Abstract: An image forming apparatus includes a rotary mechanism that allows a display device to rotate between a landscape orientation in which the long sides are opposed in an up-down direction, and a portrait orientation in which the short sides are opposed in the up-down direction, and a controller that displays a second preview screen, in which a preview image display region has been expanded, when the display device, displaying a first preview screen, has been shifted from the landscape orientation to the portrait orientation. When the display device is shifted from the portrait orientation to the landscape orientation, in a state where the second preview screen is displayed on the display device, and a job assigned with respect to image data corresponding to the second preview image is suspended, the controller displays a message urging inputting of an instruction on whether to resume the job, on the display device.

Abstract: An image forming apparatus includes: a rotation mechanism capable of rotating a rectangular display device between a landscape orientation with longer sides being top and bottom and a portrait orientation with shorter sides being top and bottom; a detection sensor that detects switching of the display device between the landscape orientation and the portrait orientation; and a controller that, upon detection of switching of the display device from the landscape orientation to the portrait orientation by the detection sensor, enlarges a preview display area and allows a preview to be displayed in a size enlarged to fit the enlarged preview display area and displayed to make top and bottom edges of the preview parallel to the shorter sides of the display device.

Abstract: An image forming apparatus includes a display device, a rotation mechanism that allows the display device to rotate between a landscape orientation in which the long sides are a top and a bottom and a portrait orientation in which the short sides are a top and a bottom, a detection sensor that detects switching between the landscape orientation and the portrait orientation of the display device, and a controller that causes the display device to perform display according to a posture of the display device based on a detection result obtained by the detection sensor. Further, when the controller determines that the posture of the display device has switched at a predetermined frequency or more based on the detection result obtained by the detection sensor, the controller causes the display device to display a message indicating occurrence of a problem related to a rotational operation of the display device.

Abstract: An image forming apparatus includes: a display device with a rectangular shape having long sides and short sides; a rotation mechanism causing the display device to be rotatable between a landscape orientation with the long sides located on upper and lower sides and a portrait orientation with the short sides located on the upper and lower sides; a detection sensor detecting which of landscape and portrait orientations the display device is in; and a controller displaying an error screen including a concept image and a text indicating details of an error on the display device. The controller arranges first and second display regions on the error screen, and horizontally arranges the first and second display regions when the detection sensor detects the landscape orientation of the display device, or vertically arranges the first and second display regions when the detection sensor detects the portrait orientation of the display device.

Abstract: An operation input device accepts non-contact operation on an operation image with a pointer. The operation input device includes a display panel and a sensing portion. The sensing portion outputs a first output value and a second output value. If a first operation image, which is an operation image corresponding to the second output value observed when the first output value is equal to a first reference value, and a second operation image, which is an operation image corresponding to the second output value observed when the first output value is equal to a second reference, differ, the display panel displays the first and second operation images with highlighting.

Abstract: A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: An operation input device accepts non-contact operation on an operation image with a pointer. The operation input device includes a display panel and a sensing portion. The sensing portion outputs a first output value and a second output value. If a first operation image, which is an operation image corresponding to the second output value observed when the first output value is equal to a first reference value, and a second operation image, which is an operation image corresponding to the second output value observed when the first output value is equal to a second reference, differ, the display panel displays the first and second operation images with highlighting.

Abstract: A method of manufacturing a metal structure including forming a metal layer including a metal and a nano-abrasive and supplying slurry on the metal layer to perform chemical mechanical polishing, a metal structure including a metal and a nano-abrasive having an average particle diameter of less than about 5 nanometers, and a metal wire, a semiconductor device, and an electronic device including the same.

Abstract: A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

Abstract: A polishing slurry including a fullerene derivative including a metal cation, a method of preparing the polishing slurry, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: A polishing slurry including a fullerene derivative and at least one compound having at least one positively-charged functional group, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.

Abstract: A polishing slurry includes a carbon polishing particle and an exothermic material.

Abstract: A carbon abrasive including a carbon nanoparticle and a positively charged polymer, a positively charged oligomer, of a combination thereof, on a surface of the carbon nanoparticle. A polishing slurry including the carbon abrasive, and a method of manufacturing a semiconductor device using the polishing slurry.

Abstract: A chemical mechanical polishing method including preparing a polishing pad including a polishing surface having an elastic modulus at room temperature of about 300 MPa to about 400 MPa, positioning a semiconductor structure having a surface, wherein the surface and the polishing surface of the polishing pad face each other, supplying polishing slurry including nano-abrasive having an average particle diameter of less than about 10 nm between the surface of the semiconductor structure and the polishing surface of the polishing pad, and contacting the surface of the semiconductor structure with the polishing surface of the polishing pad to polish the surface with the polishing slurry. A method of manufacturing a semiconductor device including the the chemical mechanical polishing method, a polishing pad used in the method, and a chemical mechanical polishing device.

Abstract: A chemical mechanical polishing method that includes preparing a chemical mechanical polishing device including a platen, a polishing pad, and a polishing slurry supplier, supplying a hot liquid to an inside of the platen to adjust a surface temperature of the platen, disposing the semiconductor substrate and the polishing pad to face each other, supplying polishing slurry including carbon abrasives having an average particle diameter of less than about 10 nm between the semiconductor substrate and the polishing pad, and contacting the surface of the semiconductor substrate with the polishing pad to polish the semiconductor substrate., a method of manufacturing a semiconductor device using the chemical polishing method, and a chemical mechanical polishing device.

Abstract: A method of manufacturing a metal structure including forming a metal layer including a metal and a nano-abrasive and supplying slurry on the metal layer to perform chemical mechanical polishing, a metal structure including a metal and a nano-abrasive having an average particle diameter of less than about 5 nanometers, and a metal wire, a semiconductor device, and an electronic device including the same.