Patents by Inventor Kenji Takai

Kenji Takai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100133486
    Abstract: Disclosed is a coated particle (10) which is obtained by coating at least apart of the surface of a functional group-containing conductive particle (8), which has a conductive metal surface at least a part of which is provided with a functional group, with an insulating material which contains a polymer electrolyte (4) and an insulating particle (6) composed of an inorganic oxide having a hydroxy group on at least a part of the surface.
    Type: Application
    Filed: October 3, 2007
    Publication date: June 3, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenji Takai, Nobuaki Takane
  • Publication number: 20100051338
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Application
    Filed: November 5, 2009
    Publication date: March 4, 2010
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20100044086
    Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
    Type: Application
    Filed: November 6, 2009
    Publication date: February 25, 2010
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Patent number: 7629045
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Patent number: 7615277
    Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: November 10, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20090145766
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Application
    Filed: February 9, 2009
    Publication date: June 11, 2009
    Inventors: Kenji TAKAI, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20090032287
    Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
    Type: Application
    Filed: July 16, 2008
    Publication date: February 5, 2009
    Inventors: Kenji Takai, Takayuki Sueyoshi
  • Patent number: 7473458
    Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: January 6, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Kenji Takai, Takayuki Sueyoshi
  • Publication number: 20080282694
    Abstract: A Stirling engine, wherein the inner yoke of a linear motor is installed on the outer peripheral surface of a cylinder. To keep a proper pressure balance between a compression space on one end side of a displacer and a back pressure space on the outer peripheral side of the cylinder, a first flow passage is formed in the piston starting at the compression space side end face toward the outer peripheral surface and a second flow passage allowing the first flow passage to communicate with the back pressure space is formed in the cylinder. The second flow passage is composed of a through hole that penetrates the wall of the cylinder in a radial direction and a communication passage formed between the outer peripheral surface of the cylinder and the inner peripheral surface of the inner yoke to allow the through hole to communicate with the back pressure space.
    Type: Application
    Filed: January 17, 2006
    Publication date: November 20, 2008
    Inventors: Yoshiyuki Kitamura, Kazushi Yoshimura, Kenji Takai, Shinji Yamagami, Jin Sakamoto
  • Publication number: 20080277143
    Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 13, 2008
    Inventors: Kenji Takai, Takayuki Sueyoshi
  • Publication number: 20080145689
    Abstract: Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 ?m on a metal whose surface has a ten-point average roughness Rz of 2.0 ?m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
    Type: Application
    Filed: November 10, 2005
    Publication date: June 19, 2008
    Inventors: Nobuyuki Ogawa, HItoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike, Shin Takanezawa, Takako (Formerly Watanabe) Ejiri, Toshihisa Kumakura
  • Publication number: 20080138505
    Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
    Type: Application
    Filed: January 30, 2008
    Publication date: June 12, 2008
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20080011612
    Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 17, 2008
    Inventors: Kenji TAKAI, Takayuki Sueyoshi
  • Publication number: 20070277373
    Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
    Type: Application
    Filed: August 10, 2007
    Publication date: December 6, 2007
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20070089410
    Abstract: In a Stirling engine, a hollow cylinder-like pressure vessel covers a cylinder, a piston, and a linear motor. The pressure vessel is divided into a ring-like portion and a dome-like portion at a position closer to the displacer installation side than a piston support-side end of the linear motor. At the divided portion, an outward-facing flange-shaped portion is formed for each of the ring-like portion and the dome-like portion. For temporary sealing of the pressure vessel, both flange-shaped portions are joined together and tightened by tightening rings and bolts. A performance check is performed in this state, and then outer peripheral portions of the flange-shaped portions are welded together for final sealing.
    Type: Application
    Filed: June 29, 2004
    Publication date: April 26, 2007
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Kazushi Yoshimura, Kenji Takai, Yoshiyuki Kitamura, Shinji Yamagami, Jin Sakamoto, Hiroshi Yasumura
  • Publication number: 20070034277
    Abstract: A fabric wherein air layers are formed between a plurality of textures of the fabric to enhance the property of keeping warm and to soften the textile thereof. The obtained fabric is very luxurious and is enhanced in the degree of freedom in the manner of weaving thereof and thus the scope of the application can be widened. The fabric includes a base texture having base warp and base weft; and a cover texture including cover warp running in the same direction as that of the base warp and cover weft interweaved with the cover warp. The cover warp are adapted to be intertangled with the base weft in every few intervals to form loops protruding between the adjacent points of capture on the base texture, and the cover texture forms a plurality of tubular air layers on the base texture.
    Type: Application
    Filed: August 7, 2006
    Publication date: February 15, 2007
    Applicant: KABUSHIKI-KAISHA DAIICHI-ORIMONO
    Inventor: Kenji Takai
  • Patent number: 7168248
    Abstract: A Stirling engine, wherein when a linear motor reciprocatingly move a piston in a cylinder, a displacer also reciprocatingly moves in the cylinder storing the displacer. By this, working mixture moves between a compression space and an expansion space. Though a spring for generating resonance is combined with the displacer, a spring for generating resonance for the piston is eliminated. Gas bearings are installed for the piston at two or more positions at specified intervals in the axial direction. An inside flange formed at the end of the cylinder and a stopper plate fixed to the linear motor determine the moving limit of the piston. Since a pin projected from the stopper plate is received by a through hole in a magnet holder, the piston can be prevented from being rotated.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: January 30, 2007
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Jin Sakamoto, Kazushi Yoshimura, Kenji Takai, Shinji Yamagami, Yoshiyuki Kitamura, Hiroshi Yasumura, Hirotaka Ohno
  • Publication number: 20060137339
    Abstract: A Stirling engine, wherein when a linear motor reciprocatingly move a piston in a cylinder, a displacer also reciprocatingly moves in the cylinder storing the displacer. By this, working mixture moves between a compression space and an expansion space. Though a spring for generating resonance is combined with the displacer, a spring for generating resonance for the piston is eliminated. Gas bearings are installed for the piston at two or more positions at specified intervals in the axial direction. An inside flange formed at the end of the cylinder and a stopper plate fixed to the linear motor determine the moving limit of the piston. Since a pin projected from the stopper plate is received by a through hole in a magnet holder, the piston can be prevented from being rotated.
    Type: Application
    Filed: July 20, 2004
    Publication date: June 29, 2006
    Inventors: Jin Sakamoto, Kazushi Yoshimura, Kenji Takai, Shinji Yamagami, Yoshiyuki Kitamura, Hiroshi Yasumura, Hirotaka Ohno
  • Publication number: 20050202261
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Application
    Filed: January 28, 2005
    Publication date: September 15, 2005
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20050121229
    Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
    Type: Application
    Filed: March 5, 2003
    Publication date: June 9, 2005
    Inventors: Kenji Takai, Takayuki Sueyoshi