Abstract: A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.

Abstract: A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

Abstract: A light emitting device is disclosed. The light emitting device includes a mounting board, one or more light emitting elements arranged on the mounting board, a frame disposed to surround the one or more light emitting elements, and a light transmissive member encapsulating an area surrounded by the frame. The frame has an inner perimeter that includes at least a pair of opposing sides and four acute-angled portions each provided at each end of the pair of opposing sides, in a plan view.

Abstract: A method of manufacturing a light-emitting device includes providing a package having an upper surface and defining a recess, the recess having an opening at the upper surface. A light-emitting element is placed on a bottom surface of the recess of the package, and the recess of the package is filled with an uncured sealing member containing a silicone resin. The package is held in a liquid in a state in which the uncured sealing member is filled in the recess of the package, and the uncured sealing member is cured by heating the package in which the uncured sealing member is filled in the recess.

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.

Abstract: A light emitting device includes a substrate and a light emitting element mounted on the substrate, a light transmissive member, covering member, first and second protruding members, and a protective element. The light transmissive member is disposed on an upper surface of the light emitting element. The covering member covers an upper surface of the substrate, a lateral surface of the light emitting element, and at least a portion of a lateral surface of the light transmissive member such that an upper surface of the light transmissive member is exposed. The first protruding member and the second protruding member are provided on the substrate such that the light emitting element and the light transmissive member are positioned between the first protruding member and the second protruding member. The protective element is mounted on the substrate so as to be positioned between the light emitting element and the second protruding member.

Abstract: A method for manufacturing a light emitting device includes preparing a light transmissive member block including a first light transmissive member block having a plate like shape and including a resin containing at least one phosphor and a second light transmissive member block including a material harder than a material of the first light transmissive member block. Grooves are formed on an upper face of the second light transmissive member block. The light transmissive member block is divided at the grooves to obtain a plurality of light transmissive members each having a first light transmissive member and a second light transmissive member. A lower face of the first light transmissive member and an upper face of a light emitting element are bonded together such that a lower face perimeter of the first light transmissive member is located outside of an upper face perimeter of the light emitting element.

Abstract: A light emitting device includes a light emitting element, a light-transmissive member, a covering member, and a base member. The light-transmissive member has a flange on a lateral surface thereof in such a manner as to continue from a periphery of an upper surface to a periphery of a lower surface of the light-transmissive member and to be positioned outside the upper surface of the light-transmissive member and an upper surface of the light emitting element in plan view. The flange has a thin portion at an inner side than the outer edge side of the flange. The thin portion has a thickness smaller than a thickness of the outer edge side of the flange.

Abstract: A light emitting device includes a substrate, light emitting elements, light transmissive members, an underfill, and a cover member. The light emitting elements are mounted on the substrate. The light transmissive members are each disposed on an upper surface of each of the light emitting elements. The underfill covers an upper surface of the substrate, lateral surfaces of the light emitting elements, and lateral surfaces of the light transmissive members between the light transmissive members. The cover member covers an upper surface of the underfill and has a hardness greater than a hardness of the underfill.

Abstract: A light emitting apparatus includes: an electrically insulating base member that has first and second sides extending in a width direction, and third and fourth sides extending in a length direction, wherein the third and fourth sides are longer than the first and second sides; a plurality of electrically conductive pattern portions; a plurality of light emitting devices mounted on the electrically conductive pattern portions, the light emitting devices being arrayed in the length direction; a protection element that is flip chip mounted on the electrically conductive pattern portions and located, in the plan view, between the light emitting devices and the third side of the base member in the width direction; a first resin part that has a frame shape; a second resin part that is located in the first resin part; and at least one transparent member located on the light emitting devices.

Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.

Abstract: A light emitting device includes light emitting elements having light extraction faces, respectively. A light transmissive member includes a lower face facing the light extraction faces, an upper face opposite to the lower face in a height direction, and first to fourth side faces that are connected to the lower face and the upper face. An area of the lower face is larger than a sum of areas of the light extraction faces. An area of the upper face is smaller than the area of the lower face. The second side face is substantially parallel to the first side face. The third side face and the fourth side face are provided between the first side face and the second side face and opposite to each other. The third side face and the fourth side face approach as approaching from the lower face to the upper face in the height direction.

Abstract: A light emitting device includes a light emitting element, a light-transmissive member, a covering member, and a base member. The light-transmissive member has a flange on a lateral surface thereof in such a manner as to continue from a periphery of an upper surface to a periphery of a lower surface of the light-transmissive member and to be positioned outside the upper surface of the light-transmissive member and an upper surface of the light emitting element in plan view. The flange has a thin portion at an inner side than the outer edge side of the flange. The thin portion has a thickness smaller than a thickness of the outer edge side of the flange.

Abstract: A light emitting apparatus includes an electrically insulating base member; a first electrically conductive pattern portion and a second electrically conductive pattern portion formed on an upper surface of the base member; a plurality of intermediate electrically conductive pattern portions arranged between the first and second electrically conductive pattern portions; at least one light emitting device mounted on at least one of the intermediate electrically conductive pattern portions; a protection element mounted on the first and second electrically conductive pattern portions; and a resin portion disposed around the at least one light emitting device such that (i) the first and second electrically conductive pattern portions are partially covered by the resin portion and partially exposed from the resin portion, and (ii) the protection element is covered by the resin portion.

Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element

Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.

Abstract: A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

Abstract: A light emitting device is disclosed. The light emitting device includes a mounting board, one or more light emitting elements arranged on the mounting board, a frame disposed to surround the one or more light emitting elements, and a light transmissive member encapsulating an area surrounded by the frame. The frame has an inner perimeter that includes at least a pair of opposing sides and four acute-angled portions each provided at each end of the pair of opposing sides, in a plan view.

Abstract: A light emitting device includes a light emitting element; a light-transmissive member that has a lower surface positioned inside a peripheral edge of an upper surface of the light emitting element in plan view, a first lateral surface extending from the lower surface and having at least one inclined surface that is inclined with respect to the upper surface of the light emitting element, and a second lateral surface positioned above and outside the first lateral surface; a light-transmissive adhesive member positioned inside the second lateral surface in plan view, wherein the adhesive member adheres the upper surface of the light emitting element and the lower surface of the light-transmissive member to each other and covers the first lateral surface; and a light-reflective member covering the second lateral surface.

Abstract: A method of manufacturing a light emitting device includes: bonding a wavelength conversion member on an upper face of a light emitting element while disposing a first light guide member to extend from a lateral face of the light emitting element to a lower face of the wavelength conversion member, the lower face of the wavelength conversion member having a larger area than the upper face of the light emitting element; and bonding a light transmissive member on an upper face of the wavelength conversion member while disposing a second light guide member to extend from the upper face of the wavelength conversion member to a lateral face of the light transmissive member, a lower face of the light transmissive member having a smaller area than the upper face of the wavelength conversion member.