Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

Abstract: A door trim includes a first board member having a plate shape and a hole that is through the first board member, and a second board member having a plate shape and including a functional part integrally therewith. The second board member overlaps the first board member, and the functional part is in the hole and exposed to a vehicular interior side.

Abstract: Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.

Abstract: This liquid crystal display device (100) includes: a vertical alignment liquid crystal layer (30); first and second substrates (10, 20); first and second electrodes (11, 21) arranged on the first and second substrates to face the liquid crystal layer; and two photo-alignment films (12, 22). Each pixel region includes first and second liquid crystal domains, of which the reference alignment directions defined by the two photo-alignment films are a first direction and a second direction different from the first direction, respectively. The first electrode has a slit cut region (11R1), through which a slit (11s) has been cut to run substantially parallel to the reference alignment direction, in a part of a region allocated to each of the first and second liquid crystal domains. The width (W) of the slit is set so that when the highest grayscale voltage is applied to the first electrode, an effective applied voltage decreases by at least 0.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: A projector is provided, having a light source emitting a laser beam; an optical element, which the laser beam emitted by the light source passes through; a projection component, projecting an image onto a projection surface by irradiating the laser beam emitted from the optical element onto the projection surface while scanning. The optical element has an incident surface, where the laser beam emitted by the light source is incident; and an emitting surface, where the laser beam incident to the incidence surface is emitted. A first lens surface, shaping a beam shape of the laser beam from elliptic into circular by astigmatism generated in the laser beam, is formed on one of the incident and the emitting surfaces, and a second lens surface, converting the laser beam from a divergent beam into a parallel beam, is formed on the other one of the incident the emitting surfaces.

Abstract: A vehicular interior part includes a porous fiber base member made of an inorganic fiber sheet, thermoplastic resin, and a foaming agent, a skin attached on one surface of the porous fiber base member and constitutes a design surface, and a mold portion included in a part of the porous fiber base member and the skin that are attached to each other, the mold portion having a recess portion on a skin surface side and a projection portion on a side opposite from the skin surface side, the recess portion having an opening on the design surface and having a depth equal to or greater than an opening width of the recess portion.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.

Abstract: A component mounting line includes an inspecting apparatus and a component mounting apparatus. The inspecting apparatus measures a solder volume of a printed solder on each electrode of a board. The component mounting apparatus includes a mounting unit that mounts an electronic component on the board, at least one component supply unit that supplies a chip solder, and a control unit that controls the mounting unit to mount the chip solder supplied from the component supply unit based on production data in which a size of the chip solder is instructed corresponding to the solder volume measured for each of component terminals corresponding to each electrode of the board.

Abstract: A method evaluates the mobility of a polymer composition in a high-temperature region of 150° C. or above. The method for evaluating a physical property of a polymer composition, the method comprising the steps of: obtaining a thin film sample which is formed on a substrate and which comprises: a fluorescent probe including a fluorescent rare earth complex having a melting point of 200° C. or higher; and a target polymer composition; and obtaining a relationship between a temperature and a fluorescent characteristic of the thin film.

Abstract: A blood flow image diagnosing device of the present invention includes a laser light irradiation system for applying laser light to an observation region of a biotissue having blood cells; a light receiving section having a plurality of pixels and adapted to detect reflection light from the observation region of the biotissue; an image capturing section for successively capturing a plurality of images on the basis of a signal from the light receiving section; an image storage section for storing the plurality of images; a computation section for computing the speed of blood flow within the biotissue from time course changes of output signals of the pixels throughout the stored images; and a display section for displaying a two-dimensional distribution which is the result of the computation as a blood flow map.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Abstract: A time period required for replacement work of a divided cable is shortened. An electrostatic coating cable (6) includes a power supply line (12) that supplies power to a high voltage generator (2), a signal line (14) that controls the high voltage generator (2), and a ground line (16). The power supply line (12) and the ground line (16) are connected by a first inspection line (18), the signal line (14) and the ground wire (16) are connected by a second inspection line (20), a first diode (22) is interposed in the first inspection line (18), and a second diode (24) is interposed in the second inspection line (20). The first and the second diodes (22) and (24) inhibit a current from flowing through the first and the second inspection lines (18) and (20) during an operation of the electrostatic coater (1).

Abstract: A power semiconductor module includes a metal plate having a through hole with an eaves; an insulated metal block including a metal block having an element mounting region on an upper surface, and an insulating layer on surfaces other than the upper surface and a portion of the upper surface other than the element mounting region; a circuit pattern disposed over the metal plate with the insulating material interposed therebetween; a power semiconductor element fixed to the element mounting region of the upper surface of the metal block; and a connection conductor connecting the power semiconductor element and the circuit pattern. The insulated metal block is fitted into the through hole in the metal plate so that the insulating layer on the upper surface of the insulated metal block contacts the eaves of the through hole to electrically insulate between the metal block and the metal plate.

Abstract: A headrest has a pad that is formed integrally with an outer cover by foam molding, and is also provided with: a low-resilience layer that is set in a front part of the pad and has lower resilience than the pad; a support member that is harder than the pad and supports the low-resilience layer from a backside of the low-resilience layer; and a blocking member that is located at a position to cover a contact area of the low-resilience layer and the support member from an outer circumference side while being in contact with at least one of the low-resilience layer and the support member and blocks infiltration of a foamed resin material of the pad into the contact area.

Abstract: A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration.

Abstract: A power semiconductor module includes a metal plate having a through hole with an eaves; an insulated metal block including a metal block having an element mounting region on an upper surface, and an insulating layer on surfaces other than the upper surface and a portion of the upper surface other than the element mounting region; a circuit pattern disposed over the metal plate with the insulating material interposed therebetween; a power semiconductor element fixed to the element mounting region of the upper surface of the metal block; and a connection conductor connecting the power semiconductor element and the circuit pattern. The insulated metal block is fitted into the through hole in the metal plate so that the insulating layer on the upper surface of the insulated metal block contacts the eaves of the through hole to electrically insulate between the metal block and the metal plate.