Patents by Inventor Kenji Hayashi

Kenji Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200298771
    Abstract: A rocker molding includes a vertical wall portion provided under a rocker in a vehicle upper-lower direction, a bottom wall portion extending from a lower end portion of the vertical wall portion to an outer side in a vehicle width direction, and a side wall portion extending upwardly in the vehicle upper-lower direction from an outer end portion of the bottom wall portion in the vehicle width direction. A sound absorbing material is provided in a penetrating portion that is provided in a grange from a portion of the vertical wall portion to an inner portion of the bottom wall portion in the vehicle width direction.
    Type: Application
    Filed: March 18, 2020
    Publication date: September 24, 2020
    Inventors: Syunsuke RIKITAKE, Kenji HAYASHI, Tatsuhiro KOMITO
  • Publication number: 20200296828
    Abstract: A ceramic substrate capable of suppressing the reduced reliability caused by via misalignment during manufacturing, and capable of suppressing the reduced reliability caused by thermal stress between the ceramic substrate and a mounting board is provided. The ceramic substrate includes an electrode and a via connected to the electrode. The ceramic substrate includes a plurality of vias provided to a center portion in a first direction of the electrode along a second direction. The first direction is parallel to a surface on which the electrode is disposed. The first direction is a direction connecting a center of the surface to a center of the electrode. The second direction is parallel to the surface and perpendicular to the first direction.
    Type: Application
    Filed: January 16, 2020
    Publication date: September 17, 2020
    Applicant: HITACHI METALS, LTD.
    Inventors: Hisashi TANIE, Kenji HAYASHI, Hiromi SHIMAZU
  • Patent number: 10777542
    Abstract: A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: September 15, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Kenji Hayashi, Akihiro Suzaki
  • Patent number: 10753325
    Abstract: An introduction pipe has a first communication pipe, which is branched from a first intake passage and is connected to a resonator box, and a second communication pipe, which is branched from a second intake passage and is connected to the first communication pipe. The length of the first communication pipe between the branch point at which the first communication pipe is branched from the first intake passage and the connection point at which the second communication pipe is connected to the first communication pipe is defined as a first length. The length of the second communication pipe between the branch point at which the second communication pipe is branched from the second intake passage and the connection point at which the second communication pipe is connected to the first communication pipe is defined as a second length. The first length is unequal to the second length.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 25, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Kenji Hayashi
  • Patent number: 10749533
    Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: August 18, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Manabu Kondo, Kazuhiko Shimodaira, Kenji Hayashi
  • Patent number: 10709017
    Abstract: A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: July 7, 2020
    Assignee: HITACHI METALS, LTD.
    Inventor: Kenji Hayashi
  • Publication number: 20200203851
    Abstract: A multiaxial antenna includes an antenna unit, the antenna unit including a planar antenna which includes a planar radiation conductor and a ground conductor, the planar radiation conductor and the ground conductor being spaced away from each other in a third axis direction in a first right-handed Cartesian coordinate system which has first, second and third axes, and at least one linear antenna which is spaced away from the planar antenna in a first axis direction, the linear antenna including one or two linear radiation conductors extending in a second axis direction.
    Type: Application
    Filed: July 31, 2018
    Publication date: June 25, 2020
    Inventors: Yasunori TAKAKI, Kenji HAYASHI
  • Publication number: 20200185358
    Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at another surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 11, 2020
    Inventors: Kenji HAYASHI, Masashi HAYASHIGUCHI
  • Publication number: 20200170661
    Abstract: A treatment method for promoting hair growth/hair restoration includes pinching a part of skin where hair growth/hair restoration is to be promoted and jetting a pressure fluid to the part from a periphery thereof to raise the part to burn fat under a skin layer in and near the part to which the pressure fluid is jetted to improve blood circulation to perform a treatment for promoting hair growth/hair restoration.
