Patents by Inventor Kenji Matsumura

Kenji Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11022372
    Abstract: An air conditioner that includes a heat exchanger including: heat-transfer pipes extending in a horizontal direction and spaced apart at predetermined intervals in a vertical direction and configured to allow a thermal medium to flow therein. A part of the heat transfer pipes are used for at least one inflow path into which the thermal medium flows from the outside of the heat exchanger and the other part of the heat transfer pipes are used for at least one outflow path from which the thermal medium flows out to the outside. At least one connection pipe through which an outlet side of one of the at least one inflow path communicates with an inlet side of one of the at least one outflow path.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: June 1, 2021
    Assignee: HITACHI-JOHNSON CONTROLS AIR CONDITIONING, INC.
    Inventors: Shuuhei Tada, Kenji Matsumura, Nagatoshi Ooki, Mamoru Houfuku, Takeshi Endo
  • Patent number: 10989433
    Abstract: An air conditioner 1 includes: an outdoor heat exchanger 14; an outdoor fan 12 for blowing air to the outdoor heat exchanger; an outdoor fan motor 20 that drives the outdoor fan; an outdoor fan inverter 21 that drives the outdoor fan motor; and a control unit 31 that generates a rotation-speed command voltage for controlling the rotation number of the outdoor fan motor. In addition, the control unit starts a defrost operation of the outdoor heat exchanger, based on the rotation-speed command voltage. In this manner, it is possible to achieve an outdoor device of an air conditioner in which there is no need to provide a current detecting sensor, and it is possible to detect frost formation over the heat exchanger during a heating operation and to perform a defrost operation at low costs.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: April 27, 2021
    Assignee: HITACHI-JOHNSON CONTROLS AIR CONDITIONING, INC.
    Inventors: Natsuko Suzuki, Koji Naito, Kenji Matsumura, Kazumoto Urata
  • Patent number: 10907902
    Abstract: A heat exchanger includes: a gas-side port connected to piping for a gaseous refrigerant; a liquid-side port connected to piping for a liquid refrigerant; a refrigerant path that links the gas-side port to the liquid-side port; at least four heat exchange part regions that perform heat exchange between air and the refrigerant flowing through the refrigerant path; and a branching and merging part that branches and merges the refrigerant path to connect the heat exchange part regions in series between the gas-side port and the liquid-side port through the refrigerant path. The heat exchange part regions are connected to each other through the branching and merging part so as to allow the number of refrigerant paths provided in the heat exchange part region near the gas-side port to be greater than the number of refrigerant paths provided in the heat exchange part region near the liquid-side port.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: February 2, 2021
    Assignee: HITACHI-JOHNSON CONTROLS AIR CONDITIONING, INC.
    Inventors: Mikihito Tokudi, Koji Naito, Kazumoto Urata, Kenji Matsumura, Kazuhiko Tani, Masayoshi Murofushi, Takumi Kamiaka
  • Patent number: 10670311
    Abstract: The present invention provides a heat exchanger having a heat exchanging portion HE including a plurality of paths through which a refrigerant flows and a plurality of columns of fin plate that exchange heat between the refrigerant and air, wherein, in a case where the heat exchanging portion functions as a condenser, the refrigerant is flown from a header into the heat exchanging portion HE via the plurality of paths, every two paths of the plurality of paths merge into one single path by branching/merging pipes after the refrigerant has flown through one fin plate, before the refrigerant flows through the other fin plate so as to flow out of the heat exchanging portion HE, wherein a difference in height between the highest path and the lowest path in a vertical direction is set equal to or less than half of a height of the heat exchanging portion HE.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: June 2, 2020
    Assignee: Hitachi-Johnson Controls Air Conditioning, Inc.
    Inventors: Kenji Matsumura, Kazumoto Urata, Koji Naito, Mikihito Tokudi
  • Publication number: 20180306515
    Abstract: An air conditioner that includes a heat exchanger including: heat-transfer pipes extending in a horizontal direction and spaced apart at predetermined intervals in a vertical direction and configured to allow a thermal medium to flow therein. A part of the heat transfer pipes are used for at least one inflow path into which the thermal medium flows from the outside of the heat exchanger and the other part of the heat transfer pipes are used for at least one outflow path from which the thermal medium flows out to the outside. At least one connection pipe through which an outlet side of one of the at least one inflow path communicates with an inlet side of one of the at least one outflow path.
