Patents by Inventor Kenji Ozeki
Kenji Ozeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240395786Abstract: A light emitting device including a substrate having a substantially rectangular shape when viewed in plan view, light emitting elements arranged along a first long side of the substantially rectangular shape of the substrate, light transmissive members each disposed on an upper surface of each of the light emitting elements, and a cover member having a substantially rectangular shape when viewed in plan view. The cover member covering an upper surface of the substrate, and exposing upper surfaces of the light transmissive members. The device includes terminals exposed from the cover member. The terminals being arranged along a second long side of the substantially rectangular shape of the substrate, and being capable of individually driving the light emitting elements. When viewed in the plan view, a long side of the substantially rectangular shape of the cover member overlaps with at least one of the first and the second long sides.Type: ApplicationFiled: July 29, 2024Publication date: November 28, 2024Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Hiroki FUKUTA
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Patent number: 12119434Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.Type: GrantFiled: July 25, 2023Date of Patent: October 15, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20240332263Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members disposed on the respective light emitting elements; a covering member covering lateral surfaces of the light transmissive members and lateral surfaces of the light emitting elements, wherein upper surfaces of the light transmissive members are exposed from the covering member, and wherein the covering member defines a first groove that opens at an upper surface of the covering member and is located between adjacent ones of the light transmissive members; a light shielding member covering a surface of the covering member that defines the first groove; and an air layer disposed on the light shielding member in the first groove.Type: ApplicationFiled: March 22, 2024Publication date: October 3, 2024Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Midori HAYASHI
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Patent number: 12080835Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.Type: GrantFiled: February 27, 2023Date of Patent: September 3, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 12080695Abstract: A method that includes providing a substrate having first and second regions for forming first and second light emitting devices, respectively, that are axisymmetrical in plan view with respect to a boundary line extending between the regions. The method includes mounting first and second light emitting elements in the first and second regions, respectively, arranging first and second light transmissive members respectively thereon, and arranging a covering member to collectively cover at least a portion of the first and second light emitting devices. The first and second devices have external connection terminals that are exposed. The terminals of the first light emitting device are on a side of the first light emitting device opposite to a side thereof adjacent the boundary line, and the terminals of the second light emitting device are on a side thereof opposite to a side of the second light emitting device adjacent the boundary line.Type: GrantFiled: September 8, 2023Date of Patent: September 3, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Hiroki Fukuta
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Publication number: 20240266480Abstract: A light-emitting device includes: a package having an upper surface and defining a recess including an opening located at the upper surface; a light-emitting element disposed on a surface that defines a bottom of the recess of the package; and a sealing member disposed in the recess of the package and covering the light-emitting element. The upper surface of the sealing member includes a flat region. The flat region includes at least a region located above the light-emitting element. The flat region is located below the upper surface of the package.Type: ApplicationFiled: April 18, 2024Publication date: August 8, 2024Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11996502Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.Type: GrantFiled: March 13, 2020Date of Patent: May 28, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 11876153Abstract: A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.Type: GrantFiled: March 10, 2023Date of Patent: January 16, 2024Assignee: NICHIA CORPORATIONInventors: Tomonori Miyoshi, Kenji Ozeki, Tomoaki Tsuruha
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Publication number: 20230420435Abstract: A method that includes providing a substrate having first and second regions for forming first and second light emitting devices, respectively, that are axisymmetrical in plan view with respect to a boundary line extending between the regions. The method includes mounting first and second light emitting elements in the first and second regions, respectively, arranging first and second light transmissive members respectively thereon, and arranging a covering member to collectively cover at least a portion of the first and second light emitting devices. The first and second devices have external connection terminals that are exposed. The terminals of the first light emitting device are on a side of the first light emitting device opposite to a side thereof adjacent the boundary line, and the terminals of the second light emitting device are on a side thereof opposite to a side of the second light emitting device adjacent the boundary line.Type: ApplicationFiled: September 8, 2023Publication date: December 28, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Hiroki FUKUTA
