Abstract: An illumination unit of the present invention includes a tabular light guide plate having a light emitting surface for emitting light coming from an LED as planar light, wherein a recessed portion is formed in the opposite surface of the light emitting surface of the light guide plate, and wherein the LED is provided in the recessed portion so that the optical axis of the LED becomes parallel to the light emitting surface of the light guide plate. Then, a dimming pattern is provided at a location corresponding to the LED of the light emitting surface of the light guide plate, and the dimming pattern includes a main portion covering the LED on the light emitting surface side, and protrusions radially extending toward a light emitting direction of the LED around the LED.

Abstract: An illumination unit includes LEDs and a tabular light guide plate having a light emitting surface for emitting light from the LEDs as planar light, wherein a recessed portion is formed in the opposite surface of the light emitting surface of the light guide plate, and the LED is provided in the recessed portion so that the optical axis of the LED becomes parallel to the light emitting surface of the light guide plate. Here, a dimming pattern is provided at a location corresponding to the LED of the light emitting surface of the light guide plate, and furthermore a first light guide pattern is provided on the light emitting surface of the light guide plate and a second light guide pattern is provided on a rear surface that is a reflective surface.

Abstract: An illumination unit includes an LED and a tabular light guide plate having a light emitting surface for emitting light from the LED as planar light, wherein a recessed portion is formed in the opposite surface of the tight emitting surface of the light guide plate, and wherein the LED is provided in the recessed portion so that the optical axis of the LED becomes parallel to the light emitting surface of the light guide plate. Further, a plurality of LEDs are arranged along the longer direction of the recessed portion, a dimming pattern is provided at a location corresponding to each of a plurality of LED of the light emitting surface of the light guide plate, and the shape or the size of the dimming pattern is varied with a location on the light emitting surface of the light guide plate.

Abstract: Provided is a blank structure for a ring member of a bearing in which a cut target surface after stainless steel is forged has uniform surface characteristics, and highly accurate cutting processing is enabled. A blank (10), which is processed to an outer race (2) and an inner race (3) of a bearing, includes: a cylindrical portion (11, 12) formed by forging a stainless-steel material, and having an inner circumferential surface (11a, 12a) and an outer circumferential surface (11b, 12b) entirely being surface eutectic carbides fragmented beds; and a clamp portion (13) provided to one end portion side of the cylindrical portion (11, 12).

Abstract: The present invention provides a novel method of producing piezoelectric vibrators in which a plurality of substrates are formed at once from a wafer, and the wafer is formed with a plurality of electrode holes formed in the respective substrates. Using holders each having a plurality of electrode columns held thereon, the plurality of electrode columns are substantially simultaneously inserted in the electrode holes formed in the wafer.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: An apparatus connection interface remarkably reduces the processing load of the controller. The apparatus connection interface includes a pair of connectors including a first connector and a second connector having respective signal transmission terminals for connecting a plurality of apparatus to be controlled in series to form an annular signal transmission line so as to circulate and transmit a condition confirming signal for confirming the condition of the apparatus to be controlled and, at the same time, circulate and transmit a condition notifying signal for notifying the condition of the individual apparatus to be controlled by way of the formed signal transmission line.

Abstract: An object of the present invention is to provide a method for removing gaseous mercury in flue gas that make it possible to remove mercury in flue gas extremely satisfactorily while handling is made easy and cost increases are kept under control. In order to accomplish the object, the present invention adopts the method of removing gaseous mercury in flue gas, in which, after water-insoluble mercury in the flue gas is converted into water-soluble mercury by placing the flue gas in contact with a solid catalyst formed by a metal oxide, wet-type absorption is performed on the water-soluble mercury.

Abstract: Provided is a blank structure for a ring member of a bearing in which a cut target surface after stainless steel is forged has uniform surface characteristics, and highly accurate cutting processing is enabled. A blank (10), which is processed to an outer race (2) and an inner race (3) of a bearing, includes: a cylindrical portion (11, 12) formed by forging a stainless-steel material, and having an inner circumferential surface (11a, 12a) and an outer circumferential surface (11b, 12b) entirely being surface eutectic carbides fragmented beds; and a clamp portion (13) provided to one end portion side of the cylindrical portion (11, 12).

Abstract: Provided is a method for manufacturing inkjet system ultraviolet curable inks which are improved in formability, adhesiveness and tackiness by selecting a combination of a monofunctional radical polymerization monomer as a major component with other polyfunctional radical polymerization oligomers and/or monofunctional radical polymerization monomers.

Abstract: The present invention provides a metal terminal that can hold and fix a conductive wire thereto without excessive deformation. In the metal terminal of this invention, a predetermined relationship is set between a length in the lengthwise direction and a width in the widthwise direction of a conductive wire winding portion and a diameter of the conductive wire wound around the conductive wire winding portion to reduce force applied to the conductive wire when holding and fixing the conductive wire.

Abstract: Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2); Ni—Co alloy layer (3) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer (4) superimposed on the surface of the Ni—Co alloy layer; and solder layer (5) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member (10) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni—Co alloy layer into the solder layer at about 235° C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300° to about 320° C.

Abstract: A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: An object of the present invention is to provide a method for removing gaseous mercury in flue gas that make it possible to remove mercury in flue gas extremely satisfactorily while handling is made easy and cost increases are kept under control. In order to accomplish the object, the present invention adopts the method of removing gaseous mercury in flue gas, in which, after water-insoluble mercury in the flue gas is converted into water-soluble mercury by placing the flue gas in contact with a solid catalyst formed by a metal oxide, wet-type absorption is performed on the water-soluble mercury.

Abstract: A process for producing a circuit board includes the steps of detachably laminating a metal foil layer on a surface of a supporting substrate; forming a laminate on the metal foil layer by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating the metal foil layer from the supporting substrate to detach the laminate; and etching the metal foil layer by photolithography so as to form a predetermined interconnection pattern.

Abstract: A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

Abstract: The present invention provides a fixing device and a digital photocopier which can shorten the time from an instruction of starting image formation to end of fixing. The fixing device is provided in a cylinder made of metal and having a small thickness, and includes a magnetic excitation coil. When the power source is turned on, all the electric power defined by subtracting an electric power amount consumed by components other than the fixing device is supplied to the magnetic excitation coil to perform heating. As the structural components of the photocopier and auxiliary devices added to the photocopier operate, the electric power defined by subtracting, from the maximum input electric power, the electric power consumed by the structural components of the photocopier and the auxiliary devices is supplied to perform heating. In this manner, the heat roller of the fixing device is heated, in a short time, to a temperature which enables fixing, so that the time required for first copying can be shortened.

Abstract: The present invention provides a fixing device and a digital photocopier which can shorten the time from an instruction of starting image formation to end of fixing. The fixing device is provided in a cylinder made of metal and having a small thickness, and includes a magnetic excitation coil. When the power source is turned on, all the electric power defined by subtracting an electric power amount consumed by components other than the fixing device is supplied to the magnetic excitation coil to perform heating. As the structural components of the photocopier and auxiliary devices added to the photocopier operate, the electric power defined by subtracting, from the maximum input electric power, the electric power consumed by the structural components of the photocopier and the auxiliary devices is supplied to perform heating. In this manner, the heat roller of the fixing device is heated, in a short time, to a temperature which enables fixing, so that the time required for first copying can be shortened.