Abstract: This rapid-hardening mortar composition includes: a rapid-hardening admixture; cement; and a fine aggregate, wherein the cement is contained in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.

Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.

Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.

Abstract: This rapid-hardening mortar composition includes: a rapid-hardening admixture; cement; and a fine aggregate, wherein the cement is contained in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.

Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.

Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.

Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.

Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.

Abstract: A sound reproducing device having: a sound source data storage unit configured to store reference sound source data for reproducing a reference sound having a prescribed frequency band and comparative sound source data for reproducing comparative sounds having frequency bands different from each other; a reproduction processing unit configured to reproduce the reference sound and the comparative sounds on the basis of the reference sound source data and the comparative sound source data stored in the sound source data storage unit; a comparative sound volume adjustment operation unit configured to receive sound volume adjustment operation for the comparative sounds; and an acoustic characteristic information generation unit configured to simultaneously output the reference sound and a comparative sound of a sound volume in accordance with the received sound volume adjustment operation and record a result of the sound volume adjustment operation in association with the comparative sound related to reproduction

Abstract: A sound reproducing device having: a sound source data storage unit configured to store reference sound source data for reproducing a reference sound having a prescribed frequency band and comparative sound source data for reproducing comparative sounds having frequency bands different from each other; a reproduction processing unit configured to reproduce the reference sound and the comparative sounds on the basis of the reference sound source data and the comparative sound source data stored in the sound source data storage unit; a comparative sound volume adjustment operation unit configured to receive sound volume adjustment operation for the comparative sounds; and an acoustic characteristic information generation unit configured to simultaneously output the reference sound and a comparative sound of a sound volume in accordance with the received sound volume adjustment operation and record a result of the sound volume adjustment operation in association with the comparative sound related to reproduction

Abstract: A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.

Abstract: There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element.

Abstract: There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element.

Abstract: A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.

Abstract: When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.

Abstract: To provide a semiconductor integrated circuit device having improved reliability. An EFEM unit upstream of a plasma processing unit is equipped with a chemical filer for alkali removal. In the plasma processing unit, a semiconductor wafer is subjected to plasma processing with a gas containing fluorine. The resulting semiconductor wafer is put in a carrier via a transfer chamber, load lock chamber and EFEM chamber. During this operation, the concentration of amines in the EFEM chamber is adjusted to be lower than that of amines in a clean room outside the chamber by a chemical filter.

Abstract: When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.

Abstract: When atmosphere inside a wafer carrier is replaced by introducing a gas into the wafer carrier from a gas inlet provided to the wafer carrier that can accommodate wafers. At the same time, the atmosphere inside the wafer carrier is sucked to make an inside pressure negative relative to an outside pressure.

Abstract: When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.