Patents by Inventor Kenji Miura

Kenji Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210108218
    Abstract: An expression system is provided, including a first nucleic acid fragment containing a long intergenic region (LIR) derived from geminivirus, a small intergenic region (SIR) derived from geminivirus, and an expression cassette of a target protein linked between the LIR and the SIR and a second nucleic acid fragment containing an expression cassette of a Rep/RepA protein derived from geminivirus, in which the expression cassette of the target protein includes a promoter, a nucleic acid fragment encoding the target protein, and two or more linked terminators in this order.
    Type: Application
    Filed: March 6, 2018
    Publication date: April 15, 2021
    Applicant: University of Tsukuba
    Inventors: Kenji MIURA, Hiroshi EZURA, Ken HOSHIKAWA
  • Patent number: 10980114
    Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 13, 2021
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Eiko Imazaki, Koji Nitta, Kousuke Miura, Shoichiro Sakai, Kenji Takahashi, Masahiro Matsumoto, Hirohisa Saito
  • Patent number: 10917967
    Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 ?m or greater and 35 ?m or less at the first surface, and is 3 ?m or greater and 15 ?m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 ?m or greater and 12 ?m or less.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 9, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kenji Takahashi, Eiko Imazaki, Koji Nitta, Shoichiro Sakai, Kousuke Miura, Masahiro Matsumoto, Hirohisa Saito
  • Patent number: 10892158
    Abstract: A manufacturing process of a semiconductor device including a SiGe channel can form a Si segregation layer for protecting the SiGe channel without damaging the SiGe channel. A manufacturing method of a semiconductor device includes: a first step for performing plasma processing on a semiconductor substrate having a silicon layer and a silicon germanium layer formed on the silicon layer under a first condition to expose the silicon germanium layer; and a second step for performing plasma processing on the semiconductor substrate under a second condition to segregate silicon on the surface of the exposed silicon germanium layer. The silicon germanium layer or layers lying adjacent to the silicon germanium layer can be etched under the first condition, hydrogen plasma processing is performed under the second condition, and the first step and the second step are executed in series in the same processing chamber of a plasma processing apparatus.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: January 12, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Makoto Miura, Yohei Ishii, Satoshi Sakai, Kenji Maeda
  • Publication number: 20200413537
    Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, and including a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first surface and the second surface of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator, an average diameter of the through-hole at the first surface of the insulator is 20 ?m or greater and 35 ?m or less, the average diameter of the through-hole at the second surface of the insulator is 3 ?m or greater and 15 ?m or less, and an average thickness of the metal plated layer formed on the first surface and the second surface of the insulator is 8 ?m or greater and 12 ?m or less.
    Type: Application
    Filed: March 6, 2019
    Publication date: December 31, 2020
    Inventors: Kenji TAKAHASHI, Eiko IMAZAKI, Koji NITTA, Shoichiro SAKAI, Kousuke MIURA, Masahiro MATSUMOTO, Hirohisa SAITO
  • Patent number: 10801671
    Abstract: A gas supply system (2) includes a compressor unit (21), an accumulator unit (23), a pre-cooling system (24) and a housing (4). In the gas supply system (2), the compressor unit (21) is vertically arranged and the pre-cooling system (24) is arranged above the accumulator unit (23) in the housing (4). The compressor unit (21) and the accumulator unit (23) are covered by one rectangular parallelepiped housing (4).
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: October 13, 2020
    Assignee: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Kenji Nagura, Tetsuya Kakiuchi, Takashi Okuno, Koji Noishiki, Akitoshi Fujisawa, Shinichi Miura
  • Publication number: 20200318125
    Abstract: It is an object of the present invention to provide a method for introducing a protein into a plant, which is simple and extensively applicable to various types of plant cells and proteins. The above object is achieved by the present invention to provide a complex comprising a protein of interest to be introduced into a target plant cell and a carrier peptide, a method for introducing a protein of interest into a target plant cell using the complex, and a kit comprising a protein of interest to be introduced into a target plant cell and a carrier peptide.
