Patents by Inventor Kenji Komatsu

Kenji Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180066735
    Abstract: In a transmission device, a power roller transmits a rotational driving force from an input disc to an output disc in a transmission ratio (transmission gear ratio) corresponding to a tilt motion angle. The power roller allows the transmission ratio to be changed in such a manner that the position of the trunnion on which the power roller is tiltably supported is changed by a trunnion drive mechanism. Hydraulic oil is supplied from a hydraulic pump to the trunnion drive mechanism via a direction selector valve. The direction selector valve selects a flow direction of the hydraulic oil to supply the hydraulic oil to a speed reduction chamber or a speed increase chamber of the trunnion drive mechanism, and discharge the hydraulic oil from the other. In a case where a discharge condition is met, the controller controls a movement of the discharge valve to discharge the hydraulic oil from the speed increase chamber.
    Type: Application
    Filed: March 8, 2016
    Publication date: March 8, 2018
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Kenji KOMATSU, Kenichiro TANAKA, Shogo FUCHIWAKI, Tatsuhiko GOI, Kippei MATSUDA
  • Patent number: 8142609
    Abstract: A plasma processing apparatus including a mounting table that includes a mounting table body having a temperature adjusted to be a predetermined level, and an electrostatic chuck disposed on an upper portion of the mounting table body, joined thereto with an acrylic adhesive having a thickness of 60 ?m or more, to adsorb the substrate thereon. The apparatus further including first and second heat transfer gas diffusion regions formed at a center and a circumferential edge, respectively, of an upper surface of the electrostatic chuck, and first and second heat transfer gas supply units to supply heat transfer gas to the first and second heat transfer gas diffusion regions, respectively. A volume ratio of the second heat transfer gas diffusion region to the first heat transfer gas diffusion region is equal to or less than 0.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: March 27, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Syuichi Takahashi, Hiroki Matsumaru, Nobutaka Nakao, Kenji Komatsu
  • Publication number: 20100006030
    Abstract: To provide a take up type vacuum vapor deposition apparatus capable of suppressing generation of a thermally-affected area on a film without lowering productivity. A take-up type vacuum vapor deposition apparatus according to the present invention includes: a payout roller configured to successively pay out a film ; a take-up roller configured to take up the film paid out from the payout roller; a cooling roller disposed between the payout roller and the take-up roller and configured to cool the film by coming into close contact with the film ; an evaporation source that faces the cooling roller and configured to deposit an evaporation material on the film; and an electron beam irradiator disposed between the payout roller and the evaporation source and configured to irradiate the film with an electron beam while the film is traveling.
    Type: Application
    Filed: June 7, 2007
    Publication date: January 14, 2010
    Applicant: ULVAC, INC.
    Inventors: Nobuhiro Hayashi, Takayoshi Hirono, Isao Tada, Atsushi Nakatsuka, Kenji Komatsu
  • Publication number: 20080308230
    Abstract: A plasma processing apparatus 1, in which a substrate W is mounted on a mounting table 11 in a processing chamber 10 and processing gas supplied in the processing chamber 10 is made into plasma to a perform plasma treatment on the substrate W, wherein the mounting table 11 has a mounting table body 12 having a temperature adjusted to be a predetermined level, and an electrostatic chuck 13 disposed on an upper portion of the mounting table body 12 and adsorbing the substrate W thereon; a first heat transfer gas diffusion region 47 is formed at a center of an upper surface of the electrostatic chuck 13 and a second heat transfer gas diffusion region 48 is formed at a circumferential edge of the upper surface of the electrostatic chuck 13; a first heat transfer gas supply unit 51 supplying heat transfer gas to the first heat transfer gas diffusion region 47 and a second heat transfer gas supply unit 52 supplying heat transfer gas to the second heat transfer gas diffusion region 48 are included; and a volume rati
    Type: Application
    Filed: March 26, 2008
    Publication date: December 18, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Syuichi TAKAHASHI, Hiroki Matsumaru, Nobutaka Nakao, Kenji Komatsu
  • Publication number: 20080242086
    Abstract: A plasma processing method, for performing a plasma process on a target substrate by generating a plasma between an upper electrode and a lower electrode facing each other by means of applying a radio frequency power therebetween, includes applying a DC voltage of a positive or negative polarity to an inner electrode of an electrostatic chuck on the lower electrode to attract and hold the target substrate thereon; and changing the positive or negative polarity of the DC voltage applied to the inner electrode of the electrostatic chuck to an opposite polarity thereto between a time when the application of the radio frequency power from the radio frequency power supply is started to perform the plasma process of the target substrate and a time when the plasma process is completed.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 2, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hiroki MATSUMARU, Nobutaka Nakao, Kenji Komatsu, Syuichi Takahashi
  • Patent number: 7262617
    Abstract: A method for manufacturing an integrated circuit, a measurement apparatus of an integrated circuit, and a wafer that reduces damages inflicted on bonding pads while enabling a probe test to be accurately performed. A sensor cell is arranged on a wafer between chip formation regions. The sensor cell has a diaphragm. Sensor pads, connected to a doping region, are arranged on the surface of the diaphragm. Probe needles contact the sensor pads. This strains the doping region and produces a corresponding voltage measured by the probe needles connected to the sensor pads. Relative inclination angle and relative distance of a probe card, which includes the probe needles, and the wafer are determined based on the measured voltage. A conduction test is performed by having the probe needles contact the bonding pad of the wafer while maintaining the determined the relative position.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: August 28, 2007
    Assignee: Freescale Semiconductor Inc.
