Patents by Inventor Kenji Terada

Kenji Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160211481
    Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.
    Type: Application
    Filed: January 15, 2015
    Publication date: July 21, 2016
    Applicant: KYOCERA CIRCUIT SOLUTIONS INC.
    Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
  • Patent number: 9157932
    Abstract: A wiring board 3 according to the present invention includes a first resin layer 18a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18a; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18a.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: October 13, 2015
    Assignee: KYOCERA Circuit Solutions, Inc.
    Inventors: Takayuki Taguchi, Kenji Terada
  • Patent number: 9110234
    Abstract: An optical module includes: a wiring substrate having an electrode pad on a main surface thereof; an optical waveguide disposed on the main surface of the wiring substrate; an optical semiconductor device mounted on a main surface of the optical waveguide, and having a connection pad disposed on a main surface on an optical waveguide side of the optical semiconductor device; and an electrically conductive member for providing electrical connection between the electrode pad and the connection pad. The optical waveguide has a hole passing therethrough in its thickness direction to leave the electrode pad exposed. The connection pad includes a projection which is at least partly inserted in the hole. The conductive member is disposed inside the hole, and makes connection with the projection and the electrode pad.
    Type: Grant
    Filed: December 26, 2011
    Date of Patent: August 18, 2015
    Assignee: KYOCERA Corporation
    Inventors: Kenji Terada, Kimihiro Yamanaka
  • Patent number: 8836361
    Abstract: A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: September 16, 2014
    Assignee: KYOCERA SLC Technologies Corporation
    Inventors: Takayuki Taguchi, Kenji Terada
  • Publication number: 20130272648
    Abstract: An optical module includes: a wiring substrate having an electrode pad on a main surface thereof; an optical waveguide disposed on the main surface of the wiring substrate; an optical semiconductor device mounted on a main surface of the optical waveguide, and having a connection pad disposed on a main surface on an optical waveguide side of the optical semiconductor device; and an electrically conductive member for providing electrical connection between the electrode pad and the connection pad. The optical waveguide has a hole passing therethrough in its thickness direction to leave the electrode pad exposed. The connection pad includes a projection which is at least partly inserted in the hole. The conductive member is disposed inside the hole, and makes connection with the projection and the electrode pad.
    Type: Application
    Filed: December 26, 2011
    Publication date: October 17, 2013
    Applicant: KYOCERA CORPORATION
    Inventors: Kenji Terada, Kimihiro Yamanaka
  • Patent number: 8284557
    Abstract: Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (2) is provided with a base (5) and a through hole conductor (11). The base is provided with a fiber layer (9) and a through hole (S). The fiber layer has a single fiber (8) arranged along one direction and a resin for covering the single fiber (8). The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole. The single fiber (8) partially protrudes to the side of the through hole conductor (11) from an inner wall surface of the through hole (S), and the protruded part is covered with the through hole conductor (11).
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: October 9, 2012
    Assignee: Kyocera Corporation
    Inventors: Yutaka Tsukada, Kimihiro Yamanaka, Kenji Terada
  • Publication number: 20120212585
    Abstract: A stereoscopic imaging device includes: a first image capture device and a second image capture device; a convergence point shifter configured to shift a convergence point; and a controller configured to control, in accordance with a zooming-in operation regarding a subject whose images are taken by the first image capture device and by the second image capture device, the convergence point shifter to shift the convergence point rearward or frontward of the subject, and to control, in accordance with a zooming-out operation regarding the subject whose images are taken by the first image capture device and the second image capture device, the convergence point shifter to shift the convergence point frontward or rearward of the subject.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 23, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Kenji TERADA, Hiroyuki MAKUTA, Nobuo IWAI
  • Patent number: 8208723
    Abstract: Provided is a smoke detecting apparatus capable of detecting occurrence of smoke at high sensitivity while suppressing an effect of disturbance. The smoke detecting apparatus for detecting occurrence of smoke by subjecting an image captured by a monitoring camera to image processing includes: an image memory (10) for storing a plurality of images captured by the monitoring camera in a time series; and a smoke detection area selecting portion (20) for calculating a luminance histogram of the same pixel for each predetermined pixel a plurality of times in a past predetermined period based on the plurality of images stored in the image memory (10), detecting presence or absence of a luminance value that has been newly generated due to occurrence of one of an intrusive object and smoke based on the luminance histogram, and identifying candidate regions to be subjected to the image processing.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: June 26, 2012
    Assignees: Nohmi Bosai Ltd., The University of Tokushima
    Inventors: Takatoshi Yamagishi, Kazuhisa Nakano, Kenji Terada
  • Patent number: 7839476
    Abstract: The present invention reduces a connection failure between two conductive layers which are connected with each other via a through hole in a display device and reduces a defect of an orientation film formed on a TFT substrate side in a liquid crystal display device. A display device includes a display panel in which a first conductive layer formed on a surface of a substrate, and a second conductive layer which is formed over the first conductive layer as viewed from a surface of the substrate by way of a thin film layer formed of one insulation film or two or more stacked thin films including one insulation film are electrically connected with each other in an opening portion formed in the thin film layer. Out of opening ends of the opening portion of the thin film layer, an outer periphery of the opening end remote from the surface of the substrate changes a distance from the surface of the substrate one time or more during one turn of the outer periphery.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: November 23, 2010
    Assignee: Hitachi Displays, Ltd.
