Abstract: Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; (B) a reaction initiator; and (C) an inorganic filler surface-treated with a silane coupling agent, wherein the component (C) has a maximum particle size of not larger than 40 ?m.

Abstract: A thermosetting resin composition, including: a thermosetting resin; a laser direct structuring additive; an inorganic filler; and a coupling agent, wherein the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent.

Abstract: Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.

Abstract: The present invention provides, for example, an oligonucleotide derivative or a salt thereof comprising a circular oligonucleotide and a linear oligonucleotide, wherein the circular oligonucleotide and the linear oligonucleotide have base sequences complementary to each other, and form a complex via a hydrogen bond between the complementary base sequences, and a method for producing the same.

Abstract: Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB2O4 ??(1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.

Abstract: Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains: (A) an epoxy resin; (B) a phenolic curing agent; (C) a curing accelerator having a urea structure; (D) a laser direct structuring additive; and (E) an inorganic filler.

Abstract: The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.

Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Abstract: Systems, apparatuses, applications and methodologies are configured to assist a user to generate a proposed state (e.g., a proposed fleet of devices), for a customer, that largely maintains total output volumes. Thus, obtaining a proposed state analysis can become a manageable task.

Abstract: This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.

Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Abstract: The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.

Abstract: Systems, apparatuses, application software and methodologies are configured to assist a user to generate a proposed state (e.g., a proposed fleet of devices), for a customer. A user interface is provided through which the user can request a proposed state floormap graphically showing locations of devices in the proposed state to be presented. Thus, the object of arriving at a proposal for the customer can become a more manageable task.

Abstract: The present invention provides an oligonucleotide derivative having, at an oxygen atom of at least one phosphate group of an oligonucleotide, a group represented by formula (I): (wherein R1 represents lower alkyl or the like; and R2 and R3 are the same or different and respectively represent an electron-withdrawing group or the like), or a salt thereof.

Abstract: Systems, apparatuses, application software and methodologies are configured to assist a user to generate a proposed state (e.g., a proposed fleet of devices), for a customer. A user interface is provided through which the user can request a proposed state floormap graphically showing locations of devices in the proposed state to be presented. Thus, the object of arriving at a proposal for the customer can become a more manageable task.

Abstract: Systems, apparatuses, applications and methodologies are configured to assist a user to generate a proposed state (e.g., a proposed fleet of devices), for a customer, that largely maintains total output volumes. Thus, obtaining a proposed state analysis can become a manageable task.

Abstract: Systems, apparatuses, application software and methodologies are configured for generating automatically a proposed state (e.g., a proposed fleet of devices), for an enterprise or another organization, based on device models specified in a contract or proposed contract. Thus, obtaining a proposed state analysis can become a manageable task.

Abstract: Systems, apparatuses, application software and methodologies are configured for generating automatically a proposed state (e.g., a proposed fleet of devices), for an enterprise or another organization, based on user-specified auto-creation options. Thus, obtaining a proposed state analysis becomes a manageable task, based on a current state analysis, or based on another registered proposed state.

Abstract: Tools, such as a system, apparatus, methodology, application, etc., are provided for generating a proposed state analysis, and include provisions to generate a proposed state analysis based on another proposed state analysis or based on a current state analysis of a current fleet of devices.

Abstract: Systems, apparatuses, applications and methodologies are configured for a user to generate, based on a proposed model list, a proposed state analysis of a proposed fleet of devices, for a customer. By limiting the devices that can be added to the proposed fleet to those encompassed by the proposed model list, the objective of arriving at a proposal for the customer becomes a manageable task.