Patents by Inventor Kenji Takano
Kenji Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11965510Abstract: A compressor body includes a compression mechanism including a screw rotor that compresses gas, a casing that accommodates the compression mechanism and defines a compression working chambers therein, a suction side bearing that rotatably supports the screw rotor, a bearing chamber that accommodates the suction side bearing, and a liquid supply port that communicates with the compression working chambers and supplies liquid supplied from the outside of the casing into the compression working chambers. The casing has an internal liquid supply flow path that extends from a discharge side of the compression working chambers as an upstream side to a suction side of the compression working chambers as a downstream side and that supplies the liquid to the liquid supply port. The internal liquid supply flow path has a downstream portion reaching the bearing chamber and supplies the liquid to the suction side bearing.Type: GrantFiled: September 28, 2020Date of Patent: April 23, 2024Assignee: Hitachi Industrial Equipment Systems Co., Ltd.Inventors: Shigeyuki Yorikane, Masahiko Takano, Kenji Morita, Yoshitaka Takeuchi
-
Publication number: 20240122818Abstract: The present invention relates to light-scattering silica particles having a light scattering property, the light-scattering silica particles including: a plurality of hollow portions each having a closed pore structure inside the particle, in which the light-scattering silica particles have a volume-based cumulative 50% particle diameter of 1 ?m to 500 ?m and an average circularity of 0.80 or more, and in use of the light-scattering silica particles, a reflectance A of a water cake containing 20 mg/cm2 of silica per measurement cross-sectional area at an ultraviolet wavelength of 310 nm is 30% or more.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Applicants: AGC Inc., AGC SI-TECH CO., LTD.Inventors: Hajime KATAYAMA, Masashi KONDO, Kohta FUKUMOTO, Yuriko TAKANO, Shinnosuke ARIMITSU, Takeshi MURAKAMI, Kenji HIGASHI, Daisuke YAMAZUMI
-
Publication number: 20240108186Abstract: A charging base includes: a base seat installed on a floor surface; a columnar tower part provided on the base seat; a first support provided on the tower part and capable of supporting a vertical first electric vacuum cleaner; and a second support provided on the tower part and capable of supporting a vertical second electric vacuum cleaner. An electric vacuum cleaner system includes the charging base configured as described above, the vertical first electric vacuum cleaner, and the vertical second electric vacuum cleaner.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Inventors: Koshiro TAKANO, Eigo SHIMIZU, Yumi KUROKAWA, Shigeyuki NAGATA, Eunjin CHOI, Isamu OKUDA, Tsutomu MATSUBARA, Takenori SEKIGUCHI, Hiroaki ITO, Kenji YANAGISAWA
-
Publication number: 20240067764Abstract: A solid titanium catalyst component (I) for olefin polymer production contains titanium, magnesium, halogen, and a cyclic multiple-ester-group-containing compound (a) represented by the formula (1). Preferably, a propylene polymer that is obtained by the olefin polymerization method and has specific thermal properties as determined primarily by differential scanning calorimetry (DSC).Type: ApplicationFiled: December 21, 2021Publication date: February 29, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Takashi KIMURA, Makoto ISOGAI, Yasushi NAKAYAMA, Kenji MICHIUE, Takashi JINNAI, Wataru YAMADA, Shotaro TAKANO, Hiroshi TERAO, Takaaki YANO, Yoshiyuki TOTANI, Sunil Krzysztof MOORTHI, Takashi NAKANO
-
Publication number: 20240067763Abstract: The solid titanium catalyst component (I) of the present invention contains titanium, magnesium, halogen, and a cyclic multiple-ester-group-containing compound (a) represented by the following formula (1).Type: ApplicationFiled: August 26, 2021Publication date: February 29, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Takashi KIMURA, Makoto ISOGAI, Yasushi NAKAYAMA, Kenji MICHIUE, Takashi JINNAI, Wataru YAMADA, Shotaro TAKANO, Hiroshi TERAO, Takaaki YANO, Yoshiyuki TOTANI, Sunil Krzysztof MOORTHI, Takashi NAKANO
-
Publication number: 20240064907Abstract: An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).Type: ApplicationFiled: February 22, 2022Publication date: February 22, 2024Applicant: FICT LIMITEDInventors: Taiji Sakai, Kenji Iida, Norikazu Ozaki, Kenji Takano, Takashi Nakagawa, Takayuki Inaba, Tetsuro Miyagawa, Akira Yajima, Shin Hirano, Kota Aoi, Yoichi Abe, Mio Emura
-
Patent number: 11759774Abstract: Methods for the removal of ionic contaminants from a hydrophilic organic solvent by a mixed bed of ion exchange resins are described. A mixed bed of ion exchange resins with gel-type strong-acid cationic ion exchange resin with a specific moisture holding capacity and gel-type anionic ion exchange resin is used in some embodiments of such methods.Type: GrantFiled: December 16, 2016Date of Patent: September 19, 2023Assignee: Dow Global Technologies LLCInventors: Kaoru Ohba, Kenji Takano, Masonori Iida, Shinnosuke Abe, Takashi Masudo, Osamu Kishizaki, Ryo Ishibashi, Yusuke Yamashita
