Patents by Inventor Kenji Hayashi
Kenji Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146405Abstract: A control apparatus capable of exhibiting the diversity effect in a hybrid mobile communication system using a terrestrial communication apparatus and a non-terrestrial communication apparatus is provided.Type: ApplicationFiled: October 13, 2023Publication date: May 2, 2024Applicant: NEC CorporationInventors: Kenji WAKAFUJI, Junichi FUNADA, Kohei YOSHIDA, Masakazu ONO, Kazuyuki HAYASHI
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Publication number: 20240146400Abstract: At least one processor included in a server carries out: an acquiring process of acquiring, from a communication terminal configured to communicate with low earth orbit satellite equipment, information which indicates a communication condition in the communication terminal regarding communication with the low earth orbit satellite equipment; and a controlling process of referring to a radio wave map of a region including a location of the communication terminal and the information, to control an air vehicle configured to measure an attenuation of a radio wave between the air vehicle and the communication terminal.Type: ApplicationFiled: October 19, 2023Publication date: May 2, 2024Applicant: NEC CorporationInventors: Kazuyuki HAYASHI, Masakazu Ono, Junichi Funada, Kenji Wakafuji, Kohei Yoshida
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Patent number: 11971563Abstract: Disclosed is a near-infrared absorbing composition, including: a near-infrared absorbing agent; and a solvent, wherein the near-infrared absorbing agent includes at least one of the following Component (A) and Component (B): Component (A): a component composed of a compound having a structure of the following general formula (I) and a metal ion; Component (B): a component composed of a metal complex that is obtainable by a reaction of the compound having the structure of the following general formula (I) and a metal compound.Type: GrantFiled: March 11, 2019Date of Patent: April 30, 2024Assignee: KONICA MINOLTA, INC.Inventors: Koji Daifuku, Yosuke Mizutani, Natsumi Itamoto, Keigo Tamaki, Yutaro Horie, Kenji Hayashi, Issei Nakahara, Takahiko Nojima, Kiyoshi Fukusaka
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Publication number: 20240136335Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.Type: ApplicationFiled: December 28, 2023Publication date: April 25, 2024Inventors: Kenji HAYASHI, Masashi HAYASHIGUCHI
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Patent number: 11965444Abstract: A controller for an internal combustion engine is configured to execute a determination process that determines that a deviation between a first change amount and a second change amount during a fuel cutoff operation is less than or equal to a threshold, and an anomaly diagnosing process that determines that an exhaust purification device is in a detached state when the determination process determines that the deviation is less than or equal to the threshold. The first change amount and the second change amount are change amounts per unit time of the temperature of exhaust gas on the upstream side and the downstream side of the exhaust purification device, respectively. The controller is configured to interrupt the determination process when the upstream-side temperature increases within a determination period.Type: GrantFiled: June 6, 2023Date of Patent: April 23, 2024Assignee: Toyota Jidosha Kabushiki KaishaInventors: Toru Yaeo, Yoshifumi Matsuda, Masashi Hakariya, Atsushi Morikawa, Ikuo Hoda, Noriyasu Adachi, Masanori Hayashi, Kenji Igawa
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Patent number: 11961790Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.Type: GrantFiled: August 21, 2023Date of Patent: April 16, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
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Publication number: 20240119475Abstract: An information processing device includes a processor configured to provide an incentive to a first user who sells or returns a first vehicle in which a part of a first coating film including an easily peelable layer is not peeled off.Type: ApplicationFiled: December 19, 2023Publication date: April 11, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yukinori II, Kenji YAMAGUCHI, Junya OGAWA, Yuki NAGANUMA, Junya YAMAMOTO, Yuta TONE, Naoki ISHIZUKA, Tadayuki TANAKA, Keisuke ITO, Yuka YOKOI, Takashi HAYASHI, Naoya OKA, Yu HAMADA
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Patent number: 11955451Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: GrantFiled: August 29, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
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Patent number: 11955452Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: GrantFiled: August 29, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
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Patent number: 11955414Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: GrantFiled: August 24, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
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Patent number: 11955413Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: GrantFiled: August 24, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
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Patent number: 11901340Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.Type: GrantFiled: February 6, 2023Date of Patent: February 13, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Masashi Hayashiguchi
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Publication number: 20240039067Abstract: The treating method for a positive electrode for a non-aqueous electrolyte secondary battery is a treating method for a positive electrode for a non-aqueous electrolyte secondary battery which comprises a positive electrode having a foil containing Al and an active material which is a metal composite oxide, the method comprising: conducting a heating treatment for heating the positive electrode (heating step); melting the positive electrode using heat of reaction of the foil and the active material to obtain a molten material (melting step); and separating the molten material into a metal material containing a metal constituting the metal composite oxide and a slag (separating step). By subjecting the positive electrode to heating treatment, a reduction reaction of the positive electrode can be promoted at a low cost.Type: ApplicationFiled: July 28, 2021Publication date: February 1, 2024Inventors: Yutaro KIKUCHI, Atsushi YOKOYAMA, Shinichi OGURA, Yohei TAKANO, Hideki HASHIMOTO, Kenji HAYASHI
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Patent number: 11888240Abstract: A planar antenna includes a planar radiation conductor 11, a common ground conductor 32, a first strip conductor 21 located between the planar radiation conductor 11 and the common ground conductor 32 and extending in a direction in parallel to a first axis in a first right rectangular coordinate system including first, second, and third axes, a second strip conductor 22 located between the planar radiation conductor and the common ground conductor and extending in a direction orthogonal to a direction of extension of the first strip conductor, and at least one pair of passive conductors 12 to 15 each including a side at an angle of 45±3° or ?45±3° with respect to the first axis and opposed to the planar radiation conductor.Type: GrantFiled: July 28, 2021Date of Patent: January 30, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasunori Takaki, Kenji Hayashi, Masato Enoki
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Publication number: 20230411339Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: ApplicationFiled: August 29, 2023Publication date: December 21, 2023Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
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Publication number: 20230402432Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a mounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: ApplicationFiled: August 25, 2023Publication date: December 14, 2023Inventors: Kenji HAYASHI, Akihiro SUZAKI, Masaaki MATSUO, Ryuta WATANABE, Makoto IKENAGA
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Publication number: 20230402421Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: ApplicationFiled: August 29, 2023Publication date: December 14, 2023Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
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Publication number: 20230395476Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: ApplicationFiled: August 24, 2023Publication date: December 7, 2023Inventors: Kohei TANIKAWA, Kenji HAYASHI, Ryosuke FUKUDA
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Publication number: 20230395474Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.Type: ApplicationFiled: August 21, 2023Publication date: December 7, 2023Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
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Publication number: 20230395475Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: ApplicationFiled: August 24, 2023Publication date: December 7, 2023Inventors: Kohei TANIKAWA, Kenji HAYASHI, Ryosuke FUKUDA