Abstract: A photodetector comprising: a separation region that is provided in a semiconductor substrate and defines a pixel region; a hole accumulation region that is provided in the semiconductor substrate of the pixel region along a side surface of the separation region; a multiplication region that is provided in the semiconductor substrate of the pixel region and is configured by joining a first conductivity type region and a second conductivity type region from the surface side of the semiconductor substrate in the thickness direction of the semiconductor substrate; and an insulating region provided in the semiconductor substrate in a region between the multiplication region and the hole accumulation region, wherein a formation depth of the insulating region is larger than a formation depth of the first conductivity type region.

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

Abstract: A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

Abstract: The present invention relates to a swimsuit that is made of a stretchable fabric and covers at least a portion of the thighs and the hips when worn, wherein two or more band-like tightening portions are arranged so as to extend in the body length direction from each of the left and right hips to the corresponding thigh such that the tightening portions intersect each other, and the intersection of the two or more band-like tightening portions is located between the top of the hip and proximal ? of the hamstrings. Thus, a swimsuit is provided that can stabilize the posture in water and support the movements of the hamstrings.

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a protective overcoat layer positioned above the surface of the substrate, and a sphere-shaped magnetic concentrator positioned above the protective overcoat layer. Instead of or in addition to the sphere-shaped magnetic concentrator, the structure may include an embedded magnetic concentrator positioned within the substrate and below the horizontal-type Hall sensor.

Abstract: A coil component that can be made thinner while ensuring sufficient magnetic characteristics includes a magnetic part, a conductor part, and multiple insulator parts. The magnetic part is constituted by magnetic alloy grains. The conductor part has multiple winding parts and is wound around one axis inside the magnetic part. The multiple insulator parts are each placed between the multiple winding parts, each having a winding shape that includes two joining surfaces that are respectively joined to two winding parts facing each other at least partially in the direction of the one axis, and are each constituted by electrically insulating grains.

Abstract: A coil component has a magnetic body of rectangular solid shape, a coil with N turns (N is a positive number of 2 or greater) provided inside the magnetic body, an insulating intermediate part, and external electrodes. The coil has a first conductor layer, a second conductor layer, and an inter-layer connection part. The first conductor layer has a first multiple winding part which is wound around one axis with a first spacing. The second conductor layer has a second multiple winding part which is wound around the one axis with the first spacing and faces the first conductor layer. The insulating intermediate part is provided inside the magnetic body and forms, between the first conductor layer and second conductor layer, a second spacing corresponding to a thickness equal to or less than the product of the first spacing and (N?1).

Abstract: A magnetic material has: multiple soft magnetic alloy grains that contain Fe, element L (where element L is Si, Zr, or Ti), and element M (where element M is not Si, Zr, or Ti, and oxidizes more easily than Fe); a first oxide film that contains element L and covers each of the multiple soft magnetic alloy grains; a second oxide film that contains element M and covers the first oxide film; a third oxide film that contains element L and covers the second oxide film; a fourth oxide film that contains Fe and covers the third oxide film; and bonds that are constituted by parts of the fourth oxide film and that bond the multiple soft magnetic alloy grains together.