inorganic LED body with two symmetrical locking teeth. First and second electrode mounting wings are electrically connected to corresponding LED interface first and second interconnect platforms, and aligned in a plane orthogonal to stacked LED body semiconductor layers.

Abstract: A charging roll includes a core member, a rubber base material disposed around the core member, and a surface layer disposed around the rubber base material. The ten point height of irregularities RZ of a surface of the surface layer is equal to or greater than 3.9 micrometers, and is equal to or less than 6.1 micrometers. The mean spacing between peaks Sm of the surface of the surface layer is equal to or greater than 12.5 micrometers and is equal to or less than 13.5 micrometers.