-
Publication number: 20230180398Abstract: A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.Type: ApplicationFiled: March 1, 2021Publication date: June 8, 2023Applicant: FICT LIMITEDInventors: Kenji Iida, Norikazu Ozaki, Taiji Sakai, Takashi Nakagawa, Kenji Takano, Takayuki Inaba, Akira Yajima, Shin Hirano, Kota Aoi, Tetsuro Miyagawa
-
Publication number: 20230073192Abstract: Provided is a carbon dioxide recovery device including an absorption part that produces a compound of carbon dioxide and an amine contained in an absorbing solution, and a regeneration part that includes an anode that desorbs the carbon dioxide from the compound to produce a complex compound of the amine, and a cathode that is electrically connected to the anode and regenerates the amine from the complex compound.Type: ApplicationFiled: November 14, 2022Publication date: March 9, 2023Applicant: IHI CORPORATIONInventors: Toshiyuki SUDA, Wonyoung CHOI, Takumi ENDO, Kenji TAKANO
-
Publication number: 20220322534Abstract: A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.Type: ApplicationFiled: June 3, 2020Publication date: October 6, 2022Applicant: FUJITSU INTERCONNECT TECHNOLOGIES LIMITEDInventors: Shin Hirano, Kenji Iida, Takashi Nakagawa, Kenji Takano
-
Patent number: 11305244Abstract: A gas-liquid contact apparatus has a gas-liquid contact unit, a liquid supply system, and a gas supply system. The gas-liquid contact unit includes a plurality of stages which are allocated so as to be arranged in the lateral direction. Each of the plurality of stages includes a plurality of vertical flat plates arranged parallel to each other at intervals. The liquid supply system supplies a liquid to the gas-liquid contact unit, and causes the liquid to be circulated along the arrangement of the plurality of stages successively. The gas supply system supplies a gas to the gas-liquid contact unit, and causes the gas to be circulated along the arrangement of the plurality of stages successively. The supplied liquid flows down on the plurality of vertical flat plates in each of the plurality of stages, and comes into contact with the supplied gas.Type: GrantFiled: October 12, 2020Date of Patent: April 19, 2022Assignee: IHI CorporationInventors: Shiko Nakamura, Yoshiyuki Iso, Kenji Takano, Shinya Okuno, Ryosuke Ikeda, Hirohito Okuhara
-
Patent number: 11154809Abstract: A packing for gas-liquid contact has at least one packing element of a thin layer shape, placed in a standing position. The packing element has a main body portion having a planar liquid film-forming surface extending along a liquid flow direction, and at least one wall portion provided to stand relative to the liquid film-forming surface and extending along the liquid flow direction. The wall portion has a side surface inclined at a predetermined angle to the liquid film-forming surface in a surface position of a liquid film to be formed by a liquid on the liquid film-forming surface.Type: GrantFiled: July 24, 2020Date of Patent: October 26, 2021Assignees: IHI Corporation, University Public Corporation OsakaInventors: Yoshiyuki Iso, Ryosuke Ikeda, Kenji Takano, Kenji Katoh, Tatsuro Wakimoto
-
Hydrophilized material, hydrophilized member, and gas-liquid contact apparatus in which same is used
Patent number: 11014065Abstract: A hydrophilized material has a surface provided with surface roughness that arithmetic mean roughness is 0.3 ?m to 1.0 ?m and mean width of roughness profile elements is 0.1 mm or less. A hydrophilized member that contacts a liquid is at least partially made of the hydrophilized material. The hydrophilized member is applicable to a gas-liquid contact apparatus having a gas-liquid contact section, a liquid supply system, and a gas supply system, to constitute the gas-liquid contact section as a packing element. Wettability imparted due to the surface roughness is exhibited continuously.Type: GrantFiled: October 30, 2019Date of Patent: May 25, 2021Assignee: IHI CorporationInventors: Ryosuke Ikeda, Yoshiyuki Iso, Shiko Nakamura, Hirohito Okuhara, Kenji Takano -
Patent number: 10913058Abstract: Methods for the removal of ionic contaminants from hydrolysable organic solvent by ion exchange resins are described. A mixed bed of ion exchange resin with cationic ion exchange resin and weak-base anionic ion exchange resin is used in such methods.Type: GrantFiled: December 16, 2016Date of Patent: February 9, 2021Assignee: Dow Global Technologies LLCInventors: Kaoru Ohba, Kenji Takano, Masonori Iida, Shinnosuke Abe, Takashi Masudo, Osamu Kishizaki, Ryo Ishibashi, Yusuke Yamashita
-
