Patents by Inventor Kenji Tokunaga

Kenji Tokunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210357792
    Abstract: In order to assist participants in thinking of an idea by acquiring audio data, it is provided a workshop assistance system, which includes a computer having an arithmetic apparatus configured to execute predetermined processing, a storage device coupled to the arithmetic apparatus, and a communication interface coupled to the arithmetic apparatus, the computer being configured to access solved problem case data including information of solved cases that correspond to problem data, the workshop assistance system comprising: a problem processing module configured to search, by the arithmetic apparatus, solved cases based on problem data that is generated from a discussion among participants; and an idea generation module configured to present, by the arithmetic apparatus, idea data including the generated problem data and information of the solved case found in the search to the participants.
    Type: Application
    Filed: January 31, 2019
    Publication date: November 18, 2021
    Applicant: Hitachi, Ltd.
    Inventors: Shuhei FURUYA, Yo TAKEUCHI, Kiyoshi KUMAGAI, Toshiyuki ONO, Masao ISHIGURO, Tatsuya TOKUNAGA, Chisa NAGAI, Takashi SUMIYOSHI, Naoyuki KANDA, Kenji NAGAMATSU, Kenji OHYA
  • Publication number: 20210300817
    Abstract: To provide a water/oil repellent layer-provided substrate having improved long-term reliability of abrasion resistance, and a method for producing it. A water/oil repellent layer-provided substrate comprising a substrate, an undercoat layer formed on the surface of the substrate, and a water/oil repellent layer formed on the surface of the undercoat layer, in this order, wherein the alkali deficiency index is higher than 0.0, as determined by a depth profile obtained by X-ray photoelectron spectroscopy (XPS) by C60 ion sputtering from the side of the surface of the water/oil repellent layer, taking the total concentration of fluorine, silicon, aluminum, alkali metal elements and oxygen as 100 at %.
    Type: Application
    Filed: June 8, 2021
    Publication date: September 30, 2021
    Applicant: AGC Inc.
    Inventors: Daisuke KOBAYASHI, Maemi IWAHASHI, Aichi INOUE, Yoshihito TOKUNAGA, Kenji ISHIZEKI, Yusuke TOMIYORI
  • Publication number: 20210284867
    Abstract: To provide a water/oil repellent layer-provided substrate having a water/oil repellent layer excellent in abrasion resistance, a deposition material and a method for producing a water/oil repellent layer-provided substrate. The water/oil repellent layer-provided substrate of the present invention is a water/oil repellent layer-provided substrate comprising a substrate, an undercoat layer and a water/oil repellent layer in this order, wherein the water/oil repellent layer comprises a condensate of a fluorinated compound having a reactive silyl group, the undercoat layer contains an oxide containing silicon and an alkaline earth metal element, and the ratio of the molar concentration of the alkaline earth metal element in the undercoat layer to the molar concentration of silicon in the undercoat layer is from 0.005 to 5.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Applicant: AGC INC.
    Inventors: Yoshihito TOKUNAGA, Maemi IWAHASHI, Hirokazu KODAIRA, Kenji ISHIZEKI, Daisuke KOBAYASHI, Yusuke TOMIYORI
  • Patent number: 11117833
    Abstract: This rapid-hardening mortar composition includes: a rapid-hardening admixture; cement; and a fine aggregate, wherein the cement is contained in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 14, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi Kamitani, Daisuke Kimoto, Kenji Tokunaga, Hideo Tawara
  • Patent number: 10829416
    Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 10, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi Kamitani, Kenji Tokunaga, Hideo Tawara
  • Patent number: 10800701
    Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: October 13, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi Kamitani, Keiji Saitou, Kenji Tokunaga, Hideo Tawara
  • Publication number: 20200317576
    Abstract: This rapid-hardening mortar composition includes: a rapid-hardening admixture; cement; and a fine aggregate, wherein the cement is contained in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 8, 2020
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi KAMITANI, Daisuke KIMOTO, Kenji TOKUNAGA, Hideo TAWARA
  • Patent number: 10787389
    Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 29, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi Kamitani, Kenji Tokunaga, Hideo Tawara
  • Patent number: 10759698
    Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 1, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi Kamitani, Keiji Saitou, Kenji Tokunaga, Hideo Tawara
  • Publication number: 20190161409
    Abstract: The present invention provides a rapid-hardening admixture for accelerating hardening of a cement composition and a method for producing the same. The rapid-hardening admixture includes calcium aluminate, inorganic sulfate, and a setting modifier, in which the calcium aluminate has an average particle diameter in a range of 8 ?m to 100 ?m, and the setting modifier has an average particle diameter of 5 ?m or less.
