Abstract: The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal (58) having, on one surface thereof, a first metal layer (26) formed in a pattern shape; manufacturing unit structures (60) each having the first metal layer (26), a cured first insulating base material (22) filled with a cured first conductive paste (32), a second metal layer (28), and a semi-cured second insulating base material (24) filled with a semi-cured second conductive paste (36); joining together the first insulating base material (22) in one unit structure (60) among a plurality of the unit structures with the second insulating base material (24) in another unit structure (60); and layering the plurality of unit structures (60).

Abstract: The present invention addresses the problem that, when applying pressure and heat to laminate substrates, to maintain the flatness of the substrates so as not to have the load concentrated in one part, and to prevent the occurrence of resistance value abnormalities by making the electrically conductive layers between terminal parts uniform over the entire substrate.

Abstract: An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).

Abstract: Methods for the removal of ionic contaminants from a hydrophilic organic solvent by a mixed bed of ion exchange resins are described. A mixed bed of ion exchange resins with gel-type strong-acid cationic ion exchange resin with a specific moisture holding capacity and gel-type anionic ion exchange resin is used in some embodiments of such methods.

Abstract: A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.

Abstract: Provided is a carbon dioxide recovery device including an absorption part that produces a compound of carbon dioxide and an amine contained in an absorbing solution, and a regeneration part that includes an anode that desorbs the carbon dioxide from the compound to produce a complex compound of the amine, and a cathode that is electrically connected to the anode and regenerates the amine from the complex compound.

Abstract: A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

Abstract: A gas-liquid contact apparatus has a gas-liquid contact unit, a liquid supply system, and a gas supply system. The gas-liquid contact unit includes a plurality of stages which are allocated so as to be arranged in the lateral direction. Each of the plurality of stages includes a plurality of vertical flat plates arranged parallel to each other at intervals. The liquid supply system supplies a liquid to the gas-liquid contact unit, and causes the liquid to be circulated along the arrangement of the plurality of stages successively. The gas supply system supplies a gas to the gas-liquid contact unit, and causes the gas to be circulated along the arrangement of the plurality of stages successively. The supplied liquid flows down on the plurality of vertical flat plates in each of the plurality of stages, and comes into contact with the supplied gas.

Abstract: A packing for gas-liquid contact has at least one packing element of a thin layer shape, placed in a standing position. The packing element has a main body portion having a planar liquid film-forming surface extending along a liquid flow direction, and at least one wall portion provided to stand relative to the liquid film-forming surface and extending along the liquid flow direction. The wall portion has a side surface inclined at a predetermined angle to the liquid film-forming surface in a surface position of a liquid film to be formed by a liquid on the liquid film-forming surface.

Abstract: A hydrophilized material has a surface provided with surface roughness that arithmetic mean roughness is 0.3 ?m to 1.0 ?m and mean width of roughness profile elements is 0.1 mm or less. A hydrophilized member that contacts a liquid is at least partially made of the hydrophilized material. The hydrophilized member is applicable to a gas-liquid contact apparatus having a gas-liquid contact section, a liquid supply system, and a gas supply system, to constitute the gas-liquid contact section as a packing element. Wettability imparted due to the surface roughness is exhibited continuously.

Abstract: Methods for the removal of ionic contaminants from hydrolysable organic solvent by ion exchange resins are described. A mixed bed of ion exchange resin with cationic ion exchange resin and weak-base anionic ion exchange resin is used in such methods.

Abstract: A gas-liquid contact apparatus has a gas-liquid contact unit, a liquid supply system, and a gas supply system. The gas-liquid contact unit includes a plurality of stages which are allocated so as to be arranged in the lateral direction. Each of the plurality of stages includes a plurality of vertical flat plates arranged parallel to each other at intervals. The liquid supply system supplies a liquid to the gas-liquid contact unit, and causes the liquid to be circulated along the arrangement of the plurality of stages successively. The gas supply system supplies a gas to the gas-liquid contact unit, and causes the gas to be circulated along the arrangement of the plurality of stages successively. The supplied liquid flows down on the plurality of vertical flat plates in each of the plurality of stages, and comes into contact with the supplied gas.