Publication number: 20210031154Abstract: A gas-liquid contact apparatus has a gas-liquid contact unit, a liquid supply system, and a gas supply system. The gas-liquid contact unit includes a plurality of stages which are allocated so as to be arranged in the lateral direction. Each of the plurality of stages includes a plurality of vertical flat plates arranged parallel to each other at intervals. The liquid supply system supplies a liquid to the gas-liquid contact unit, and causes the liquid to be circulated along the arrangement of the plurality of stages successively. The gas supply system supplies a gas to the gas-liquid contact unit, and causes the gas to be circulated along the arrangement of the plurality of stages successively. The supplied liquid flows down on the plurality of vertical flat plates in each of the plurality of stages, and comes into contact with the supplied gas.Type: ApplicationFiled: October 12, 2020Publication date: February 4, 2021Applicant: IHI CorporationInventors: Shiko NAKAMURA, Yoshiyuki ISO, Kenji TAKANO, Shinya OKUNO, Ryosuke IKEDA, Hirohito OKUHARA
-
Publication number: 20200353405Abstract: A packing for gas-liquid contact has at least one packing element of a thin layer shape, placed in a standing position. The packing element has a main body portion having a planar liquid film-forming surface extending along a liquid flow direction, and at least one wall portion provided to stand relative to the liquid film-forming surface and extending along the liquid flow direction. The wall portion has a side surface inclined at a predetermined angle to the liquid film-forming surface in a surface position of a liquid film to be formed by a liquid on the liquid film-forming surface.Type: ApplicationFiled: July 24, 2020Publication date: November 12, 2020Applicants: IHI Corporation, University Public Corporation OsakaInventors: Yoshiyuki ISO, Ryosuke IKEDA, Kenji TAKANO, Kenji KATOH, Tatsuro WAKIMOTO
-
Patent number: 10814630Abstract: Provided herein are a jet hole plate, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing a jet hole plate that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate having provided therein a plurality of jet holes. The metal substrate has a principal surface having outlets for the jet holes. The principal surface has a surface roughness (arithmetic mean roughness Ra) that is smaller in outlet edge regions of the jet holes than in surrounding regions around the outlet edge regions.Type: GrantFiled: November 13, 2018Date of Patent: October 27, 2020Assignee: SII PRINTEK INC.Inventors: Masakazu Hirata, Kenji Takano, Tomoki Sodetai
-
Patent number: 10710366Abstract: Provided herein are a jet hole plate, a liquid jet head, and a liquid jet recording apparatus that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate provided with a plurality of jet holes. In the metal substrate, an average crystal grain size in outlet edges of the jet holes is smaller than that in surrounding regions around the outlet edges.Type: GrantFiled: November 13, 2018Date of Patent: July 14, 2020Assignee: SII Printek Inc.Inventors: Masakazu Hirata, Kenji Takano, Emiko Osaka
-
Patent number: 10596484Abstract: A packing has a plurality of sheet materials spaced and arranged in parallel, and liquid flows along the flat surface thereof in a standing use state. Each sheet material has at least one member group including a plurality of support members arranged such that the upper end of the uppermost support member corresponds to the upper end of the sheet material and the lower end of the lowermost support member corresponds to the lower end of the sheet material. Each support member has a pair of support walls parallel to the liquid flow direction and perpendicular to the sheet material surface, and a bridging part connecting the support walls. A sandwiching structure is formed that one sheet material is held by at least one support member attached thereto and at least one support member attached to an adjacent sheet material, and it extends linearly through the plurality of sheet materials.Type: GrantFiled: March 19, 2018Date of Patent: March 24, 2020Assignee: IHI CorporationInventors: Yoshiyuki Iso, Jian Huang, Mariko Saga, Shinsuke Matsuno, Hiroyuki Uchida, Naoki Fujiwara, Kenji Takano, Kenji Tokuda, Shiko Nakamura
-
HYDROPHILIZED MATERIAL, HYDROPHILIZED MEMBER, AND GAS-LIQUID CONTACT APPARATUS IN WHICH SAME IS USED
Publication number: 20200061574Abstract: A hydrophilized material has a surface provided with surface roughness that arithmetic mean roughness is 0.3 ?m to 1.0 ?m and mean width of roughness profile elements is 0.1 mm or less. A hydrophilized member that contacts a liquid is at least partially made of the hydrophilized material. The hydrophilized member is applicable to a gas-liquid contact apparatus having a gas-liquid contact section, a liquid supply system, and a gas supply system, to constitute the gas-liquid contact section as a packing element. Wettability imparted due to the surface roughness is exhibited continuously.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Applicant: IHI CorporationInventors: Ryosuke IKEDA, Yoshiyuki ISO, Shiko NAKAMURA, Hirohito OKUHARA, Kenji TAKANO