    Inventors: Hiroaki Iwato, Kotaro Araya, Kenji Terada
  • Patent number: 7834277
    Abstract: The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: November 16, 2010
    Assignee: International Business Machines Corporation
    Inventors: Kohichi Ohsumi, Kenji Terada, Kohichi Yamazaki
  • Publication number: 20100254098
    Abstract: Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (2) is provided with a base (5) and a through hole conductor (11). The base is provided with a fiber layer (9) and a through hole (S). The fiber layer has a single fiber (8) arranged along one direction and a resin for covering the single fiber (8). The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole. The single fiber (8) partially protrudes to the side of the through hole conductor (11) from an inner wall surface of the through hole (S), and the protruded part is covered with the through hole conductor (11).
    Type: Application
    Filed: October 17, 2008
    Publication date: October 7, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Yutaka Tsukada, Kimihiro Yamanaka, Kenji Terada
  • Patent number: 7726016
    Abstract: The present invention provides a method of manufacturing a printed circuit board. The method includes the steps of preparing an insulating substrate having a front surface and a back surface and a layer of metal foil formed on each of the front surface and the back surface; selectively forming a plating layer for forming a land on at least one of the metal foils; adjusting a thickness of the plating layer; and forming the metal foils into lines.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: June 1, 2010
    Assignee: International Business Machines Corporation
    Inventors: Kohichi Ohsumi, Kenji Terada, Kohichi Yamazaki
  • Publication number: 20100098335
    Abstract: Provided is a smoke detecting apparatus capable of detecting occurrence of smoke at high sensitivity while suppressing an effect of disturbance. The smoke detecting apparatus for detecting occurrence of smoke by subjecting an image captured by a monitoring camera to image processing includes: an image memory (10) for storing a plurality of images captured by the monitoring camera in a time series; and a smoke detection area selecting portion (20) for calculating a luminance histogram of the same pixel for each predetermined pixel a plurality of times in a past predetermined period based on the plurality of images stored in the image memory (10), detecting presence or absence of a luminance value that has been newly generated due to occurrence of one of an intrusive object and smoke based on the luminance histogram, and identifying candidate regions to be subjected to the image processing.
    Type: Application
    Filed: October 14, 2009
    Publication date: April 22, 2010
    Inventors: Takatoshi YAMAGISHI, Kazuhisa NAKANO, Kenji TERADA
  • Patent number: 7641559
    Abstract: A tripod constant velocity universal joint including an outer joint member having axially extending track grooves formed at three circumferentially equispaced positions in the inner periphery. A tripod member having a trunnion barrel adapted to be fitted to a shaft for torque transmission and trunnion journals radially projecting from three circumferentially equispaced positions in the trunnion barrel. Rollers respectively attached to the trunnion journals for rotation through a plurality of needle rollers and received in the track grooves. Each roller is guided at its outer peripheral surface by roller guide surfaces formed in opposite lateral walls of the track groove. A skew angle of the needle rollers is controlled so that it is within a predetermined specified value.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: January 5, 2010
    Assignee: NTN Corporation
    Inventors: Yukihiro Watanabe, Hideki Kondo, Kenji Terada, Hisaaki Kura
  • Publication number: 20080257597
    Abstract: The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.