    Type: Application
    Filed: January 19, 2017
    Publication date: October 8, 2020
    Applicant: RIKEN
    Inventors: Keiji NUMATA, Yoko HORII, Takeshi YOSHIZUMI, Taku DEMURA, Yutaka KODAMA, Takashi YAMAMOTO, Tetsushi SAKUMA, Kenji MIURA, Hiroshi EZURA
  • Publication number: 20200312658
    Abstract: A manufacturing process of a semiconductor device including a SiGe channel can form a Si segregation layer for protecting the SiGe channel without damaging the SiGe channel. A manufacturing method of a semiconductor device includes: a first step for performing plasma processing on a semiconductor substrate having a silicon layer and a silicon germanium layer formed on the silicon layer under a first condition to expose the silicon germanium layer; and a second step for performing plasma processing on the semiconductor substrate under a second condition to segregate silicon on the surface of the exposed silicon germanium layer. The silicon germanium layer or layers lying adjacent to the silicon germanium layer can be etched under the first condition, hydrogen plasma processing is performed under the second condition, and the first step and the second step are executed in series in the same processing chamber of a plasma processing apparatus.
    Type: Application
    Filed: April 1, 2019
    Publication date: October 1, 2020
    Inventors: Makoto MIURA, Yohei ISHII, Satoshi SAKAI, Kenji MAEDA
  • Patent number: 10786836
    Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Kazuhiro Fujita, Hiroki Tsujikawa, Yuya Tsuchihashi, Kenji Takemoto
  • Patent number: 10755951
    Abstract: In a substrate processing apparatus, an outer edge portion of a substrate in a horizontal state is supported from below by an annular substrate supporting part, and a lower surface facing part having a facing surface facing a lower surface of the substrate is provided inside the substrate supporting part. A gas ejection nozzle for ejecting heated gas toward the lower surface is provided in the lower surface facing part, and the substrate is heated by the heated gas when an upper surface of the rotating substrate is processed with a processing liquid ejected from an upper nozzle. Further, a lower nozzle is provided in the lower surface facing part, to thereby perform a processing on the lower surface with a processing liquid. Since the gas ejection nozzle protrudes from the facing surface, a flow of the processing liquid into the gas ejection nozzle can be suppressed during the processing.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: August 25, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kenji Izumoto, Takemitsu Miura, Kenji Kobayashi, Kazuhide Saito, Akihisa Iwasaki
  • Publication number: 20200236791
    Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.
    Type: Application
    Filed: May 21, 2018
    Publication date: July 23, 2020
    Inventors: Junichi MOTOMURA, Koji NITTA, Shoichiro SAKAI, Kenji TAKAHASHI, Maki IKEBE, Kousuke MIURA, Masahiro ITOH
  • Publication number: 20200196445
    Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.
    Type: Application
    Filed: July 24, 2018
    Publication date: June 18, 2020
    Inventors: Eiko IMAZAKI, Koji NITTA, Kousuke MIURA, Shoichiro SAKAI, Kenji TAKAHASHI, Masahiro MATSUMOTO, Hirohisa SAITO
  • Patent number: 10655488
    Abstract: In a gas turbine in which a seal member seals a gap between a transition piece and a nozzle end wall in a turbine first stage, the transition piece and the nozzle end wall has a seal groove. The seal member includes a hook portion that slides in the turbine radial direction with respect to the flange and a seal plate portion inserted in the groove. The groove and the portion are configured to include a surface contact region in which a surface of the groove and the portion are in surface contact with each other, a non-contact region disposed on a side closer to the transition piece than the region, and a hole provided at the portion so as to face the surface in the groove across a gap in the region.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: May 19, 2020
    Assignee: Mitsubishi Hitachi Power Systems, Ltd.
    Inventors: Yasuhiro Horiuchi, Shinichi Higuchi, Hisato Tagawa, Kenji Shingai, Takemitsu Miura
  • Patent number: 10634283
    Abstract: A gas supply system—includes a compressor unit, an accumulator unit, a pre-cooling system and a housing. In the gas supply system, the compressor unit is vertically arranged and the pre-cooling system is arranged above the accumulator unit in the housing. The compressor unit and the accumulator unit are covered by one rectangular parallelepiped housing.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: April 28, 2020
    Assignee: Kobe Steel, Ltd.
