Abstract: To appropriately determine the usage fee for each business operator of a system using a cloud service. An information processing apparatus includes a calculating unit configured to calculate a usage fee relating to a cloud service with respect to each of a plurality of business operators, based on information relating to a number of devices managed by each of the plurality of business operators by using the cloud service, and information relating to a usage record of using the cloud service by each of the plurality of business operators.

Abstract: A device management system includes a device installed in a building, a control terminal connected to the device, and a management apparatus connected to the control terminal via a network. Both the control terminal and the management apparatus are configured to be capable of acquiring a control command that is created by a user. The control command that is created by the user is acquired by at least one of the control terminal and the management apparatus. Based on the control command that is acquired, control of the device is shared and executed in at least one of the control terminal and the management apparatus.

Abstract: To appropriately determine the usage fee for each business operator of a system using a cloud service. An information processing apparatus includes a calculating unit configured to calculate a usage fee relating to a cloud service with respect to each of a plurality of business operators, based on information relating to a number of devices managed by each of the plurality of business operators by using the cloud service, and information relating to a usage record of using the cloud service by each of the plurality of business operators.

Abstract: To provide a technology by which the operation cost of a function using a cloud service can be properly identified. A computer is caused to execute a calculating process of calculating a usage fee for using a cloud service by at least one of a first function or a second function, based on first information indicating a relationship of input/output between a first service and a second service that are used by the first function and provided by the cloud service, and second information indicating a relationship of input/output between the first service and a third service that are used by the second function and provided by the cloud service.

Abstract: A device control system remotely controls one or more devices. The device control system includes the one or more devices, and a management apparatus connected to the one or more devices via a network. The management apparatus is capable of executing, in a plurality of execution modes having different processing performances, a program in order to control the one or more devices. The management apparatus accepts input of the program, executes the accepted program in a first execution mode, which is one of the plurality of execution modes, and determines, based on an execution result, an execution mode in which the program is to be executed.

Abstract: A device management system includes a device installed in a building, a control terminal connected to the device, and a management apparatus connected to the control terminal via a network. Both the control terminal and the management apparatus are configured to be capable of acquiring a control command that is created by a user. The control command that is created by the user is acquired by at least one of the control terminal and the management apparatus. Based on the control command that is acquired, control of the device is shared and executed in at least one of the control terminal and the management apparatus.

Abstract: Provided is a farming support system capable of precisely calculating the cost of a crop to be planted for sales. A farming support system includes: a storage unit to store a unit cost for each of a plurality of types of crops per unit planting area, the unit cost being calculated from a total cost including: a preparation cost required for a preparation operation; a farm-work cost required for farm work; and a shipping cost required for shipping operation; a condition setting unit configured to set a crop to be planted and a planting area for the crop; a unit-cost selection unit configured to select a unit cost corresponding to the crop to be planted from unit costs of the plurality of crops stored in the storage unit; and a cost calculation unit configured to calculate a cost of the crop to be planted based on the set planting area and the selected unit cost.

Abstract: A management system (1090) includes an air conditioner (1062), a sound input unit (1064), an operation sound analyzing unit (1016), a first preprocessing unit (1011), a command extracting unit (1014), and a control unit (1017). The sound input unit (1064) is provided in a room where the air conditioner is provided and obtains sound data (SD). The operation sound analyzing unit (1016) analyzes the sound data by a predetermined analysis method so as to obtain a determination result (RE) regarding whether an abnormality exists in the air conditioner or details of the abnormality. The first preprocessing unit (1011) performs first preprocessing on the sound data. The command extracting unit (1014) extracts a command (CM) of a user from the sound data that has been subjected to the first preprocessing. The control unit (1017) controls the air conditioner on the basis of the command.

Abstract: A display control method includes: obtaining a position of an object which is arranged in an area when receiving an input; determining, in accordance with the position of the object, a first display position of at least a first image between the first image and a second image in a display area of a display device adjacent to the area; displaying the first image and the second image on the display device; and changing, after receiving the input, the first display position of the first image in accordance with a change in a position of the object in the area without changing a second display position of the second image.

Abstract: A display control method includes: obtaining a position of an object which is arranged in an area when receiving an input; determining, in accordance with the position of the object, a first display position of at least a first image between the first image and a second image in a display area of a display device adjacent to the area; displaying the first image and the second image on the display device; and changing, after receiving the input, the first display position of the first image in accordance with a change in a position of the object in the area without changing a second display position of the second image.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

Abstract: A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.

Abstract: A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

Abstract: A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.

Abstract: A wafer-processing tape (10), having an intermediate resin layer (2), a removable adhesive layer (3), and, if necessary, an adhesive layer (4), which are laminated in this order on a substrate film (1), wherein a storage elastic modulus at 80° C. of the intermediate resin layer is larger than a storage elastic modulus at 80° C. of the removable adhesive layer.

Abstract: A wafer-processing tape, which has an adhesive layer (1) and a removable adhesive layer (2) formed on a surface of a base film (3), and which has an area where B>A, and an area where A>B, in which a peeling force between the base film (3) and the adhesive layer (1) is designated as A, and peeling forces between a target to be bonded (4) and the adhesive layer (1) and between a target to be bonded (5) and the removable adhesive layer (2) are designated as B, wherein the adhesive layer (1) is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer (2) is not transferred onto the target to be bonded (5) in the area where A>B during peeling off the tape.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.