Abstract: A soft magnetic alloy includes a main component of (Fe(1?(?+?))X1?X2?)(1?(a+b+c+d+e))MaBbPcSidCe. X1 is one or more of Co and Ni. X2 is one or more of Al, Mn, Ag, Zn, Sn, As, Sb, Cu, Cr, Bi, N, O, and rare earth elements. M is one or more of Nb, Hf, Zr, Ta, Mo, W, and V. 0.020?a?0.14 is satisfied. 0.020<b?0.20 is satisfied. 0?d?0.060 is satisfied. ??0 is satisfied. ??0 is satisfied. 0??+??0.50 is satisfied. c and e are within a predetermined range. The soft magnetic alloy has a nanohetero structure or a structure of Fe based nanocrystallines.

Abstract: A projector includes a projection lens and a projector body. In the projection lens, a U-shaped optical path is formed by optical axis to optical axis. A lens barrel is a U-shaped barrel. A housing of the projector body includes a storage section. The projection lens is supported rotatably about the optical axis with respect to the housing, in an up-down direction and a right-left direction of the housing perpendicular to the optical axis, between a first position where the projection lens is stored inside a storage section provided in the housing and a second position where the projection lens is protruding from the housing.

Abstract: Provided is an air conditioner including an indoor unit provided with a microphone element for receiving voice instructions, such that a voice instruction spoken by an operator is acquired with high quality and control based on the voice instruction spoken by the operator is likely to be ensured. The air conditioner includes an indoor unit, a transmission unit, and a reception unit. The indoor unit has a main body and a microphone element. The main body has formed therein a blow-out port through which air-conditioned air is blown out toward a space to be air-conditioned. The microphone element accepts a voice instruction captured from a voice capturing portion arranged at a position that deviates from a ventilation space through which the air blown out from the blow-out port flows, in such a manner as to face the space to be air-conditioned. The transmission unit transmits the voice instruction accepted by the microphone element to an outside as a signal.

Abstract: An object of the present invention is to provide an optical switch element, an optical switch device, an optical communication system, and an optical computer capable of operating even in a temperature range higher than the Néel temperature. An optical switch element (10) according to the present invention includes a substance including a plurality of transition metal elements having electrons in d-orbitals, and a plurality of anions arranged around each of the plurality of transition metal elements, in which the plurality of transition metal elements are arranged in a lattice form, t2g-orbitals into which the d-orbitals of each of the plurality of transition metal elements are split are connected annularly, and in a state in which the substance does not have a long-range magnetic order, the polarization of signal light (L1) is rotated when control light (C1) is applied.

Abstract: [PROBLEM] The problem to be solved by the invention is to provide a novel pharmaceutical use of a JAK inhibitor. [SOLUTION MEANS] A therapeutic or preventive agent for a skin disease selected from the group consisting of senile xerosis, asteatosis, eczema and contact dermatitis, containing a JAK inhibitor as an active ingredient. [EFFECT] The followings are found: a JAK inhibitor increases the expression amounts of filaggrin, loricrin, involucrin and ?-defensin 3 as skin barrier function-related proteins; a JAK inhibitor significantly increases NMF production in a Tape Stripping-treated mouse; and a JAK inhibitor significantly accelerates a reduction in TEWL in a dry skin mouse model, namely improves the skin barrier function. The JAK inhibitor can be used as an active ingredient of a therapeutic or preventive agent for skin diseases such as senile xerosis, asteatosis, eczema, contact dermatitis, ichthyosis vulgaris, Netherton syndrome, type B peeling skin syndrome, etc.

Abstract: A method that, regarding a process of refining molten iron, can increase the thermal margin and the amount of cold iron source to be used. A burner having jetting holes for jetting a fuel and a combustion supporting gas is provided at a leading end part of one lance that top-blows an oxidizing gas to molten iron contained in a converter-type vessel, or at a leading end part of another separate lance. A powdery auxiliary raw material or an auxiliary raw material processed into a powder form that is blown into the molten iron from the one lance or the other lance passes through a flame formed by the burner. This top-blowing lance for a converter is configured to secure a predetermined heating time and powder-fuel ratio. Also, a method for adding an auxiliary raw material and a method for refining of molten iron that use this top-blowing lance.

Abstract: A molten iron refining method having, an auxiliary material, and an oxidizing gas supplied through a top-blowing lance, to a cold iron source and molten pig iron that are contained/fed in a converter-type vessel, and molten iron is subjected to a refining process. A pre-charged cold iron source is charged into the converter-type vessel at an amount not larger than 0.15 times. A furnace-top-added cold iron source that's part or all of the cold iron source and added from a furnace top is fed during the refining process. A burner at a leading end of the top-blowing lance that spray holes through which a fuel and a combustion-supporting gas are ejected. During the refining process, a powdery auxiliary material processed into powder that's part of the auxiliary material is blown in, to pass through a flame formed by the burner.