    Type: Application
    Filed: July 9, 2018
    Publication date: June 4, 2020
    Inventor: Kenji HAYASHI
  • Patent number: 10637481
    Abstract: An oscillator includes a case that has a base and a cap connected to the base; a first substrate accommodated in the case; a lead terminal electrically connected to the first substrate; and a resonator module electrically connected to the lead terminal and supported by the lead terminal with a gap with respect to the first substrate between the first substrate and the base.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 28, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Manabu Kondo, Kensaku Isohata, Kenji Hayashi
  • Patent number: 10604042
    Abstract: An object is to provide a vehicle rear seat frame wherein impact caused by a housed seat toward the vehicle front is mitigated in a case of rear-end collision. Seat cushion side frames are disposed on both ends, with respect to the vehicle lateral direction, of a seat cushion frame, and include first weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state. Seat back side frames disposed on both ends, with respect to the vehicle lateral direction, of a seat back frame include second weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 31, 2020
    Assignee: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
    Inventors: Shintaro Yasuda, Kenji Hayashi, Mafuyu Okada
  • Patent number: 10603825
    Abstract: A fiber-reinforced resin molded article is molded into a three-dimensional shape on the basis of a sheet-shaped base material containing a fiber-reinforced resin. The fiber-reinforced resin molded article includes three-way directed corner portions constituted by plate sections joined in three mutually different directions. The fiber-reinforced resin molded article includes wrinkles that protrude from the differently directed corner portions by folding the sheet base material, and thick-walled sections which are laminated at sites where at least the wrinkles are formed.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 31, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Motoki Sakurai, Kenji Hayashi
  • Patent number: 10600764
    Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at another surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: March 24, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Kenji Hayashi, Masashi Hayashiguchi
  • Publication number: 20200092995
    Abstract: A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a
    Type: Application
    Filed: September 20, 2019
    Publication date: March 19, 2020
    Inventor: Kenji Hayashi
  • Patent number: 10559509
    Abstract: In order to address the problem in that, by increasing the gate resistance of a power semiconductor element, while variation of switching time can be controlled, loss due to the gate resistance becomes larger and power efficiency for the entire system is lowered, the present invention provides an insulating substrate capable of uniformizing switching speeds of circuit elements while suppressing influence on power efficiency of the circuit elements. In the insulating substrate according to the present invention, part of a wiring layer is formed as a control signal circuit layer, and part of the control signal circuit layer is formed as a resistance layer that increases input resistance when the circuit element receives a control signal.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: February 11, 2020
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiroshi Hozoji, Kenji Hayashi, Hiroyuki Itoh, Hisayuki Imamura, Hiroyuki Nagatomo
  • Publication number: 20200013703
    Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.
    Type: Application
    Filed: March 14, 2018
    Publication date: January 9, 2020
    Inventors: Masaaki MATSUO, Kenji HAYASHI, Akihiro SUZAKI, Soichiro TAKAHASHI, Masashi HAYASHIGUCHI, Yoshihisa TSUKAMOTO
  • Publication number: 20190379325
    Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 12, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Manabu KONDO, Kazuhiko SHIMODAIRA, Kenji HAYASHI
  • Publication number: 20190363432
    Abstract: A planar antenna includes a multilayer ceramic body 10 having an upper surface and a lower surface, and including a plurality of ceramic layers stacked together, at least one radiation conductor 31 positioned at one of interfaces between the plurality of ceramic layers in the multilayer ceramic body or on the upper surface of the multilayer ceramic body, a ground conductor 32 positioned at another one of the interfaces between the plurality of ceramic layers in the multilayer ceramic body or on the lower surface of the multilayer ceramic body, and a low-dielectric-constant region 115 positioned in the multilayer ceramic body between the radiation conductor and the ground conductor, and having a plurality of hollow portions.
    Type: Application
    Filed: February 8, 2018
    Publication date: November 28, 2019
    Inventors: Kenji HAYASHI, Masato ENOKI, Hatsuo IKEDA
  • Patent number: 10476493
    Abstract: A buffer circuit includes a first MOSFET including a first source electrode, a first gate electrode, and a first drain electrode, and a second MOSFET, which includes a second source electrode, a second gate electrode, and a second drain electrode, and is same in polarity as the first MOSFET, and the first gate electrode and the second gate electrode are electrically connected to each other.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: November 12, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Kenji Hayashi
  • Publication number: 20190326671
    Abstract: A planar antenna includes: a multilayer ceramic structure 10 having an upper surface and a lower surface and including a plurality of ceramic layers stacked with each other; at least one radiation conductor 31 located at one of interfaces between the ceramic layers 10; and a ground conductor 32 located on the lower surface of the multilayer ceramic structure or at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 24, 2019
    Inventors: Kenji HAYASHI, Masato ENOKI