Abstract: A liquid ejection apparatus includes a first storage portion capable of storing a liquid supplied from a liquid container, a first open-to-atmosphere channel configured to open the inside of the first storage portion to the atmosphere, a second storage portion capable of storing the liquid supplied from the first storage portion, and a second open-to-atmosphere channel configured to open the inside of the second storage portion to the atmosphere. The liquid ejection apparatus is configured to select either a normal mode or a transport mode. The normal mode is a mode in which the power is switched off with the first open-to-atmosphere channel open and the second open-to-atmosphere channel open. The transport mode is a mode in which the power is switched off with the first open-to-atmosphere channel open and the second open-to-atmosphere channel closed.

Abstract: A circuit forming method including a first wiring forming step of forming a first metal wiring on a resin layer, and a second wiring forming step of forming a second metal wiring on the first metal wiring, in which a Young's modulus of the first metal wiring and a Young's modulus of the second metal wiring are different from each other.

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Abstract: A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.

Abstract: A billing method for a liquid jet device includes, counting a consumed amount of liquid by printing, counting the number of printed sheets, counting a consumed amount of liquid for maintenance of a jet head, calculating a maintenance consumption amount per unit number of sheets, from a maintenance consumption amount consumed in current maintenance, and the number of printed sheets for which printing is performed from previous maintenance to the current maintenance, setting, as a liquid consumption amount, a value obtained by adding the maintenance consumption amount per unit number of sheets, to a print consumption amount consumed in printing for the unit number of sheets, and billing for printing for the same number of sheets as the number of printed sheets performed after the current maintenance, in accordance with the liquid consumption amount.

Abstract: In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided.

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.

Abstract: To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

Abstract: In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.

Abstract: A shaping method includes a first ejection step of ejecting a first curable viscous fluid, a planarization step of planarizing the first curable viscous fluid, a first curing step of curing the first curable viscous fluid, a cured layer forming step of repeatedly executing the first ejection step, the planarization step, and the first curing step to form a cured layer, a second ejection step of ejecting a second curable viscous fluid onto a surface of the cured layer, a second curing step of forming a smooth surface on the surface of the cured layer by curing the second curable viscous fluid, a third ejection step of ejecting a fluid containing metal particles onto the smooth surface, and a third curing step of curing the fluid containing the metal particles ejected in the third ejection step to form a metallic conductor on the smooth surface.

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Abstract: A method of controlling a liquid ejecting apparatus includes detecting an ejection failure of nozzles by inspecting an ejection state of the nozzles from which liquid is ejected, covering the nozzles with a cap when the number of the nozzles whose ejection failure is detected is equal to or less than a predetermined number, and discharging the liquid from the nozzles when the number of the nozzles whose ejection failure is detected is greater than the predetermined number.

Abstract: A billing method for a liquid jet device includes, counting a consumed amount of liquid by printing, counting the number of printed sheets, counting a consumed amount of liquid for maintenance of a jet head, calculating a maintenance consumption amount per unit number of sheets, from a maintenance consumption amount consumed in current maintenance, and the number of printed sheets for which printing is performed from previous maintenance to the current maintenance, setting, as a liquid consumption amount, a value obtained by adding the maintenance consumption amount per unit number of sheets, to a print consumption amount consumed in printing for the unit number of sheets, and billing for printing for the same number of sheets as the number of printed sheets performed after the current maintenance, in accordance with the liquid consumption amount.

Abstract: A liquid ejecting apparatus includes a liquid ejection head that ejects a liquid, a liquid supply flow path including a liquid storage unit that stores the liquid, a supply pump sending the liquid from the liquid storage unit to the liquid ejection head, a coupling flow path coupling a first supply coupling portion and a second supply coupling portion in the liquid supply flow path, a branch flow path coupling a third supply coupling portion provided in the coupling flow path and the liquid storage unit, an opening/closing valve provided in the branch flow path, where the opening/closing valve is configured to open/close the branch flow path, and a controller, wherein the controller fills the coupling flow path and the branch flow path with the liquid with a combination of a drive of the supply pump and an opening/closing operation of the opening/closing valve.

Abstract: A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

Abstract: A liquid ejecting apparatus includes a liquid ejection head that ejects a liquid, a liquid supply flow path including a liquid storage unit that stores the liquid, a supply pump sending the liquid from the liquid storage unit to the liquid ejection head, a coupling flow path coupling a first supply coupling portion and a second supply coupling portion in the liquid supply flow path, a branch flow path coupling a third supply coupling portion provided in the coupling flow path and the liquid storage unit, an opening/closing valve provided in the branch flow path, where the opening/closing valve is configured to open/close the branch flow path, and a controller, wherein the controller fills the coupling flow path and the branch flow path with the liquid with a combination of a drive of the supply pump and an opening/closing operation of the opening/closing valve.

Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.