Abstract: Provided are: a mechanical property measuring apparatus and method that can accurately measure a mechanical property through physical quantities; a substance manufacturing equipment and method that can improve the production yield rate. A mechanical property measuring apparatus (100) comprises: a physical quantity measuring unit (5) configured to measure a plurality of physical quantities of a measured object that includes a substance and a film on a surface of the substance; a classification processing unit (81) configured to select one of a plurality of calculation models (M1, M2, . . . , Mn) for calculating a mechanical property of the substance, based on at least two of the plurality of physical quantities measured; and a mechanical property calculating unit (82) configured to calculate the mechanical property of the substance using the calculation model selected by the classification processing unit (81) and the at least two of the plurality of physical quantities.

Abstract: Provided are: a mechanical property measuring apparatus and method that can accurately measure a mechanical property through physical quantities; a substance manufacturing equipment and method that can improve the production yield rate and high-quality substance. A mechanical property measuring apparatus (100) comprises: a physical quantity measuring unit (5) configured to measure a plurality of physical quantities of a measured object that includes a substance and a film on a surface of the substance; a mechanical property calculating unit (82) configured to calculate, using a plurality of calculation models each for calculating a mechanical property of the substance and at least two of the plurality of physical quantities measured, the mechanical property of the substance for each of the plurality of calculation models; and a selection processing unit (81) configured to select one mechanical property based on the at least two of the plurality of physical quantities.

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.

Abstract: A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.

Abstract: A light emitting apparatus includes: an electrically insulating base member that has first and second sides extending in a width direction, and third and fourth sides extending in a length direction, wherein the third and fourth sides are longer than the first and second sides; a plurality of electrically conductive pattern portions; a plurality of light emitting devices mounted on the electrically conductive pattern portions, the light emitting devices being arrayed in the length direction; a protection element that is flip chip mounted on the electrically conductive pattern portions and located, in the plan view, between the light emitting devices and the third side of the base member in the width direction; a first resin part that has a frame shape; a second resin part that is located in the first resin part; and at least one transparent member located on the light emitting devices.

Abstract: A light emitting device includes a light emitting element and a light reflecting member that reflects light emitted from the light emitting element. The light reflecting member comprises plate-shaped light reflective particles, silica, and an alkali metal. An average particle size of the light reflective particles is 0.6 ?m to 43 ?m, and an average aspect ratio of the light reflective particles is 10 or higher.

Abstract: A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.

Abstract: A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.

Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided. A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

Abstract: A light-emitting module includes a first substrate, a heat dissipation member, a second substrate, and a light-emitting element. The heat dissipation member is disposed on the first substrate. The second substrate is disposed on the heat dissipation member. The light-emitting element is disposed on a lower surface of the first substrate or an upper surface of the second substrate. The heat dissipation member includes a graphite member and a metal member. The graphite member has a first surface facing the first substrate and a second surface located opposite to the first surface. The graphite member has a first groove extending in a first direction in the first surface. The metal member includes a first internal metal member disposed in the first groove.

Abstract: Provided is a hot and cold water mixer capable of performing stable temperature control, including a cold water supply pipe, a hot water supply pipe, a mixing pipe, flow rate adjustment valves, temperature sensors, flow rate sensors, a setting unit, and a control unit. When the control unit determines that either one of the flow rate adjustment valves cannot increase the flow rate, and also determines, by comparing the target flow rate for the one flow rate adjustment valve with the flow rate of water flowing through the one flow rate adjustment valve, that the target flow rate for the one flow rate adjustment valve is higher, the control unit calculates and updates the target flow rate for the other flow rate adjustment valve and controls the other flow rate adjustment valve based on the updated target flow rate.

Abstract: A light emitting device includes a substrate, a light emitting element, and a protective element. The substrate includes a support member and a plurality of wirings disposed on an upper surface of the support member. The substrate has a first side extending in a first direction and a second side opposite to the first side. The light emitting element is disposed on an upper surface of the substrate, and the protective element is disposed on the upper surface of the substrate. The plurality of wirings has a plurality of external connecting portions disposed adjacent to the first side and arranged in the first direction in a plan view. The protective element is disposed between the light emitting element and the second side of the substrate.

Abstract: A light-emitting device includes: a light-emiting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.

Abstract: A light emitting device includes a substrate and a light emitting element mounted on the substrate, a light transmissive member, covering member, first and second protruding members, and a protective element. The light transmissive member is disposed on an upper surface of the light emitting element. The covering member covers an upper surface of the substrate, a lateral surface of the light emitting element, and at least a portion of a lateral surface of the light transmissive member such that an upper surface of the light transmissive member is exposed. The first protruding member and the second protruding member are provided on the substrate such that the light emitting element and the light transmissive member are positioned between the first protruding member and the second protruding member. The protective element is mounted on the substrate so as to be positioned between the light emitting element and the second protruding member.

Abstract: A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.

Abstract: A method of manufacturing a light-emitting device includes: a providing step including providing a plurality of light sources, each of the light sources having an upper surface including a light-emitting portion, a lower surface opposite to the upper surface, and lateral surfaces between the upper surface and the lower surface, wherein each of the light sources includes an external connection terminal at the lower surface, and wherein the plurality of light sources are ranked in terms of at least one of luminous flux or chromaticity; an extracting step including extracting a plurality of light sources in a desired rank from the plurality of light sources; and a bonding step including bonding the lateral surfaces of adjacent ones of the plurality of extracted light sources via a bonding member such that the upper surfaces and the lower surfaces of the light sources are exposed from the bonding member and such that the bonding member is spaced apart from the external connection terminals.

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.

Abstract: A method for manufacturing a light emitting device includes preparing a light transmissive member block including a first light transmissive member block having a plate like shape and including a resin containing at least one phosphor and a second light transmissive member block including a material harder than a material of the first light transmissive member block. Grooves are formed on an upper face of the second light transmissive member block. The light transmissive member block is divided at the grooves to obtain a plurality of light transmissive members each having a first light transmissive member and a second light transmissive member. A lower face of the first light transmissive member and an upper face of a light emitting element are bonded together such that a lower face perimeter of the first light transmissive member is located outside of an upper face perimeter of the light emitting element.

Abstract: A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.