    Type: Application
    Filed: September 27, 2007
    Publication date: October 23, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kohichi Ohsumi, Kenji Terada, Kohichi Yamazaki
  • Patent number: 7354347
    Abstract: The tripod member has three trunnions which are projected radially. Each of the trunnions carries a roller, and this roller is accommodated in one of the track grooves in the outer joint member. The outer peripheries of the rollers and the roller guideways make angular contact with each other. Support rings are fitted onto the outer peripheries of the trunnions. These support rings and the rollers are assembled (unitized) via a plurality of needle rollers to constitute roller assemblies capable of relative rotations. In longitudinal sections, the outer peripheries of the trunnions have straight shapes parallel to the axes of the trunnions. In cross sections, the outer peripheries are elliptic in shape, with their respective major axes perpendicular to the axis of the joint. The inner peripheries of the support rings have arcuate convex sections.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: April 8, 2008
    Assignee: NTN Corporation
    Inventors: Tatsuro Sugiyama, Tatsuhiro Goto, Kenji Terada, Kenta Yamazaki, Hisaaki Kura
  • Patent number: 7316620
    Abstract: The tripod member has three trunnions which are projected radially. Each of the trunnions carries a roller, and this roller is accommodated in one of the track grooves in the outer joint member. The outer peripheries of the rollers and the roller guideways make angular contact with each other. Support rings are fitted onto the outer peripheries of the trunnions. These support rings and the rollers are assembled (unitized) via a plurality of needle rollers to constitute roller assemblies capable of relative rotations. In longitudinal sections, the outer peripheries of the trunnions have straight shapes parallel to the axes of the trunnions. In cross sections, the outer peripheries are elliptic in shape, with their respective major axes perpendicular to the axis of the joint. The inner peripheries of the support rings have arcuate convex sections.
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: January 8, 2008
    Assignee: NTN Corporation
    Inventors: Tatsuro Sugiyama, Tatsuhiro Goto, Kenji Terada, Kenta Yamazaki, Hisaaki Kura
  • Publication number: 20070279564
    Abstract: The present invention reduces a connection failure between two conductive layers which are connected with each other via a through hole in a display device and reduces a defect of an orientation film formed on a TFT substrate side in a liquid crystal display device. A display device includes a display panel in which a first conductive layer formed on a surface of a substrate, and a second conductive layer which is formed over the first conductive layer as viewed from a surface of the substrate by way of a thin film layer formed of one insulation film or two or more stacked thin films including one insulation film are electrically connected with each other in an opening portion formed in the thin film layer. Out of opening ends of the opening portion of the thin film layer, an outer periphery of the opening end remote from the surface of the substrate changes a distance from the surface of the substrate one time or more during one turn of the outer periphery.
    Type: Application
    Filed: May 23, 2007
    Publication date: December 6, 2007
    Inventors: Hiroaki Iwato, Kotaro Araya, Kenji Terada
  • Publication number: 20070123355
    Abstract: The tripod member has three trunnions which are projected radially. Each of the trunnions carries a roller, and this roller is accommodated in one of the track grooves in the outer joint member. The outer peripheries of the rollers and the roller guideways make angular contact with each other. Support rings are fitted onto the outer peripheries of the trunnions. These support rings and the rollers are assembled (unitized) via a plurality of needle rollers to constitute roller assemblies capable of relative rotations. In longitudinal sections, the outer peripheries of the trunnions have straight shapes parallel to the axes of the trunnions. In cross sections, the outer peripheries are elliptic in shape, with their respective major axes perpendicular to the axis of the joint. The inner peripheries of the support rings have arcuate convex sections.
    Type: Application
    Filed: January 17, 2007
    Publication date: May 31, 2007
    Inventors: Tatsuro Sugiyama, Tatsuhiro Goto, Kenji Terada, Kenta Yamazaki, Hisaaki Kura
  • Patent number: 7201664
    Abstract: A fixed constant velocity joint is provided, which is suitable for an application where a rotational backlash should be avoided. A pressing member is attached to a shaft, and simultaneously a receiving member is attached to a cage. Then, an elastic force of an elastic member elastically bring a pressing part of the pressing member in contact with a receiving part of the receiving member. As a result, an inner race and a cage relatively travel in the axial direction, balls are pushed toward a direction along which wedge-shape ball tracks narrow, and consequently a track clearance in the axial direction decreases.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: April 10, 2007
    Assignee: NTN Corporation
    Inventors: Kenta Yamazaki, Junichi Izumino, Kenji Terada, Hisaaki Kura