    Type: Application
    Filed: March 31, 2017
    Publication date: May 30, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi KAMITANI, Kenji TOKUNAGA, Hideo TAWARA
  • Publication number: 20190077707
    Abstract: This rapid-hardening cement composition includes: a rapid-hardening admixture; and cement in an amount of 100 parts by mass to 2,000 parts by mass with respect to 100 parts by mass of the rapid-hardening admixture, wherein the rapid-hardening admixture is a composition that contains: calcium aluminate; inorganic sulfate in an amount of 50 parts by mass to 200 parts by mass with respect to 100 parts by mass of the calcium aluminate; and a setting modifier in an amount of 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the calcium aluminate, and an average particle diameter of the calcium aluminate is in a range of 8 ?m to 100 ?m, and an average particle diameter of the setting modifier is in a range of 5 ?m or less.
    Type: Application
    Filed: March 31, 2017
    Publication date: March 14, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyoshi KAMITANI, Keiji SAITOU, Kenji TOKUNAGA, Hideo TAWARA
  • Patent number: 8913760
    Abstract: A sound reproducing device having: a sound source data storage unit configured to store reference sound source data for reproducing a reference sound having a prescribed frequency band and comparative sound source data for reproducing comparative sounds having frequency bands different from each other; a reproduction processing unit configured to reproduce the reference sound and the comparative sounds on the basis of the reference sound source data and the comparative sound source data stored in the sound source data storage unit; a comparative sound volume adjustment operation unit configured to receive sound volume adjustment operation for the comparative sounds; and an acoustic characteristic information generation unit configured to simultaneously output the reference sound and a comparative sound of a sound volume in accordance with the received sound volume adjustment operation and record a result of the sound volume adjustment operation in association with the comparative sound related to reproduction
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: December 16, 2014
    Assignee: JVC Kenwood Corporation
    Inventors: Tetsuo Tagaeto, Hiroyuki Takeishi, Kenji Tokunaga
  • Publication number: 20130279707
    Abstract: A sound reproducing device having: a sound source data storage unit configured to store reference sound source data for reproducing a reference sound having a prescribed frequency band and comparative sound source data for reproducing comparative sounds having frequency bands different from each other; a reproduction processing unit configured to reproduce the reference sound and the comparative sounds on the basis of the reference sound source data and the comparative sound source data stored in the sound source data storage unit; a comparative sound volume adjustment operation unit configured to receive sound volume adjustment operation for the comparative sounds; and an acoustic characteristic information generation unit configured to simultaneously output the reference sound and a comparative sound of a sound volume in accordance with the received sound volume adjustment operation and record a result of the sound volume adjustment operation in association with the comparative sound related to reproduction
    Type: Application
    Filed: June 13, 2013
    Publication date: October 24, 2013
    Inventors: Tetsuo TAGAETO, Hiroyuki TAKEISHI, Kenji TOKUNAGA
  • Publication number: 20100086392
    Abstract: A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.
    Type: Application
    Filed: September 29, 2009
    Publication date: April 8, 2010
    Inventors: Yoshiaki Kobayashi, Shigeru Kobayashi, Kenji Tokunaga, Koji Kato, Teruo Minami
  • Patent number: 7643302
    Abstract: There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: January 5, 2010
    Assignee: Fujitsu Limited
    Inventor: Kenji Tokunaga
  • Publication number: 20080218965
    Abstract: There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element.
    Type: Application
    Filed: May 15, 2008
    Publication date: September 11, 2008
    Applicant: FUJITSU LIMITED
    Inventor: Kenji TOKUNAGA
  • Publication number: 20080107517
    Abstract: A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.
    Type: Application
    Filed: December 20, 2007
    Publication date: May 8, 2008
    Inventors: Yoshiaki KOYAYASHI, Shigen Kobayashi, Kenji Tokunaga, Koji Kato, Teruo Minami
  • Patent number: 7314345
    Abstract: When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: January 1, 2008
    Assignees: Renesas Technology Corp., Hitachi Plant Engineering & Construction Co., Ltd.
    Inventors: Yoshiaki Kobayashi, Shigeru Kobayashi, Kenji Tokunaga, Koji Kato, Teruo Minami
  • Publication number: 20060278612
    Abstract: To provide a semiconductor integrated circuit device having improved reliability. An EFEM unit upstream of a plasma processing unit is equipped with a chemical filer for alkali removal. In the plasma processing unit, a semiconductor wafer is subjected to plasma processing with a gas containing fluorine. The resulting semiconductor wafer is put in a carrier via a transfer chamber, load lock chamber and EFEM chamber. During this operation, the concentration of amines in the EFEM chamber is adjusted to be lower than that of amines in a clean room outside the chamber by a chemical filter.
    Type: Application
    Filed: June 7, 2006
    Publication date: December 14, 2006
    Inventors: Kenji Tokunaga, Kazuhiko Kawai, Sakae Terakado
  • Publication number: 20060182541
    Abstract: When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
    Type: Application
    Filed: March 29, 2006
    Publication date: August 17, 2006
    Inventors: Yoshiaki Kobayashi, Shigeru Kobayashi, Kenji Tokunaga, Koji Kato, Teruo Minami