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Publication number: 20230378408Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.Type: ApplicationFiled: July 25, 2023Publication date: November 23, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11791324Abstract: A light emitting device includes a substrate, a light emitting element, and a protective element. The substrate includes a support member and a plurality of wirings disposed on an upper surface of the support member. The substrate has a first side extending in a first direction and a second side opposite to the first side. The light emitting element is disposed on an upper surface of the substrate, and the protective element is disposed on the upper surface of the substrate. The plurality of wirings has a plurality of external connecting portions disposed adjacent to the first side and arranged in the first direction in a plan view. The protective element is disposed between the light emitting element and the second side of the substrate.Type: GrantFiled: June 10, 2022Date of Patent: October 17, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Hiroki Fukuta
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Patent number: 11791448Abstract: A light-emitting device includes: a light-emitting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.Type: GrantFiled: May 4, 2022Date of Patent: October 17, 2023Assignee: NICHIA CORPORATIONInventors: Atsushi Kojima, Kenji Ozeki, Chinami Nakai
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Patent number: 11764342Abstract: A light emitting device includes: a mounting board; a plurality of light emitting elements disposed on the mounting board; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a first cover member located on or above the mounting board, the first cover member including: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements.Type: GrantFiled: September 29, 2021Date of Patent: September 19, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 11757078Abstract: A light emitting device includes: a package in which a recess is defined; a light emitting element mounted on a bottom surface defining the recess; a first reflecting layer covering lateral surfaces defining the recess; and a second reflecting layer covering the bottom surface defining the recess, wherein the second reflecting layer is in contact with the first reflecting layer, wherein at least a portion of lateral surfaces of the light emitting element is exposed from the second reflecting layer.Type: GrantFiled: August 10, 2021Date of Patent: September 12, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 11725796Abstract: A light-emitting module includes a first substrate, a heat dissipation member, a second substrate, and a light-emitting element. The heat dissipation member is disposed on the first substrate. The second substrate is disposed on the heat dissipation member. The light-emitting element is disposed on a lower surface of the first substrate or an upper surface of the second substrate. The heat dissipation member includes a graphite member and a metal member. The graphite member has a first surface facing the first substrate and a second surface located opposite to the first surface. The graphite member has a first groove extending in a first direction in the first surface. The metal member includes a first internal metal member disposed in the first groove.Type: GrantFiled: June 28, 2022Date of Patent: August 15, 2023Assignee: NICHIA CORPORATIONInventors: Yoshiyuki Kageyama, Kenji Ozeki
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Publication number: 20230216000Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.Type: ApplicationFiled: February 27, 2023Publication date: July 6, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Publication number: 20230207745Abstract: A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.Type: ApplicationFiled: March 10, 2023Publication date: June 29, 2023Applicant: Nichia CorporationInventors: Tomonori MIYOSHI, Kenji OZEKI, Tomoaki TSURUHA
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Patent number: 11626543Abstract: A light emitting apparatus includes: an electrically insulating base member that has first and second sides extending in a width direction, and third and fourth sides extending in a length direction, wherein the third and fourth sides are longer than the first and second sides; a plurality of electrically conductive pattern portions; a plurality of light emitting devices mounted on the electrically conductive pattern portions, the light emitting devices being arrayed in the length direction; a protection element that is flip chip mounted on the electrically conductive pattern portions and located, in the plan view, between the light emitting devices and the third side of the base member in the width direction; a first resin part that has a frame shape; a second resin part that is located in the first resin part; and at least one transparent member located on the light emitting devices.Type: GrantFiled: July 2, 2020Date of Patent: April 11, 2023Assignee: NICHIA CORPORATIONInventors: Tomonori Miyoshi, Kenji Ozeki, Tomoaki Tsuruha
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Publication number: 20230100081Abstract: A light emitting device includes a light emitting element and a light reflecting member that reflects light emitted from the light emitting element. The light reflecting member comprises plate-shaped light reflective particles, silica, and an alkali metal. An average particle size of the light reflective particles is 0.6 ?m to 43 ?m, and an average aspect ratio of the light reflective particles is 10 or higher.Type: ApplicationFiled: September 28, 2022Publication date: March 30, 2023Applicant: NICHIA CORPORATIONInventors: Taekshi KUSUSE, Kazuya TAMURA, Daisuke KISHIKAWA, Takuya YAMANOI, Takaaki TADA, Kenji OZEKI
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Publication number: 20230099246Abstract: A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.Type: ApplicationFiled: August 19, 2022Publication date: March 30, 2023Applicant: NICHIA CORPORATIONInventors: Hiroaki KAGEYAMA, Koji NISHINO, Kenji OZEKI