Abstract: A packing for gas-liquid contact has at least one packing element of a thin layer shape, placed in a standing position. The packing element has a main body portion having a planar liquid film-forming surface extending along a liquid flow direction, and at least one wall portion provided to stand relative to the liquid film-forming surface and extending along the liquid flow direction. The wall portion has a side surface inclined at a predetermined angle to the liquid film-forming surface in a surface position of a liquid film to be formed by a liquid on the liquid film-forming surface.

Abstract: Provided herein are a jet hole plate, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing a jet hole plate that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate having provided therein a plurality of jet holes. The metal substrate has a principal surface having outlets for the jet holes. The principal surface has a surface roughness (arithmetic mean roughness Ra) that is smaller in outlet edge regions of the jet holes than in surrounding regions around the outlet edge regions.

Abstract: Provided herein are a jet hole plate, a liquid jet head, and a liquid jet recording apparatus that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate provided with a plurality of jet holes. In the metal substrate, an average crystal grain size in outlet edges of the jet holes is smaller than that in surrounding regions around the outlet edges.

Abstract: A packing has a plurality of sheet materials spaced and arranged in parallel, and liquid flows along the flat surface thereof in a standing use state. Each sheet material has at least one member group including a plurality of support members arranged such that the upper end of the uppermost support member corresponds to the upper end of the sheet material and the lower end of the lowermost support member corresponds to the lower end of the sheet material. Each support member has a pair of support walls parallel to the liquid flow direction and perpendicular to the sheet material surface, and a bridging part connecting the support walls. A sandwiching structure is formed that one sheet material is held by at least one support member attached thereto and at least one support member attached to an adjacent sheet material, and it extends linearly through the plurality of sheet materials.

Abstract: A hydrophilized material has a surface provided with surface roughness that arithmetic mean roughness is 0.3 ?m to 1.0 ?m and mean width of roughness profile elements is 0.1 mm or less. A hydrophilized member that contacts a liquid is at least partially made of the hydrophilized material. The hydrophilized member is applicable to a gas-liquid contact apparatus having a gas-liquid contact section, a liquid supply system, and a gas supply system, to constitute the gas-liquid contact section as a packing element. Wettability imparted due to the surface roughness is exhibited continuously.

Abstract: Provided herein are a jet hole plate, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing a jet hole plate that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate having provided therein a plurality of jet holes. The metal substrate has a principal surface having outlets for the jet holes. The principal surface has a surface roughness (arithmetic mean roughness Ra) that is smaller in outlet edge regions of the jet holes than in surrounding regions around the outlet edge regions.

Abstract: Provided herein are a jet hole plate, a liquid jet head, and a liquid jet recording apparatus that can achieve a long life. A jet hole plate according to an embodiment of the present disclosure is a jet hole plate for use in a liquid jet head. The jet hole plate includes a metal substrate provided with a plurality of jet holes. In the metal substrate, an average crystal grain size in outlet edges of the jet holes is smaller than that in surrounding regions around the outlet edges.

Abstract: Provided herein is a method for manufacturing a jet hole plate that can improve ejection stability and head durability. A method for manufacturing a jet hole plate according to an embodiment of the present disclosure includes a punching step of pressing a first principal surface of a metal substrate with a punch to form an indentation in the first principal surface, and to form a raised portion in a second principal surface of the metal substrate at a position opposite to the indentation; a first polishing step of removing the raised portion by mechanical polishing to penetrate the metal substrate at the indentation to thereby form a jet hole; and a second polishing step of polishing at least one of the first principal surface and the second principal surface of the metal substrate by chemical polishing, electrolytic polishing, or chemical-mechanical polishing.