    Inventors: Kenji Nagura, Tetsuya Kakiuchi, Takashi Okuno, Koji Noishiki, Akitoshi Fujisawa, Shinichi Miura
  • Patent number: 10591853
    Abstract: A moving device, which is included in an image forming apparatus, includes a cam, a moving body, a biasing body, a drive source and a drive transmission device. The moving body is configured to be moved by the cam. The biasing body is configured to apply a biasing force to bias the moving body toward the cam. The drive source is configured to apply a driving force to the cam. The drive transmission device is configured to transmit the driving force to the cam and includes a load applying body configured to apply a load to a rotation of the cam.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: March 17, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenji Tomita, Kimihiro Tanaka, Yohei Miura, Hiroaki Nieda
  • Patent number: 10548217
    Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: January 28, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Kenji Takahashi, Kouji Nitta, Shoichiro Sakai, Junichi Motomura, Maki Ikebe, Kousuke Miura, Masahiro Itou
  • Publication number: 20200015353
    Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.
    Type: Application
    Filed: February 7, 2018
    Publication date: January 9, 2020
    Inventors: Kenji TAKAHASHI, Kouji NITTA, Shoichiro SAKAI, Junichi MOTOMURA, Maki IKEBE, Kousuke MIURA, Masahiro ITOU
  • Patent number: 10479275
    Abstract: Provided is a device whereby it is possible to accurately recognize which area has been enlarged when part of an overhead image displayed on a monitor is displayed as enlarged. When any one area of a plurality divided areas (D1-D4) is indicated, the divided areas being a result of dividing an overhead image displayed on a monitor (21), an image of the indicated divided area (D1-D4) is set as an image to be enlarged, and an auxiliary display area (21B) is set as an enlarged display area. Enlarged display unit forms a plurality of intermediate images (M) of an intermediate size between the size of the indicated divided area (D2) and the size of the enlarged display area, and the intermediate images are sequentially displayed beginning with the smallest intermediate image (M), using the indicated divided area (D2) as an origin point.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: November 19, 2019
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hidehiko Miyoshi, Noboru Nagamine, Kenji Miura, Kinji Yamamoto, Kenjiro Goto
  • Publication number: 20180178725
    Abstract: Provided is a device whereby it is possible to accurately recognize which area has been enlarged when part of an overhead image displayed on a monitor is displayed as enlarged. When any one area of a plurality divided areas (D1-D4) is indicated, the divided areas being a result of dividing an overhead image displayed on a monitor (21), an image of the indicated divided area (D1-D4) is set as an image to be enlarged, and an auxiliary display area (21B) is set as an enlarged display area. Enlarged display unit forms a plurality of intermediate images (M) of an intermediate size between the size of the indicated divided area (D2) and the size of the enlarged display area, and the intermediate images are sequentially displayed beginning with the smallest intermediate image (M), using the indicated divided area (D2) as an origin point.
    Type: Application
    Filed: February 8, 2018
    Publication date: June 28, 2018
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hidehiko Miyoshi, Noboru Nagamine, Kenji Miura, Kinji Yamamoto, Kenjiro Goto
  • Patent number: 9969836
    Abstract: A radical-polymerizable resin composition comprising one or more metal-containing compounds (A) selected from a metal soap (A1) and a ?-diketone skeleton-containing metal complex (A2); one or more thiol compounds (B) selected from a secondary thiol compound (B1) and a tertiary thiol compound (B2); and a radical-polymerizable compound (C) can stably cure under a dry condition, in water and in seawater and further on a wet substrate. The radical-polymerizable resin composition is useful as a repairing material for inorganic structure, a radical-polymerizable coating composition, a concrete spall preventing curable material, a reinforcing fiber-containing composite material, etc.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: May 15, 2018
    Assignee: SHOWA DENKO K.K.
    Inventors: Kunihiro Kuroki, Kenji Miura, Yoichiro Sakaguchi, Kohei Saito