    Inventors: Kenji Komatsu, Akira Nakajo
  • Publication number: 20070024300
    Abstract: A method for manufacturing an integrated circuit, a measurement apparatus of an integrated circuit, and a wafer that reduces damages inflicted on bonding pads while enabling a probe test to be accurately performed. A sensor cell is arranged on a wafer between chip formation regions. The sensor cell has a diaphragm. Sensor pads, connected to a doping region, are arranged on the surface of the diaphragm. Probe needles contact the sensor pads. This strains the doping region and produces a corresponding voltage measured by the probe needles connected to the sensor pads. Relative inclination angle and relative distance of a probe card, which includes the probe needles, and the wafer are determined based on the measured voltage. A conduction test is performed by having the probe needles contact the bonding pad of the wafer while maintaining the determined the relative position.
    Type: Application
    Filed: July 26, 2006
    Publication date: February 1, 2007
    Inventors: Kenji Komatsu, Akira Nakajo
  • Patent number: 6679107
    Abstract: An improved timing sensor for an internal combustion engine that cooperates with the camshaft and is mounted on a bearing cap of the camshaft. The timing sensor and bearing cap extend through an opening in a cam cover that encloses the area where the camshaft is journaled so that the timing sensor can be removed without removing the cam cover.
    Type: Grant
    Filed: August 16, 1995
    Date of Patent: January 20, 2004
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Katsumasa Ono, Kenji Komatsu
  • Patent number: 6279529
    Abstract: A cylinder head constructions wherein the cylinder head is comprised of a main cylinder head member that slidably supports the valves for the engine, and which has an upper peripheral edge that defines a cam chamber. At least one camshaft and the tappets associated thereby are supported by a separate cam and tappet carrier member that is affixed to the main cylinder head member. The bearing surfaces for the camshaft are formed at longitudinally spaced points and the valves for the corresponding cylinder are disposed between those points and are in parallel relation but have a large diameter and their actuating tappets have a large diameter but do not encroach on the bearing surfaces for the camshaft.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: August 28, 2001
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Kenji Komatsu, Hideo Fujita, Hidetoshi Kageyama
  • Patent number: 5959279
    Abstract: A magnetic pattern recognition method and apparatus capable of preventing magnetic noise from the pulse motor from affecting MICR character recognition processing while said pulse motor transports a document printed with MICR characters. The pulse motor is driven and noise signals detected by the magnetic head from a portion of the document not containing MICR characters are captured synchronized to the drive pulse. This is repeated for plural cycles to obtain the medium of plural signals as the compensation data. The raw detection signals detected by the magnetic head from another portion of the document containing MICR characters are then captured synchronized to the drive pulse. The compensation data is then subtracted from the raw detection signals to obtain the MICR character recognition data.
    Type: Grant
    Filed: April 10, 1997
    Date of Patent: September 28, 1999
    Assignee: Seiko Epson Corporation
    Inventor: Kenji Komatsu
  • Patent number: 5789727
    Abstract: Printing to aNd MICR code reading from a cut-sheet form imprinted with an MICR code, such as personal checks, are continuously accomplished by a single apparatus, thereby simplifying processing and reducing the required installation space. A magnetic head and a magnet for reading the MICR code are disposed on the slope of a paper path provided in a printer housing. A personal check in paper path is held by cut-sheet form loading rollers and/or transportation rollers which operate at a synchronized speed, and is passed over the magnetic head for MICR code reading. Thereafter, the personal check is held by the loading rollers and/or the transportation rollers for endorsement printing by the print head.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: August 4, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuaki Teradaira, Tsutomu Momose, Kenji Komatsu, Eizo Takahashi, Akira Koyabu, Naoki Asai
  • Patent number: 5560331
    Abstract: A number of embodiments of cylinder head constructions for internal combustion engines, wherein the intake and exhaust passages extend through the cylinder head and terminate in the respective upper and lower surfaces of the cylinder head so as to simplify machining. A number of variations and manifolding arrangements are also disclosed so as to permit the installation of the engine into an engine compartment and to provide a compact construction.
    Type: Grant
    Filed: November 16, 1995
    Date of Patent: October 1, 1996
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Kenji Komatsu, Tomotaka Takano
  • Patent number: 5531194
    Abstract: A number of embodiment of cylinder head constructions for internal combustion engines, wherein the intake and exhaust passages extend through the cylinder head and terminate in the respective upper and lower surfaces of the cylinder head so as to simplify machining. A number of variations and manifolding arrangements are also disclosed so as to permit the installation of the engine into an engine compartment and to provide a compact construction.
    Type: Grant
    Filed: May 10, 1995
    Date of Patent: July 2, 1996
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Kenji Komatsu, Tomotaka Takano
  • Patent number: 5173875
    Abstract: There is enclosed a semiconductor memory device having an internal circuit including a plurality of memory cells which can store data thereinto, respectively, to output, as a first output signal, data in a memory cell selected by an address signal, and an output circuit adapted to receive the first output signal to output a second output signal. Power from the same external power supply is delivered to the internal circuit and the output circuit through power supply terminals, and power supply wirings. The power is delivered to the internal circuit through a resistor formed in the middle of the power supply wirings.
    Type: Grant
    Filed: November 8, 1990
    Date of Patent: December 22, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Komatsu, Teruyuki Hiyoshi, Tohru Yoshikawa, Kaoru Nakagawa
  • Patent number: 5097450
    Abstract: A semiconductor memory device comprises a plurality of memory blocks which are divided into a plurality of memory groups and which each include a plurality of memory cells and a plurality of word lines for selecting the memory cells, a plurality of row decoders, provided at least one for each of the memory groups, for selecting at least one of the word lines in the memory block in response to part of a word line selection address signal, and for biasing this selected word line with an input drive signal, and a drive signal generating circuit for generating a drive signal for driving the word line. This device further includes a drive signal selection circuit for selectively supplying a drive signal from the drive signal generating circuit to the row decoders corresponding to one of the memory groups specified by the remaining portion of the address signal.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: March 17, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Haruki Toda, Kenji Komatsu
  • Patent number: 4678934
    Abstract: A flip-flop circuit has a power terminal set at 5 V, first and second output terminals, a latch section for charging one of the first and second terminals to 5 V and discharging the other one of the first and second terminals to 0 V in accordance with an input signal, a first MOS transistor having a current path connected between the power and first output terminals, a second MOS transistor for charging the gate of the first MOS transistor while the potential of the second output terminal is changed from 5 V to 0 V, and a capacitor for bootstrapping the gate potential of the first MOS transistor to turn on the first MOS transistor.
    Type: Grant
    Filed: July 11, 1986
    Date of Patent: July 7, 1987
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichi Magome, Haruki Toda, Hiroyuki Koinuma, Hiroshi Sahara, Kiminobu Suzuki, Shigeo Ohshima, Kenji Komatsu
  • Patent number: 4159771
    Abstract: A container comprises a plurality of interconnected compartments having rim flanges therearound and being individually sealed by a lid sheet attached to the rim flanges after portions of a product have been placed in respective compartments, the lid sheet being provided with edge slits and the rim flanges being provided with cutout notches which facilitate the prying and lifting of a corner portion of lid sheet and tearing off of a part thereof to unseal and open only a selected one of the compartments without disturbing the other compartments. This container in a preferred embodiment of the invention is housed in an outer box which can be easily opened to expose only parts of the container for selective unsealing of the compartments as stated above, and which can be easily reclosed for further storing of any remaining portions of the product.
    Type: Grant
    Filed: November 22, 1977
    Date of Patent: July 3, 1979
    Assignees: Meiji Seika Kabushiki Kaisha, Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Kenji Komatsu, Teruyoshi Wakamatsu