    Type: Application
    Filed: June 27, 2018
    Publication date: October 25, 2018
    Inventors: Shuuhei TADA, Kenji MATSUMURA, Nagatoshi OOKI, Mamoru HOUFUKU, Takeshi ENDO
  • Publication number: 20180259265
    Abstract: A heat exchanger includes: a gas-side port connected to piping for a gaseous refrigerant; a liquid-side port connected to piping for a liquid refrigerant; a refrigerant path that links the gas-side port to the liquid-side port; at least four heat exchange part regions that perform heat exchange between air and the refrigerant flowing through the refrigerant path; and a branching and merging part that branches and merges the refrigerant path to connect the heat exchange part regions in series between the gas-side port and the liquid-side port through the refrigerant path.
    Type: Application
    Filed: September 10, 2015
    Publication date: September 13, 2018
    Inventors: Mikihito TOKUDI, Koji NAITO, Kazumoto URATA, Kenji MATSUMURA, Kazuhiko TANI, Masayoshi MUROFUSHI, Takumi KAMIAKA
  • Publication number: 20170284717
    Abstract: An air conditioner 1 includes: an outdoor heat exchanger 14; an outdoor fan 12 for blowing air to the outdoor heat exchanger; an outdoor fan motor 20 that drives the outdoor fan; an outdoor fan inverter 21 that drives the outdoor fan motor; and a control unit 31 that generates a rotation-speed command voltage for controlling the rotation number of the outdoor fan motor. In addition, the control unit starts a defrost operation of the outdoor heat exchanger, based on the rotation-speed command voltage. In this manner, it is possible to achieve an outdoor device of an air conditioner in which there is no need to provide a current detecting sensor, and it is possible to detect frost formation over the heat exchanger during a heating operation and to perform a defrost operation at low costs.
    Type: Application
    Filed: November 26, 2014
    Publication date: October 5, 2017
    Applicant: Johnson Controls-Hitachi Air Conditioning Technology (Hong Kong) Limited
    Inventors: Natsuko SUZUKI, Koji NAITO, Kenji MATSUMURA, Kazumoto URATA
  • Publication number: 20160348951
    Abstract: The present invention provides a heat exchanger having a heat exchanging portion HE including a plurality of paths through which a refrigerant flows and a plurality of columns of fin plate that exchange heat between the refrigerant and air, wherein, in a case where the heat exchanging portion functions as a condenser, the refrigerant is flown from a header into the heat exchanging portion HE via the plurality of paths, every two paths of the plurality of paths merge into one single path by branching/merging pipes after the refrigerant has flown through one fin plate, before the refrigerant flows through the other fin plate so as to flow out of the heat exchanging portion HE, wherein a difference in height between the highest path and the lowest path in a vertical direction is set equal to or less than half of a height of the heat exchanging portion HE.