Abstract: Proposed is a molten iron refining method capable of securing an in-flame staying time period of a heat transfer medium without being influenced by height adjustments of a blowing-purpose oxygen-blowing lance. As far as to a position lower than an upper end inside a converter-type vessel 1, a blowing-purpose oxygen-blowing lance 3 that supplies oxidizing gas and is capable of ascending and descending and at least one burner lance 4 capable of ascending and descending independently of the blowing-purpose oxygen-blowing lance are inserted. From the blowing-purpose oxygen-blowing lance, either oxidizing gas or oxidizing gas and CaO-containing refining agent are blown onto the molten iron. Also, a flame is formed by causing the burner lance to discharge fuel gas and combustion supporting gas. Powder particles discharged from the burner lance are caused to pass through the flame and to be blown onto the molten iron in a heat-transferred state, so that the molten iron is thermally compensated.

Abstract: Provided is an air conditioner including an indoor unit provided with a microphone element for receiving voice instructions, such that a voice instruction spoken by an operator is acquired with high quality and control based on the voice instruction spoken by the operator is likely to be ensured. The air conditioner includes an indoor unit (12), a transmission unit, and a reception unit. The indoor unit has a main body (100) and a microphone element. The main body has formed therein a blow-out port (120) through which air-conditioned air is blown out toward a space to be air-conditioned. The microphone element accepts a voice instruction captured from a voice capturing portion (P1) arranged at a position that deviates from a ventilation space through which the air blown out from the blow-out port flows, in such a manner as to face the space to be air-conditioned. The transmission unit transmits the voice instruction accepted by the microphone element to an outside as a signal.

Abstract: A management system (1090) includes an air conditioner (1062), a sound input unit (1064), an operation sound analyzing unit (1016), a first preprocessing unit (1011), a command extracting unit (1014), and a control unit (1017). The sound input unit (1064) is provided in a room where the air conditioner is provided and obtains sound data (SD). The operation sound analyzing unit (1016) analyzes the sound data by a predetermined analysis method so as to obtain a determination result (RE) regarding whether an abnormality exists in the air conditioner or details of the abnormality. The first preprocessing unit (1011) performs first preprocessing on the sound data. The command extracting unit (1014) extracts a command (CM) of a user from the sound data that has been subjected to the first preprocessing. The control unit (1017) controls the air conditioner on the basis of the command.

Abstract: The outflow of die bond material is prevented and the quality and reliability of a semiconductor device are improved. A tab, a plurality of leads arranged around the tab, silver paste arranged on a chip supporting surface of the tab, and a semiconductor chip mounted via silver paste on the tab are included. Further, a plurality of wires which electrically connect a pad of the semiconductor chip, a lead, and a sealing body which does the resin seal of the semiconductor chip and the wires are also included. By forming a step part whose height is lower than the chip supporting surface at an edge part of the chip supporting surface of the tab, the silver paste protruded from the tab can be stopped at the step part. As a result, an outflow to the back surface of the sealing body of silver paste can be prevented.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: A semiconductor device with improved reliability is provided. The semiconductor device in a QFN package configuration has a semiconductor chip mounted on a tab, leads which are alternately arranged around the tab and electrically connected to the electrodes of the semiconductor chip via bonding wires, and an encapsulating resin portion for encapsulating therein the semiconductor chip and the bonding wires. The lower exposed surfaces of the leads are exposed at the outer peripheral portion of the back surface of the encapsulating resin portion to form external terminals. The lower exposed surfaces of the leads are exposed at the portion of the back surface of the encapsulating resin portion which is located inwardly of the lower exposed surface of the leads to also form external terminals.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: The outflow of die bond material is prevented and the quality and the reliability of a semiconductor device are improved. A tab, a plurality of leads arranged around the tab, silver paste arranged on the chip supporting surface of the tab, and a semiconductor chip mounted via silver paste on the tab are included. Further, a plurality of wires which electrically connect a pad of the semiconductor chip, and a lead, and a sealing body which does the resin seal of the semiconductor chip and the wires are included. By forming a step part whose height is lower than the chip supporting surface in the edge part of the chip supporting surface of the tab, the silver paste protruded from the tab can be stopped to this step part. As a result, an outflow to the back surface of the sealing body of silver paste can be prevented.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.

Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.