    Type: Application
    Filed: May 26, 2016
    Publication date: December 1, 2016
    Inventors: Kenji MATSUMURA, Kazumoto URATA, Koji NAITO, Mikihito TOKUDI
  • Patent number: 8742554
    Abstract: A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: June 3, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Patent number: 8739401
    Abstract: A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: June 3, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Patent number: 8420446
    Abstract: A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 ?m or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: April 16, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shimazaki Yo, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Patent number: 8274877
    Abstract: An optical pickup (10) includes a light emitting element (11), a holding member (14), a light receiving element (18), and a base (13). The holding member (14) is fixed to the base (13) by a combined bonding portion (17). The combined bonding portion (17) is sandwiched between the holding member (14) and the base (13) so as to fix the holding member (14) to the base (13). The combined bonding portion (17) includes a first bonding portion (15) composed of a first adhesive and a second bonding portion (16) composed of a second adhesive having a higher curing shrinkage rate than the first adhesive. The first bonding portion (15) and the second bonding portion (16) are each sandwiched between the holding member (14) and the base (13), and the second bonding portion (16) is provided to cover at least a part of an outer peripheral surface of the first bonding portion (15). A difference between the curing shrinkage rate of the first adhesive and that of the second adhesive is 3.0% or less.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: September 25, 2012
    Assignee: Panasonic Corporation
    Inventors: Masatoshi Yajima, Kenji Matsumura, Hideki Hayashi, Yoshiyuki Hashimoto
  • Publication number: 20110117704
    Abstract: A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 ?m or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 19, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Publication number: 20100325885
    Abstract: A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
    Type: Application
    Filed: September 9, 2010
    Publication date: December 30, 2010
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Publication number: 20100329101
    Abstract: A dichroic mirror is a wedge-shaped quadrangular prism whose cross-section is a trapezoid having an upper base d and a lower base d+?d. The dichroic mirror receives on its top surface parallel light emitted from a collimating lens and reflects, off the top surface, most of the parallel light towards a wavelength plate. Moreover, the dichroic mirror transmits, through the top surface, part of the parallel light to output the part of the parallel light from a bottom surface facing the top surface toward a front monitor. The dichroic mirror has, on the bottom surface thereof, an inclination of an angle ? with respect to the top surface in a direction where a normal vector N of the bottom surface intersects with an xy-plane formed of: an optical axis x of incident light from the collimating lens; and an optical axis y of light emitted towards the wavelength plate.
    Type: Application
    Filed: June 21, 2010
    Publication date: December 30, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Yasushi Kobayashi, Masatoshi Yajima, Tomoaki Tojo, Kenji Matsumura
  • Publication number: 20100061211
    Abstract: An optical pickup (10) includes a light emitting element (11), a holding member (14), a light receiving element (18), and a base (13). The holding member (14) is fixed to the base (13) by a combined bonding portion (17). The combined bonding portion (17) is sandwiched between the holding member (14) and the base (13) so as to fix the holding member (14) to the base (13). The combined bonding portion (17) includes a first bonding portion (15) composed of a first adhesive and a second bonding portion (16) composed of a second adhesive having a higher curing shrinkage rate than the first adhesive. The first bonding portion (15) and the second bonding portion (16) are each sandwiched between the holding member (14) and the base (13), and the second bonding portion (16) is provided to cover at least a part of an outer peripheral surface of the first bonding portion (15). A difference between the curing shrinkage rate of the first adhesive and that of the second adhesive is 3.0% or less.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 11, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Masatoshi YAJIMA, Kenji MATSUMURA, Hideki HAYASHI, Yoshiyuki HASHIMOTO
  • Publication number: 20090303875
    Abstract: A congestion control system according to an exemplary aspect of the present invention includes an SIP (Session Initiation Protocol) terminal of a subscriber; a call session control device that accommodates the subscriber using SIP, and includes a notification unit that inserts server information of the call session control device including at least an acceptable number of calls in an SIP response message; and a border gateway device that includes a control device of VoIP (Voice over Internet Protocol) services, and a congestion control unit that performs congestion control for the call session control device based on the server information of the SIP response message notified by the call session control.
    Type: Application
    Filed: June 3, 2009
    Publication date: December 10, 2009
    Inventor: Kenji MATSUMURA
  • Patent number: 7548172
    Abstract: The present invention is directed to vehicle communication equipment capable of transferring information using light without adding new light emitting means, and further, between a stationary apparatus and a vehicle or between vehicles. A light emitted from a signal lamp (11) of a stationarily installed traffic signal (10) or a head lamp (35) or a tail lamp (36) of a vehicle (20) is superimposed with a signal by a modulator (13), the modulated light is received by a light receiving unit (21) of the vehicle (20) side, and the received modulated light is demodulated by a decoder (22) to be displayed on a display panel (24).
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: June 16, 2009
    Assignee: Sony Corporation
    Inventors: Akira Shinada, Kenji Matsumura
  • Publication number: 20090146280
    Abstract: A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 ?m or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.
    Type: Application
    Filed: November 28, 2006
    Publication date: June 11, 2009
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa
  • Publication number: 20090039486
    Abstract: A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
    Type: Application
    Filed: April 26, 2006
    Publication date: February 12, 2009
    Inventors: Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa